AU2001242405A1 - Device for accommodating electronic components - Google Patents
Device for accommodating electronic componentsInfo
- Publication number
- AU2001242405A1 AU2001242405A1 AU2001242405A AU4240501A AU2001242405A1 AU 2001242405 A1 AU2001242405 A1 AU 2001242405A1 AU 2001242405 A AU2001242405 A AU 2001242405A AU 4240501 A AU4240501 A AU 4240501A AU 2001242405 A1 AU2001242405 A1 AU 2001242405A1
- Authority
- AU
- Australia
- Prior art keywords
- interior
- electronic components
- wall surface
- casting material
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
Abstract
A device for accomodating at least one, preferably electrical or electronic, component, comprising a housing forming an interior defined by an inner wall surface, in which interior the at least one component is arranged, the at least one component occupying less than all of the interior of the housing, the balance being filled with a casting material, wherein a projection from the inner wall surface encircles the interior and forms an undercut filled by the casting material to lock the casting material to the inner wall surface.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10008695 | 2000-02-24 | ||
DE10008695A DE10008695C2 (en) | 2000-02-24 | 2000-02-24 | Housing for accommodating preferably electronic components |
PCT/EP2001/001666 WO2001063995A1 (en) | 2000-02-24 | 2001-02-15 | Device for accommodating electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001242405A1 true AU2001242405A1 (en) | 2001-09-03 |
Family
ID=7632262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001242405A Abandoned AU2001242405A1 (en) | 2000-02-24 | 2001-02-15 | Device for accommodating electronic components |
Country Status (8)
Country | Link |
---|---|
US (1) | US6674002B2 (en) |
EP (1) | EP1258181B1 (en) |
JP (1) | JP2003524303A (en) |
AT (1) | ATE279091T1 (en) |
AU (1) | AU2001242405A1 (en) |
DE (2) | DE10008695C2 (en) |
PT (1) | PT1258181E (en) |
WO (1) | WO2001063995A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10345570A1 (en) * | 2003-09-29 | 2005-04-28 | Endress & Hauser Gmbh & Co Kg | Encapsulated electronic housing, includes anchoring element for operating against radially, inwardly directed tensile forces |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2753145A1 (en) | 1977-11-29 | 1979-06-07 | Bosch Gmbh Robert | ELECTRONIC CONTROL UNIT, IN PARTICULAR FOR MOUNTING ON THE ENGINE BLOCK OF MOTOR VEHICLES |
US4443655A (en) | 1981-11-27 | 1984-04-17 | Unitrode Corporation | Extruded semiconductor package and fabrication method |
DE3315230A1 (en) | 1983-04-27 | 1984-10-31 | Siemens Ag | Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound |
DE3684184D1 (en) * | 1985-06-20 | 1992-04-16 | Toshiba Kawasaki Kk | ENCLOSED SEMICONDUCTOR ARRANGEMENT. |
DE4033999A1 (en) * | 1990-10-25 | 1992-04-30 | Siemens Ag | CIRCUIT MODULE WITH SAFETY HOUSING |
JP2791216B2 (en) * | 1992-07-17 | 1998-08-27 | ヴィエルティー コーポレーション | Package for electrical component, method for mounting power loss generating component, and method for connecting conductor terminal pin to circuit board |
DE19634673C2 (en) * | 1996-08-28 | 1998-08-27 | Stahl R Schaltgeraete Gmbh | Plastic housing in the "flameproof enclosure" type of protection |
EP1366521A2 (en) * | 2000-08-18 | 2003-12-03 | Koninklijke Philips Electronics N.V. | Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method |
-
2000
- 2000-02-24 DE DE10008695A patent/DE10008695C2/en not_active Expired - Fee Related
-
2001
- 2001-02-15 DE DE50103982T patent/DE50103982D1/en not_active Expired - Fee Related
- 2001-02-15 WO PCT/EP2001/001666 patent/WO2001063995A1/en active IP Right Grant
- 2001-02-15 JP JP2001562077A patent/JP2003524303A/en active Pending
- 2001-02-15 AU AU2001242405A patent/AU2001242405A1/en not_active Abandoned
- 2001-02-15 PT PT01915256T patent/PT1258181E/en unknown
- 2001-02-15 EP EP01915256A patent/EP1258181B1/en not_active Expired - Lifetime
- 2001-02-15 AT AT01915256T patent/ATE279091T1/en not_active IP Right Cessation
- 2001-02-15 US US10/204,778 patent/US6674002B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6674002B2 (en) | 2004-01-06 |
DE10008695A1 (en) | 2001-09-20 |
DE10008695C2 (en) | 2002-06-20 |
ATE279091T1 (en) | 2004-10-15 |
WO2001063995A1 (en) | 2001-08-30 |
PT1258181E (en) | 2005-02-28 |
JP2003524303A (en) | 2003-08-12 |
EP1258181B1 (en) | 2004-10-06 |
EP1258181A1 (en) | 2002-11-20 |
DE50103982D1 (en) | 2004-11-11 |
US20030010518A1 (en) | 2003-01-16 |
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