AU2001259349A1 - Compliant probe apparatus - Google Patents

Compliant probe apparatus

Info

Publication number
AU2001259349A1
AU2001259349A1 AU2001259349A AU5934901A AU2001259349A1 AU 2001259349 A1 AU2001259349 A1 AU 2001259349A1 AU 2001259349 A AU2001259349 A AU 2001259349A AU 5934901 A AU5934901 A AU 5934901A AU 2001259349 A1 AU2001259349 A1 AU 2001259349A1
Authority
AU
Australia
Prior art keywords
probe apparatus
compliant probe
compliant
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259349A
Inventor
Thomas Distefano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2001259349A1 publication Critical patent/AU2001259349A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2001259349A 2000-05-02 2001-05-02 Compliant probe apparatus Abandoned AU2001259349A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09564982 2000-05-02
US09/564,982 US6426638B1 (en) 2000-05-02 2000-05-02 Compliant probe apparatus
PCT/US2001/014108 WO2001084166A1 (en) 2000-05-02 2001-05-02 Compliant probe apparatus

Publications (1)

Publication Number Publication Date
AU2001259349A1 true AU2001259349A1 (en) 2001-11-12

Family

ID=24256708

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259349A Abandoned AU2001259349A1 (en) 2000-05-02 2001-05-02 Compliant probe apparatus

Country Status (3)

Country Link
US (4) US6426638B1 (en)
AU (1) AU2001259349A1 (en)
WO (1) WO2001084166A1 (en)

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US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6562636B1 (en) * 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
JP2002296297A (en) * 2001-03-29 2002-10-09 Isao Kimoto Contact assembly
US6636063B2 (en) * 2001-10-02 2003-10-21 Texas Instruments Incorporated Probe card with contact apparatus and method of manufacture
DE10150291A1 (en) * 2001-10-15 2003-05-08 Infineon Technologies Ag Probe needle for testing semiconductor chips and process for their manufacture
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AU2002353582A1 (en) * 2002-02-05 2003-09-02 Oug-Ki Lee Method for manufacturing electric contact element for testing electro device and electric contact element thereby
US7265565B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20050189958A1 (en) * 2003-02-04 2005-09-01 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
US6984996B2 (en) * 2003-05-01 2006-01-10 Celerity Research, Inc. Wafer probing that conditions devices for flip-chip bonding
US6900652B2 (en) * 2003-06-13 2005-05-31 Solid State Measurements, Inc. Flexible membrane probe and method of use thereof
JP4465995B2 (en) * 2003-07-02 2010-05-26 株式会社日立製作所 Probe sheet, probe card, semiconductor inspection apparatus, and semiconductor device manufacturing method
US7042080B2 (en) * 2003-07-14 2006-05-09 Micron Technology, Inc. Semiconductor interconnect having compliant conductive contacts
US7619429B2 (en) * 2003-10-20 2009-11-17 Industrial Technology Research Institute Integrated probe module for LCD panel light inspection
US6946726B1 (en) * 2003-11-26 2005-09-20 Actel Corporation Chip carrier substrate with a land grid array and external bond terminals
US7109822B2 (en) * 2004-02-26 2006-09-19 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for rapid prototyping of monolithic microwave integrated circuits
US7282932B2 (en) * 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
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US7845986B2 (en) * 2004-05-06 2010-12-07 Interconnect Portfolio Llc Torsionally-induced contact-force conductors for electrical connector systems
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US20060033515A1 (en) * 2004-08-13 2006-02-16 Tessera, Inc. Test fixture with movable pin contacts
JP2008511007A (en) * 2004-08-26 2008-04-10 エス・ブイ・プローブ・プライベート・リミテッド Cantilever electrical connector with stacked tips
WO2006031280A2 (en) * 2004-09-13 2006-03-23 Microfabrica Inc. Probe arrays and method for making
KR100586675B1 (en) * 2004-09-22 2006-06-12 주식회사 파이컴 Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof
US7462800B2 (en) * 2004-12-03 2008-12-09 Sv Probe Pte Ltd. Method of shaping lithographically-produced probe elements
US7034563B1 (en) * 2005-01-26 2006-04-25 Ahbee 2, L.P., A California Limited Partnership Apparatus for measuring of thin dielectric layer properties on semiconductor wafers with contact self aligning electrodes
KR100711292B1 (en) * 2005-04-14 2007-04-25 한국과학기술원 Probe card and method for manufacturing the same
US7362119B2 (en) * 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7589542B2 (en) * 2007-04-12 2009-09-15 Touchdown Technologies Inc. Hybrid probe for testing semiconductor devices
US7245135B2 (en) * 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7772859B2 (en) * 2005-08-01 2010-08-10 Touchdown Technologies, Inc. Probe for testing semiconductor devices with features that increase stress tolerance
US20070075717A1 (en) * 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
EP1780550A1 (en) * 2005-10-31 2007-05-02 Capres A/S A probe for testing electrical properties of test samples
US7721430B2 (en) * 2006-02-22 2010-05-25 Sv Probe Pte Ltd. Approach for fabricating cantilever probes
US7688085B2 (en) * 2006-06-13 2010-03-30 Formfactor, Inc. Contactor having a global spring structure and methods of making and using the contactor
US7538567B2 (en) * 2006-07-12 2009-05-26 Touchdown Technologies, Inc. Probe card with balanced lateral force
WO2008033428A2 (en) * 2006-09-12 2008-03-20 Innoconnex, Inc. Compliance partitioning in testing of integrated circuits
US7687304B2 (en) * 2006-11-29 2010-03-30 Innovative Micro Technology Current-driven device using NiMn alloy and method of manufacture
US7679383B2 (en) * 2007-02-28 2010-03-16 Sv Probe Pte. Ltd. Cantilever probe card
US8344748B2 (en) * 2007-04-12 2013-01-01 Advantest America, Inc. Probe for testing semiconductor devices
US8206160B2 (en) 2007-05-25 2012-06-26 Georgia Tech Research Corporation Compliant off-chip interconnects for use in electronic packages
US20090009197A1 (en) * 2007-07-02 2009-01-08 Kabushiki Kaisha Nihon Micronics Probe for electrical test
US7761966B2 (en) * 2007-07-16 2010-07-27 Touchdown Technologies, Inc. Method for repairing a microelectromechanical system
US20090064498A1 (en) * 2007-09-12 2009-03-12 Innoconnex, Inc. Membrane spring fabrication process
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
US20090072851A1 (en) * 2007-09-13 2009-03-19 Touchdown Technologies, Inc. Multi-Pivot Probe Card For Testing Semiconductor Devices
GB0722477D0 (en) * 2007-11-15 2007-12-27 Secretary Trade Ind Brit Microprobe
JP5186508B2 (en) * 2007-12-13 2013-04-17 株式会社日本マイクロニクス Electrical connection device and contact for use in the electrical connection device
US7688089B2 (en) * 2008-01-25 2010-03-30 International Business Machines Corporation Compliant membrane thin film interposer probe for intergrated circuit device testing
US8441272B2 (en) * 2008-12-30 2013-05-14 Stmicroelectronics S.R.L. MEMS probe for probe cards for integrated circuits
WO2010096711A2 (en) * 2009-02-19 2010-08-26 Touchdown Technologies, Inc. Probe head for a microelectronic contactor assembly, and methods of making same
JPWO2011024303A1 (en) * 2009-08-31 2013-01-24 株式会社アドバンテスト Probe, probe card and electronic component testing apparatus
US8246387B2 (en) 2010-01-08 2012-08-21 Interconnect Portfolio Llc Connector constructions for electronic applications
MY184982A (en) 2010-08-06 2021-04-30 First Solar Inc In-process electrical connector
TWI534432B (en) 2010-09-07 2016-05-21 瓊斯科技國際公司 Electrically conductive pins for microcircuit tester
US9086433B2 (en) * 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
US9678108B1 (en) * 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
US10062666B2 (en) 2015-10-30 2018-08-28 Advanced Research Corporation Catch flexure systems, devices and methods
US11156640B2 (en) * 2017-10-31 2021-10-26 Formfactor, Inc. MEMS probe card assembly having decoupled electrical and mechanical probe connections
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11293947B2 (en) 2019-04-26 2022-04-05 Formfactor, Inc. Probe on carrier architecture for vertical probe arrays
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
CN114188310B (en) * 2021-11-29 2023-10-24 强一半导体(苏州)股份有限公司 Method for realizing measurement slip of film probe

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Also Published As

Publication number Publication date
US20040246010A1 (en) 2004-12-09
US6771084B2 (en) 2004-08-03
US20020180473A1 (en) 2002-12-05
US6426638B1 (en) 2002-07-30
US6617865B2 (en) 2003-09-09
US20020153912A1 (en) 2002-10-24
WO2001084166A1 (en) 2001-11-08

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