AU2001248338A1 - Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements - Google Patents
Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elementsInfo
- Publication number
- AU2001248338A1 AU2001248338A1 AU2001248338A AU4833801A AU2001248338A1 AU 2001248338 A1 AU2001248338 A1 AU 2001248338A1 AU 2001248338 A AU2001248338 A AU 2001248338A AU 4833801 A AU4833801 A AU 4833801A AU 2001248338 A1 AU2001248338 A1 AU 2001248338A1
- Authority
- AU
- Australia
- Prior art keywords
- chip
- producing
- large number
- contact elements
- carrier strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10014620 | 2000-03-24 | ||
DE10014620A DE10014620A1 (en) | 2000-03-24 | 2000-03-24 | Electronic chip carrier band manufacturing method has contact elements for applied chips provided by metallized plastics foil or metal foil |
PCT/EP2001/002572 WO2001073686A1 (en) | 2000-03-24 | 2001-03-07 | Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001248338A1 true AU2001248338A1 (en) | 2001-10-08 |
Family
ID=7636171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001248338A Abandoned AU2001248338A1 (en) | 2000-03-24 | 2001-03-07 | Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements |
Country Status (5)
Country | Link |
---|---|
US (1) | US20030140487A1 (en) |
EP (1) | EP1269410B1 (en) |
AU (1) | AU2001248338A1 (en) |
DE (2) | DE10014620A1 (en) |
WO (1) | WO2001073686A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10120269C1 (en) * | 2001-04-25 | 2002-07-25 | Muehlbauer Ag | Microchip transponder manufacturing method has chip module carrier band combined with antenna carrier band with chip module terminals coupled to antenna |
US7521271B2 (en) * | 2002-02-19 | 2009-04-21 | Nxp B.V. | Method of manufacturing a transponder |
US7147739B2 (en) * | 2002-12-20 | 2006-12-12 | Cree Inc. | Systems for assembling components on submounts and methods therefor |
JPWO2004107262A1 (en) * | 2003-05-28 | 2006-07-20 | 株式会社日立製作所 | Wireless recognition semiconductor device and manufacturing method thereof |
EP1658582A1 (en) * | 2003-08-26 | 2006-05-24 | Mühlbauer AG | Method for producing bridge modules |
JP2007503634A (en) * | 2003-08-26 | 2007-02-22 | ミュールバウアー アーゲー | Module bridge for smart labels |
DE10358423B4 (en) * | 2003-08-26 | 2006-09-21 | Mühlbauer Ag | Module bridges for smart labels |
FR2861483B1 (en) * | 2003-10-28 | 2006-01-27 | Gemplus Card Int | METHOD FOR MANUFACTURING AN ELECTRONIC KEY WITH A USB CONNECTOR AND ELECTRONIC KEY OBTAINED |
DE102004006457A1 (en) * | 2004-02-04 | 2005-08-25 | Bielomatik Leuze Gmbh + Co Kg | Method and device for the continuous production of electronic film components |
DE102005023088B3 (en) * | 2005-05-13 | 2006-06-22 | Grammer Ag | Suspension for e.g. tractor seat, has controller, where removal and discharging of additional volumes is switched on or deactivated by controller so that distribution of force path spring characteristic line has no or small gradient |
US8840172B2 (en) * | 2005-05-13 | 2014-09-23 | Grammer Ag | Device and method for suspension of a vehicle cabin by means of additional volumes |
US8864145B2 (en) * | 2005-05-13 | 2014-10-21 | Grammer Ag | Device and method for suspension of a vehicle seat by means of additional volumes |
DE102006059745A1 (en) * | 2006-12-18 | 2008-06-19 | Grammer Ag | Air spring for a vehicle seat and vehicle seat with such an air spring |
DE102007032897B4 (en) * | 2007-07-14 | 2014-05-28 | Grammer Aktiengesellschaft | Vehicle seat with a base frame and with respect to this base frame realtivbeweglichen seat frame |
DE102007048194B4 (en) * | 2007-10-08 | 2014-05-15 | Grammer Aktiengesellschaft | Vehicle with sprung vehicle seat and suspension vehicle cab and suspension method |
DE102007056700B4 (en) * | 2007-11-24 | 2012-03-29 | Grammer Aktiengesellschaft | Device with a suspension system and method for adjusting a suspension system |
DE102008058409B4 (en) * | 2007-12-04 | 2020-01-23 | Grammer Aktiengesellschaft | Device and method for active suspension of a vehicle part |
DE102008022045B3 (en) * | 2008-05-03 | 2009-07-30 | Grammer Ag | Vehicle seat has device for controlling pneumatically controlled suspension system, by which vehicle seat is supported against vehicle body part |
DE102008052960B4 (en) * | 2008-10-23 | 2014-02-13 | Grammer Aktiengesellschaft | Suspension vibration system for vibration reduction |
DE102008056200B4 (en) * | 2008-11-06 | 2014-04-03 | Grammer Aktiengesellschaft | Shearing rack for a vehicle seat, vehicle seat, in particular motor vehicle seat, and method for producing a substructure of a vehicle seat |
DE102009005381B4 (en) * | 2009-01-21 | 2013-05-08 | Grammer Aktiengesellschaft | Device for springing a mass and method for adjusting and / or operating a fluid spring |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4048438A (en) * | 1974-10-23 | 1977-09-13 | Amp Incorporated | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips |
US4209355A (en) * | 1978-07-26 | 1980-06-24 | National Semiconductor Corporation | Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices |
US4283839A (en) * | 1978-07-26 | 1981-08-18 | Western Electric Co., Inc. | Method of bonding semiconductor devices to carrier tapes |
US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
US4413308A (en) * | 1981-08-31 | 1983-11-01 | Bell Telephone Laboratories, Incorporated | Printed wiring board construction |
US4721992A (en) * | 1986-06-26 | 1988-01-26 | National Semiconductor Corporation | Hinge tape |
FR2622353B1 (en) * | 1987-10-22 | 1990-03-23 | Bendix Electronics Sa | TAPE PRODUCT FOR SUPPORTING AND CONVEYING ELECTRONIC COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
JP2751450B2 (en) * | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | Mounting structure of tape carrier and mounting method |
JPH04273451A (en) * | 1991-02-28 | 1992-09-29 | Nippon Steel Corp | Semiconductor device |
DE4431605C2 (en) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Method for producing a chip card module for contactless chip cards |
DE4431754C1 (en) * | 1994-09-06 | 1995-11-23 | Siemens Ag | Carrier element for ic module of chip card |
DE4437721A1 (en) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Contactless electronic module |
DE19651566B4 (en) * | 1996-12-11 | 2006-09-07 | Assa Abloy Identification Technology Group Ab | Chip module and method for its production and a chip card |
DE19701167A1 (en) * | 1997-01-15 | 1998-07-23 | Siemens Ag | Smart card |
FR2761527B1 (en) * | 1997-03-25 | 1999-06-04 | Gemplus Card Int | METHOD OF MANUFACTURING CONTACTLESS CARD WITH ANTENNA CONNECTION BY WELDED WIRES |
DE19716342C2 (en) * | 1997-04-18 | 1999-02-25 | Pav Card Gmbh | Process for the production of a chip card |
DE19846237A1 (en) * | 1998-10-07 | 2000-04-13 | Fraunhofer Ges Forschung | Process for the production of a microtransponder |
-
2000
- 2000-03-24 DE DE10014620A patent/DE10014620A1/en not_active Withdrawn
-
2001
- 2001-03-07 DE DE50101037T patent/DE50101037D1/en not_active Expired - Lifetime
- 2001-03-07 US US10/312,527 patent/US20030140487A1/en not_active Abandoned
- 2001-03-07 EP EP01921320A patent/EP1269410B1/en not_active Expired - Lifetime
- 2001-03-07 WO PCT/EP2001/002572 patent/WO2001073686A1/en active IP Right Grant
- 2001-03-07 AU AU2001248338A patent/AU2001248338A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1269410A1 (en) | 2003-01-02 |
US20030140487A1 (en) | 2003-07-31 |
DE10014620A1 (en) | 2001-09-27 |
WO2001073686A1 (en) | 2001-10-04 |
DE50101037D1 (en) | 2004-01-08 |
EP1269410B1 (en) | 2003-11-26 |
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