AU2001248338A1 - Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements - Google Patents

Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements

Info

Publication number
AU2001248338A1
AU2001248338A1 AU2001248338A AU4833801A AU2001248338A1 AU 2001248338 A1 AU2001248338 A1 AU 2001248338A1 AU 2001248338 A AU2001248338 A AU 2001248338A AU 4833801 A AU4833801 A AU 4833801A AU 2001248338 A1 AU2001248338 A1 AU 2001248338A1
Authority
AU
Australia
Prior art keywords
chip
producing
large number
contact elements
carrier strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001248338A
Inventor
Andreas Plettner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7636171&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001248338(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of AU2001248338A1 publication Critical patent/AU2001248338A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
AU2001248338A 2000-03-24 2001-03-07 Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements Abandoned AU2001248338A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10014620A DE10014620A1 (en) 2000-03-24 2000-03-24 Electronic chip carrier band manufacturing method has contact elements for applied chips provided by metallized plastics foil or metal foil
DE10014620 2000-03-24
PCT/EP2001/002572 WO2001073686A1 (en) 2000-03-24 2001-03-07 Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements

Publications (1)

Publication Number Publication Date
AU2001248338A1 true AU2001248338A1 (en) 2001-10-08

Family

ID=7636171

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001248338A Abandoned AU2001248338A1 (en) 2000-03-24 2001-03-07 Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements

Country Status (5)

Country Link
US (1) US20030140487A1 (en)
EP (1) EP1269410B1 (en)
AU (1) AU2001248338A1 (en)
DE (2) DE10014620A1 (en)
WO (1) WO2001073686A1 (en)

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* Cited by examiner, † Cited by third party
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DE10120269C1 (en) * 2001-04-25 2002-07-25 Muehlbauer Ag Microchip transponder manufacturing method has chip module carrier band combined with antenna carrier band with chip module terminals coupled to antenna
WO2003071476A1 (en) * 2002-02-19 2003-08-28 Koninklijke Philips Electronics N.V. Method of manufacturing a transponder
US7147739B2 (en) * 2002-12-20 2006-12-12 Cree Inc. Systems for assembling components on submounts and methods therefor
WO2004107262A1 (en) * 2003-05-28 2004-12-09 Hitachi, Ltd. Radio recognition semiconductor device and its manufacturing method
US20060261957A1 (en) * 2003-08-26 2006-11-23 Ralf God Method for producing bridge modules
DE10358422B3 (en) * 2003-08-26 2005-04-28 Muehlbauer Ag Method for producing module bridges
US20060289979A1 (en) * 2003-08-26 2006-12-28 God Ralf Bridge modules for smart labels
FR2861483B1 (en) * 2003-10-28 2006-01-27 Gemplus Card Int METHOD FOR MANUFACTURING AN ELECTRONIC KEY WITH A USB CONNECTOR AND ELECTRONIC KEY OBTAINED
DE102004006457A1 (en) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Method and device for the continuous production of electronic film components
DE102005023088B3 (en) * 2005-05-13 2006-06-22 Grammer Ag Suspension for e.g. tractor seat, has controller, where removal and discharging of additional volumes is switched on or deactivated by controller so that distribution of force path spring characteristic line has no or small gradient
US8864145B2 (en) * 2005-05-13 2014-10-21 Grammer Ag Device and method for suspension of a vehicle seat by means of additional volumes
US8840172B2 (en) * 2005-05-13 2014-09-23 Grammer Ag Device and method for suspension of a vehicle cabin by means of additional volumes
DE102006059745A1 (en) * 2006-12-18 2008-06-19 Grammer Ag Air spring for a vehicle seat and vehicle seat with such an air spring
DE102007032897B4 (en) * 2007-07-14 2014-05-28 Grammer Aktiengesellschaft Vehicle seat with a base frame and with respect to this base frame realtivbeweglichen seat frame
DE102007048194B4 (en) * 2007-10-08 2014-05-15 Grammer Aktiengesellschaft Vehicle with sprung vehicle seat and suspension vehicle cab and suspension method
DE102007056700B4 (en) * 2007-11-24 2012-03-29 Grammer Aktiengesellschaft Device with a suspension system and method for adjusting a suspension system
DE102008058409B4 (en) * 2007-12-04 2020-01-23 Grammer Aktiengesellschaft Device and method for active suspension of a vehicle part
DE102008022045B3 (en) * 2008-05-03 2009-07-30 Grammer Ag Vehicle seat has device for controlling pneumatically controlled suspension system, by which vehicle seat is supported against vehicle body part
DE102008052960B4 (en) * 2008-10-23 2014-02-13 Grammer Aktiengesellschaft Suspension vibration system for vibration reduction
DE102008056200B4 (en) * 2008-11-06 2014-04-03 Grammer Aktiengesellschaft Shearing rack for a vehicle seat, vehicle seat, in particular motor vehicle seat, and method for producing a substructure of a vehicle seat
DE102009005381B4 (en) * 2009-01-21 2013-05-08 Grammer Aktiengesellschaft Device for springing a mass and method for adjusting and / or operating a fluid spring

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US4209355A (en) * 1978-07-26 1980-06-24 National Semiconductor Corporation Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
US4283839A (en) * 1978-07-26 1981-08-18 Western Electric Co., Inc. Method of bonding semiconductor devices to carrier tapes
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
US4413308A (en) * 1981-08-31 1983-11-01 Bell Telephone Laboratories, Incorporated Printed wiring board construction
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
FR2622353B1 (en) * 1987-10-22 1990-03-23 Bendix Electronics Sa TAPE PRODUCT FOR SUPPORTING AND CONVEYING ELECTRONIC COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
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JPH04273451A (en) * 1991-02-28 1992-09-29 Nippon Steel Corp Semiconductor device
DE4431605C2 (en) * 1994-09-05 1998-06-04 Siemens Ag Method for producing a chip card module for contactless chip cards
DE4431754C1 (en) * 1994-09-06 1995-11-23 Siemens Ag Carrier element for ic module of chip card
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Also Published As

Publication number Publication date
DE50101037D1 (en) 2004-01-08
WO2001073686A1 (en) 2001-10-04
DE10014620A1 (en) 2001-09-27
US20030140487A1 (en) 2003-07-31
EP1269410A1 (en) 2003-01-02
EP1269410B1 (en) 2003-11-26

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