AU2001257488A1 - A novel capacitively coupled dtmos on soi - Google Patents

A novel capacitively coupled dtmos on soi

Info

Publication number
AU2001257488A1
AU2001257488A1 AU2001257488A AU5748801A AU2001257488A1 AU 2001257488 A1 AU2001257488 A1 AU 2001257488A1 AU 2001257488 A AU2001257488 A AU 2001257488A AU 5748801 A AU5748801 A AU 5748801A AU 2001257488 A1 AU2001257488 A1 AU 2001257488A1
Authority
AU
Australia
Prior art keywords
dtmos
soi
novel
capacitively coupled
capacitively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001257488A
Inventor
John C. Holst
Srinath Krishnan
Bin Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001257488A1 publication Critical patent/AU2001257488A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7841Field effect transistors with field effect produced by an insulated gate with floating body, e.g. programmable transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78612Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
AU2001257488A 2000-06-28 2001-05-01 A novel capacitively coupled dtmos on soi Abandoned AU2001257488A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/605,920 US6420767B1 (en) 2000-06-28 2000-06-28 Capacitively coupled DTMOS on SOI
US09605920 2000-06-28
PCT/US2001/014127 WO2002003468A2 (en) 2000-06-28 2001-05-01 A novel capacitively coupled dtmos on soi

Publications (1)

Publication Number Publication Date
AU2001257488A1 true AU2001257488A1 (en) 2002-01-14

Family

ID=24425756

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001257488A Abandoned AU2001257488A1 (en) 2000-06-28 2001-05-01 A novel capacitively coupled dtmos on soi

Country Status (5)

Country Link
US (1) US6420767B1 (en)
EP (1) EP1307922A2 (en)
AU (1) AU2001257488A1 (en)
TW (1) TW503578B (en)
WO (1) WO2002003468A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599789B1 (en) * 2000-11-15 2003-07-29 Micron Technology, Inc. Method of forming a field effect transistor
US6709913B2 (en) * 2001-09-04 2004-03-23 Sharp Laboratories Of America, Inc. Method for adjusting ultra-thin SOI MOS transistor threshold voltages
JP2003332582A (en) * 2002-05-13 2003-11-21 Toshiba Corp Semiconductor device and its manufacturing method
US7071043B2 (en) * 2002-08-15 2006-07-04 Micron Technology, Inc. Methods of forming a field effect transistor having source/drain material over insulative material
JP2004319853A (en) * 2003-04-17 2004-11-11 Oki Electric Ind Co Ltd Semiconductor device and its manufacturing method
DE10343132B4 (en) * 2003-09-18 2009-07-09 X-Fab Semiconductor Foundries Ag Isolated MOS transistors with extended drain region for increased voltages
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
TWM514577U (en) 2015-07-23 2015-12-21 胡聯雄 Refractive lens and sheet-like structure having refractive lens

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5439839A (en) * 1994-07-13 1995-08-08 Winbond Electronics Corporation Self-aligned source/drain MOS process
JP2715929B2 (en) * 1994-08-18 1998-02-18 日本電気株式会社 Semiconductor integrated circuit device
US5559368A (en) * 1994-08-30 1996-09-24 The Regents Of The University Of California Dynamic threshold voltage mosfet having gate to body connection for ultra-low voltage operation
JP3634086B2 (en) 1996-08-13 2005-03-30 株式会社半導体エネルギー研究所 Method for manufacturing insulated gate type semiconductor device
JPH10284729A (en) 1997-02-07 1998-10-23 Sony Corp Insulated gate transistor element and drive method thereof
JPH10270687A (en) 1997-03-27 1998-10-09 Mitsubishi Electric Corp Field-effect transistor and manufacture thereof
US5889293A (en) 1997-04-04 1999-03-30 International Business Machines Corporation Electrical contact to buried SOI structures
US5920093A (en) 1997-04-07 1999-07-06 Motorola, Inc. SOI FET having gate sub-regions conforming to t-shape
JP3859821B2 (en) 1997-07-04 2006-12-20 株式会社半導体エネルギー研究所 Semiconductor device
TW332316B (en) * 1997-07-22 1998-05-21 Holtek Microelectronics Inc Manufacturing method of MOS transistor with adjustable source/drain extension area
JP3164047B2 (en) * 1997-11-28 2001-05-08 日本ビクター株式会社 Semiconductor device
US6020222A (en) 1997-12-16 2000-02-01 Advanced Micro Devices, Inc. Silicon oxide insulator (SOI) semiconductor having selectively linked body
US5856226A (en) * 1997-12-19 1999-01-05 Texas Instruments-Acer Incorporated Method of making ultra-short channel MOSFET with self-aligned silicided contact and extended S/D junction
US6238982B1 (en) * 1999-04-13 2001-05-29 Advanced Micro Devices Multiple threshold voltage semiconductor device fabrication technology
US6319783B1 (en) * 1999-11-19 2001-11-20 Chartered Semiconductor Manufatcuring Ltd. Process to fabricate a novel source-drain extension

Also Published As

Publication number Publication date
WO2002003468A2 (en) 2002-01-10
TW503578B (en) 2002-09-21
US6420767B1 (en) 2002-07-16
WO2002003468A3 (en) 2002-04-11
EP1307922A2 (en) 2003-05-07

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