AU2001245743A1 - Removal of "copper kiss" from pickling high copper alloys - Google Patents
Removal of "copper kiss" from pickling high copper alloysInfo
- Publication number
- AU2001245743A1 AU2001245743A1 AU2001245743A AU4574301A AU2001245743A1 AU 2001245743 A1 AU2001245743 A1 AU 2001245743A1 AU 2001245743 A AU2001245743 A AU 2001245743A AU 4574301 A AU4574301 A AU 4574301A AU 2001245743 A1 AU2001245743 A1 AU 2001245743A1
- Authority
- AU
- Australia
- Prior art keywords
- copper
- kiss
- removal
- alloys
- pickling high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002300492A CA2300492A1 (en) | 2000-03-13 | 2000-03-13 | Removal of "copper kiss" from pickling high copper alloys |
US09526219 | 2000-03-15 | ||
US09/526,219 US6540931B1 (en) | 2000-03-13 | 2000-03-15 | Removal of copper kiss from pickling high copper alloys |
PCT/US2001/008262 WO2001068930A2 (en) | 2000-03-13 | 2001-03-15 | Removal of 'copper kiss' from pickling high copper alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001245743A1 true AU2001245743A1 (en) | 2001-09-24 |
Family
ID=25681609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001245743A Abandoned AU2001245743A1 (en) | 2000-03-13 | 2001-03-15 | Removal of "copper kiss" from pickling high copper alloys |
Country Status (5)
Country | Link |
---|---|
US (1) | US6540931B1 (en) |
JP (1) | JP2001262380A (en) |
AU (1) | AU2001245743A1 (en) |
CA (1) | CA2300492A1 (en) |
WO (1) | WO2001068930A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100379824B1 (en) | 2000-12-20 | 2003-04-11 | 엘지.필립스 엘시디 주식회사 | Etchant and array substrate for electric device with Cu lines patterend on the array substrate using the etchant |
GB2386865B (en) * | 2000-12-20 | 2004-09-15 | Lg Philips Lcd Co Ltd | Etchant and array substrate having copper lines etched by the etchant |
DE60215629T2 (en) * | 2001-04-09 | 2007-09-06 | AK Steel Properties, Inc., Middletown | PROCESS FOR STAINLESS STEEL STAIN USING HYDROGEN PEROXIDE |
KR100627561B1 (en) | 2004-12-29 | 2006-09-21 | 동부일렉트로닉스 주식회사 | Method for reusing the test and dummy wafer |
CN1986892B (en) * | 2005-12-22 | 2010-04-14 | 佛山市顺德区汉达精密电子科技有限公司 | Treating process of removing vacuum coating |
MX2014001573A (en) * | 2011-08-10 | 2014-10-17 | ProASSORT GmbH | Metal scrap sorting. |
CN104005036B (en) * | 2013-02-27 | 2016-08-17 | 比亚迪股份有限公司 | A kind of copper powder washing liquid, the method removing copper containing layer body surface copper powder and preparation method of wiring board removing copper powder |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58197277A (en) * | 1982-05-08 | 1983-11-16 | Mitsubishi Gas Chem Co Inc | Treating liquid for dissolving metal chemically |
GB8922504D0 (en) * | 1989-10-05 | 1989-11-22 | Interox Chemicals Ltd | Hydrogen peroxide solutions |
FR2688787B1 (en) * | 1992-03-23 | 1994-05-13 | Elf Atochem Sa | PROCESS FOR THE OXIDATION OF CATIONIC STARCHES AND CARBOXYLIC AND CATIONIC AMPHOTERIC STARCHES THUS OBTAINED. |
IT1255655B (en) | 1992-08-06 | 1995-11-09 | STAINLESS STEEL PICKLING AND PASSIVATION PROCESS WITHOUT THE USE OF NITRIC ACID | |
IT1255855B (en) | 1992-10-12 | 1995-11-17 | Cesare Pedrazzini | PICKLING AND PASSIVATION PROCESS FOR TITANIUM SHEETS IN TAPE, WITHOUT THE USE OF NITRIC ACID. |
IT1276954B1 (en) | 1995-10-18 | 1997-11-03 | Novamax Itb S R L | PICKLING AND PASSIVATION PROCESS OF STAINLESS STEEL WITHOUT THE USE OF NITRIC ACID |
GB9620877D0 (en) * | 1996-10-07 | 1996-11-27 | Solvay Interox Ltd | Metal surface treatment |
-
2000
- 2000-03-13 CA CA002300492A patent/CA2300492A1/en not_active Abandoned
- 2000-03-15 US US09/526,219 patent/US6540931B1/en not_active Expired - Fee Related
-
2001
- 2001-03-12 JP JP2001069342A patent/JP2001262380A/en active Pending
- 2001-03-15 AU AU2001245743A patent/AU2001245743A1/en not_active Abandoned
- 2001-03-15 WO PCT/US2001/008262 patent/WO2001068930A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CA2300492A1 (en) | 2001-09-13 |
JP2001262380A (en) | 2001-09-26 |
WO2001068930A3 (en) | 2002-03-14 |
US6540931B1 (en) | 2003-04-01 |
WO2001068930A2 (en) | 2001-09-20 |
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