AU2001242267A1 - Power converter and method for producing the same - Google Patents

Power converter and method for producing the same

Info

Publication number
AU2001242267A1
AU2001242267A1 AU2001242267A AU4226701A AU2001242267A1 AU 2001242267 A1 AU2001242267 A1 AU 2001242267A1 AU 2001242267 A AU2001242267 A AU 2001242267A AU 4226701 A AU4226701 A AU 4226701A AU 2001242267 A1 AU2001242267 A1 AU 2001242267A1
Authority
AU
Australia
Prior art keywords
producing
same
power converter
converter
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001242267A
Inventor
Alfred Goerlach
Uwe Knappenberger
Christoph Ruf
Richard Spitz
Peter Urbach
Alexander Wallrauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of AU2001242267A1 publication Critical patent/AU2001242267A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2001242267A 2000-02-26 2001-02-21 Power converter and method for producing the same Abandoned AU2001242267A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10009171A DE10009171B4 (en) 2000-02-26 2000-02-26 Power converter and its manufacturing process
DE10009171 2000-02-26
PCT/DE2001/000666 WO2001063671A1 (en) 2000-02-26 2001-02-21 Power converter and method for producing the same

Publications (1)

Publication Number Publication Date
AU2001242267A1 true AU2001242267A1 (en) 2001-09-03

Family

ID=7632581

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001242267A Abandoned AU2001242267A1 (en) 2000-02-26 2001-02-21 Power converter and method for producing the same

Country Status (7)

Country Link
US (1) US6774476B2 (en)
EP (1) EP1264346A1 (en)
JP (1) JP2003525007A (en)
AU (1) AU2001242267A1 (en)
DE (1) DE10009171B4 (en)
TW (1) TW508832B (en)
WO (1) WO2001063671A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3673776B2 (en) 2002-07-03 2005-07-20 株式会社日立製作所 Semiconductor module and power conversion device
DE10258035A1 (en) * 2002-12-12 2004-06-24 Robert Bosch Gmbh Single-phase power converter module, e.g. automobile rectifier, has auxiliary element for inhibiting connector tilt about connecting vane longitudinal axis that can be separated after module assembly
DE10352079A1 (en) * 2003-11-08 2005-06-02 Robert Bosch Gmbh Electric motor, and method of making such
JP4284625B2 (en) * 2005-06-22 2009-06-24 株式会社デンソー Three-phase inverter device
DE102005039478B4 (en) * 2005-08-18 2007-05-24 Infineon Technologies Ag Power semiconductor device with semiconductor chip stack and method for producing the same
JP4564937B2 (en) 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 Electric circuit device, electric circuit module, and power conversion device
FI121613B (en) * 2006-12-21 2011-01-31 Abb Oy Method and system in connection with a motor fed by a voltage converter
JP5029824B2 (en) * 2007-09-20 2012-09-19 株式会社安川電機 Matrix converter
US8011950B2 (en) 2009-02-18 2011-09-06 Cinch Connectors, Inc. Electrical connector
DE102009024341B4 (en) * 2009-06-09 2012-12-06 Minebea Co., Ltd. Control circuit for a polyphase electric motor, wherein the drive circuit is arranged together with the bridge circuit on a single circuit board
DE102010028203A1 (en) * 2010-04-26 2011-10-27 Robert Bosch Gmbh Rectifier bridge circuit
MY166609A (en) 2010-09-15 2018-07-17 Semiconductor Components Ind Llc Connector assembly and method of manufacture
DE102016101433A1 (en) * 2016-01-27 2017-07-27 Infineon Technologies Ag Multi-chip semiconductor power housing

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356914A (en) * 1963-05-03 1967-12-05 Westinghouse Electric Corp Integrated semiconductor rectifier assembly
NL297107A (en) * 1963-06-03
DE2536711C3 (en) 1975-08-18 1980-02-28 Siemens Ag, 1000 Berlin Und 8000 Muenchen High voltage rectifier for high voltage cascades
JPS5850105B2 (en) * 1976-06-05 1983-11-08 株式会社東芝 semiconductor rectifier
DE2840399A1 (en) 1978-09-16 1980-03-27 Bbc Brown Boveri & Cie SEMICONDUCTOR ARRANGEMENT OF SEMICONDUCTOR DISC CONNECTED IN STACKING TECHNOLOGY IN A HOUSING, AT LEAST ONE PN TRANSITION
JPS57196535A (en) * 1981-05-28 1982-12-02 Toshiba Corp Semiconductor device for electric power
JPS5875479U (en) * 1981-11-16 1983-05-21 三菱電機株式会社 Rectifier for vehicle alternator
EP0100626A3 (en) * 1982-07-29 1985-11-06 LUCAS INDUSTRIES public limited company Semi-conductor assembly
JPS6064458A (en) 1983-09-19 1985-04-13 Fujitsu Ltd Semiconductor device
JP3216184B2 (en) * 1991-12-26 2001-10-09 株式会社デンソー Rectifier for automotive alternator
EP0660496B1 (en) * 1993-12-23 1998-09-30 Asea Brown Boveri AG Converter device with low-inductive commutation loop
DE19617055C1 (en) * 1996-04-29 1997-06-26 Semikron Elektronik Gmbh High-density multilayer prepreg semiconductor power module
JP2980046B2 (en) * 1997-02-03 1999-11-22 日本電気株式会社 Semiconductor device mounting structure and mounting method
JP2870530B1 (en) * 1997-10-30 1999-03-17 日本電気株式会社 Stack module interposer and stack module
JP4121185B2 (en) * 1998-06-12 2008-07-23 新電元工業株式会社 Electronic circuit equipment
SG106054A1 (en) * 2001-04-17 2004-09-30 Micron Technology Inc Method and apparatus for package reduction in stacked chip and board assemblies

Also Published As

Publication number Publication date
TW508832B (en) 2002-11-01
US6774476B2 (en) 2004-08-10
EP1264346A1 (en) 2002-12-11
DE10009171B4 (en) 2005-08-11
JP2003525007A (en) 2003-08-19
DE10009171A1 (en) 2001-09-13
US20030142480A1 (en) 2003-07-31
WO2001063671A1 (en) 2001-08-30

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