AU2001246670A1 - Method and device for making substrates - Google Patents
Method and device for making substratesInfo
- Publication number
- AU2001246670A1 AU2001246670A1 AU2001246670A AU4667001A AU2001246670A1 AU 2001246670 A1 AU2001246670 A1 AU 2001246670A1 AU 2001246670 A AU2001246670 A AU 2001246670A AU 4667001 A AU4667001 A AU 4667001A AU 2001246670 A1 AU2001246670 A1 AU 2001246670A1
- Authority
- AU
- Australia
- Prior art keywords
- depth
- ingot
- cylindrical
- implantation
- making substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/20—Doping by irradiation with electromagnetic waves or by particle radiation
- C30B31/22—Doping by irradiation with electromagnetic waves or by particle radiation by ion-implantation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Abstract
The invention concerns a method for making substrates, in particular for optics, electronics or optoelectronics. The method includes an operation which consists in implanting (100) atomic species beneath the surface of a material in the form of a cylindrical ingot (1), at a depth of implantation distributed about a certain value by bombardment of the atomic species on a zone of the ingot (1) cylindrical surface, and an operation which consists in removing (300), at a separation depth located proximate to the depth of implantation, the layer (2) of material located between the surface and the separation depth, to remove the layer (2) from the rest of the cylindrical ingot (1).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0004210A FR2807074B1 (en) | 2000-04-03 | 2000-04-03 | METHOD AND DEVICE FOR MANUFACTURING SUBSTRATES |
FR0004210 | 2000-04-03 | ||
PCT/FR2001/000976 WO2001075196A1 (en) | 2000-04-03 | 2001-04-02 | Method and device for making substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001246670A1 true AU2001246670A1 (en) | 2001-10-15 |
Family
ID=8848788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001246670A Abandoned AU2001246670A1 (en) | 2000-04-03 | 2001-04-02 | Method and device for making substrates |
Country Status (11)
Country | Link |
---|---|
US (1) | US6855619B2 (en) |
EP (1) | EP1268884B1 (en) |
JP (1) | JP4597462B2 (en) |
KR (1) | KR100749597B1 (en) |
AT (1) | ATE437980T1 (en) |
AU (1) | AU2001246670A1 (en) |
DE (1) | DE60139385D1 (en) |
FR (1) | FR2807074B1 (en) |
MY (1) | MY128008A (en) |
TW (1) | TWI286166B (en) |
WO (1) | WO2001075196A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070122997A1 (en) | 1998-02-19 | 2007-05-31 | Silicon Genesis Corporation | Controlled process and resulting device |
US6146979A (en) | 1997-05-12 | 2000-11-14 | Silicon Genesis Corporation | Pressurized microbubble thin film separation process using a reusable substrate |
FR2842650B1 (en) * | 2002-07-17 | 2005-09-02 | Soitec Silicon On Insulator | PROCESS FOR PRODUCING SUBSTRATES, IN PARTICULAR FOR OPTICS, ELECTRONICS OR OPTO-ELECTRONICS |
TWI273659B (en) * | 2002-07-17 | 2007-02-11 | Soitec Silicon On Insulator | Method of fabricating substrates, in particular for optics, electronics or optoelectronics |
US7538010B2 (en) | 2003-07-24 | 2009-05-26 | S.O.I.Tec Silicon On Insulator Technologies | Method of fabricating an epitaxially grown layer |
FR2857983B1 (en) * | 2003-07-24 | 2005-09-02 | Soitec Silicon On Insulator | PROCESS FOR PRODUCING AN EPITAXIC LAYER |
FR2857982B1 (en) * | 2003-07-24 | 2007-05-18 | Soitec Silicon On Insulator | PROCESS FOR PRODUCING AN EPITAXIC LAYER |
US7811900B2 (en) | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process |
US9362439B2 (en) | 2008-05-07 | 2016-06-07 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
US8993410B2 (en) | 2006-09-08 | 2015-03-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
US8293619B2 (en) | 2008-08-28 | 2012-10-23 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled propagation |
FR2906077B1 (en) * | 2006-09-18 | 2009-03-06 | Michel Roche | METHOD AND APPARATUS FOR THE MANUFACTURE OF THIN POLY OR MONOCRYSTALLINE SEMICONDUCTOR SUBSTRATES |
US8124499B2 (en) * | 2006-11-06 | 2012-02-28 | Silicon Genesis Corporation | Method and structure for thick layer transfer using a linear accelerator |
US20080128641A1 (en) * | 2006-11-08 | 2008-06-05 | Silicon Genesis Corporation | Apparatus and method for introducing particles using a radio frequency quadrupole linear accelerator for semiconductor materials |
US20080188011A1 (en) * | 2007-01-26 | 2008-08-07 | Silicon Genesis Corporation | Apparatus and method of temperature conrol during cleaving processes of thick film materials |
DE102007018080B3 (en) * | 2007-04-17 | 2008-06-19 | Eisele, Christopher, Dr. | Manufacture of thin wafers, sheet or films from semiconductor body, cuts using laser and optional etchant, whilst spreading separated sheet away from body |
WO2009057667A1 (en) * | 2007-10-29 | 2009-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Formation method of single crystal semiconductor layer, formation method of crystalline semiconductor layer, formation method of polycrystalline layer, and method for manufacturing semiconductor device |
WO2009092926A1 (en) * | 2008-01-21 | 2009-07-30 | Michel Roche | Method and related equipment for making thin poly- or mono-crystalline semiconductor substrates |
US8330126B2 (en) | 2008-08-25 | 2012-12-11 | Silicon Genesis Corporation | Race track configuration and method for wafering silicon solar substrates |
US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
US8329557B2 (en) | 2009-05-13 | 2012-12-11 | Silicon Genesis Corporation | Techniques for forming thin films by implantation with reduced channeling |
US9196503B2 (en) * | 2012-08-23 | 2015-11-24 | Michael Xiaoxuan Yang | Methods for fabricating devices on semiconductor substrates |
CA2939214A1 (en) * | 2014-02-18 | 2015-08-27 | Rayton Solar Inc. | Float zone silicon wafer manufacturing system and related process |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2427645A1 (en) * | 1974-06-07 | 1976-01-02 | Siemens Ag | Doping semiconductor crystal rod - by forming doped layer by nuclear reaction before zone melting, giving reproducible results |
FR2752768B1 (en) * | 1996-08-27 | 2003-04-11 | Commissariat Energie Atomique | PROCESS FOR OBTAINING A WAFER OF LARGE-SIZE SEMICONDUCTOR MATERIAL AND USE OF THE WAFER OBTAINED FOR MAKING SEMICONDUCTOR-TYPE SUBSTRATES ON INSULATION |
JPH1093122A (en) * | 1996-09-10 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | Method of manufacturing thin-film solar cell |
FR2756847B1 (en) * | 1996-12-09 | 1999-01-08 | Commissariat Energie Atomique | METHOD FOR SEPARATING AT LEAST TWO ELEMENTS OF A STRUCTURE IN CONTACT WITH THEM BY ION IMPLANTATION |
US5877070A (en) * | 1997-05-31 | 1999-03-02 | Max-Planck Society | Method for the transfer of thin layers of monocrystalline material to a desirable substrate |
US6150239A (en) * | 1997-05-31 | 2000-11-21 | Max Planck Society | Method for the transfer of thin layers monocrystalline material onto a desirable substrate |
US5899939A (en) * | 1998-01-21 | 1999-05-04 | Osteotech, Inc. | Bone-derived implant for load-supporting applications |
FR2774510B1 (en) * | 1998-02-02 | 2001-10-26 | Soitec Silicon On Insulator | PROCESS FOR TREATING SUBSTRATES, ESPECIALLY SEMICONDUCTORS |
US6503321B2 (en) * | 1998-02-17 | 2003-01-07 | The Trustees Of Columbia University In The City Of New York | Slicing of single-crystal films using ion implantation |
US6120597A (en) * | 1998-02-17 | 2000-09-19 | The Trustees Of Columbia University In The City Of New York | Crystal ion-slicing of single-crystal films |
-
2000
- 2000-04-03 FR FR0004210A patent/FR2807074B1/en not_active Expired - Lifetime
-
2001
- 2001-04-02 MY MYPI20011556A patent/MY128008A/en unknown
- 2001-04-02 KR KR1020027013219A patent/KR100749597B1/en active IP Right Grant
- 2001-04-02 EP EP01919609A patent/EP1268884B1/en not_active Expired - Lifetime
- 2001-04-02 AU AU2001246670A patent/AU2001246670A1/en not_active Abandoned
- 2001-04-02 WO PCT/FR2001/000976 patent/WO2001075196A1/en active Application Filing
- 2001-04-02 DE DE60139385T patent/DE60139385D1/en not_active Expired - Lifetime
- 2001-04-02 JP JP2001573066A patent/JP4597462B2/en not_active Expired - Lifetime
- 2001-04-02 US US10/239,869 patent/US6855619B2/en not_active Expired - Lifetime
- 2001-04-02 AT AT01919609T patent/ATE437980T1/en not_active IP Right Cessation
- 2001-04-03 TW TW090107909A patent/TWI286166B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FR2807074A1 (en) | 2001-10-05 |
TWI286166B (en) | 2007-09-01 |
DE60139385D1 (en) | 2009-09-10 |
EP1268884B1 (en) | 2009-07-29 |
JP4597462B2 (en) | 2010-12-15 |
JP2003529526A (en) | 2003-10-07 |
KR20030001401A (en) | 2003-01-06 |
WO2001075196A1 (en) | 2001-10-11 |
ATE437980T1 (en) | 2009-08-15 |
EP1268884A1 (en) | 2003-01-02 |
FR2807074B1 (en) | 2002-12-06 |
MY128008A (en) | 2007-01-31 |
US20030186493A1 (en) | 2003-10-02 |
US6855619B2 (en) | 2005-02-15 |
KR100749597B1 (en) | 2007-08-14 |
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