AU2001233100A1 - Circuit protective composites - Google Patents

Circuit protective composites

Info

Publication number
AU2001233100A1
AU2001233100A1 AU2001233100A AU3310001A AU2001233100A1 AU 2001233100 A1 AU2001233100 A1 AU 2001233100A1 AU 2001233100 A AU2001233100 A AU 2001233100A AU 3310001 A AU3310001 A AU 3310001A AU 2001233100 A1 AU2001233100 A1 AU 2001233100A1
Authority
AU
Australia
Prior art keywords
circuit protective
protective composites
composites
circuit
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001233100A
Inventor
Rui Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001233100A1 publication Critical patent/AU2001233100A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B29C66/433—Casing-in, i.e. enclosing an element between two sheets by an outlined seam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/69—General aspects of joining filaments 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91933—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined higher than said fusion temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AU2001233100A 2000-10-05 2001-01-30 Circuit protective composites Abandoned AU2001233100A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09680159 2000-10-05
US09/680,159 US6372992B1 (en) 2000-10-05 2000-10-05 Circuit protective composites
PCT/US2001/002914 WO2002028638A1 (en) 2000-10-05 2001-01-30 Circuit protective composites

Publications (1)

Publication Number Publication Date
AU2001233100A1 true AU2001233100A1 (en) 2002-04-15

Family

ID=24729927

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001233100A Abandoned AU2001233100A1 (en) 2000-10-05 2001-01-30 Circuit protective composites

Country Status (9)

Country Link
US (1) US6372992B1 (en)
EP (1) EP1324880A1 (en)
JP (1) JP2004510604A (en)
KR (2) KR20070090275A (en)
CN (1) CN100413684C (en)
AU (1) AU2001233100A1 (en)
MX (1) MXPA03002830A (en)
TW (1) TW516341B (en)
WO (1) WO2002028638A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6612677B2 (en) * 2001-07-25 2003-09-02 Hewlett-Packard Company Ink drop sensor
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
EP1424882A1 (en) * 2002-11-26 2004-06-02 I & T Innovation Technology Entwicklungs- und Holding AG Flat conductor cable
US20040234707A1 (en) * 2003-05-23 2004-11-25 Dimarzio Don Method of multi-axial crystalline thermoplastic coating of composite structures
US6843870B1 (en) * 2003-07-22 2005-01-18 Epic Biosonics Inc. Implantable electrical cable and method of making
US7189929B2 (en) * 2004-01-16 2007-03-13 Hewlett-Packard Development Company, L.P. Flexible circuit with cover layer
US7220920B1 (en) 2004-01-23 2007-05-22 Hutchinson Technology Incorporated Flexible electrical circuit with slotted coverlay
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate
TWI330510B (en) * 2006-09-11 2010-09-11 Au Optronics Corp Flexible printed circuit and display module comprising the same
US20080233011A1 (en) * 2007-03-23 2008-09-25 3M Innovative Properties Company Microfluidic devices
US8049112B2 (en) * 2007-04-13 2011-11-01 3M Innovative Properties Company Flexible circuit with cover layer
US20080308922A1 (en) * 2007-06-14 2008-12-18 Yiwen Zhang Method for packaging semiconductors at a wafer level
US8213120B2 (en) * 2007-09-10 2012-07-03 International Business Machines Corporation Flexible cable comprising liquid crystal polymer
US9220890B2 (en) 2008-04-17 2015-12-29 Medtronic, Inc. Extensible implantable medical lead with co-axial conductor coils
WO2009128966A1 (en) * 2008-04-17 2009-10-22 Medtronic, Inc. Extensible implantable medical lead with sigmoidal conductors
US10155109B2 (en) 2008-04-17 2018-12-18 Medtronic, Inc. Extensible implantable medical lead with braided conductors
KR101088806B1 (en) 2009-01-07 2011-12-01 주식회사 뉴로바이오시스 Micro-electrode Array Package using Liquid Crystal Polymer and Manufacturing Method thereof
US8662639B2 (en) 2009-01-30 2014-03-04 John A. Doran Flexible circuit
US20110019370A1 (en) * 2009-07-27 2011-01-27 Gainteam Holdings Limited Flexible circuit module
US8693203B2 (en) 2011-01-14 2014-04-08 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
US8472207B2 (en) 2011-01-14 2013-06-25 Harris Corporation Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
US8867219B2 (en) * 2011-01-14 2014-10-21 Harris Corporation Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
US8844125B2 (en) 2011-01-14 2014-09-30 Harris Corporation Method of making an electronic device having a liquid crystal polymer solder mask and related devices
KR101144532B1 (en) * 2011-02-17 2012-05-11 주식회사 뉴로바이오시스 Micro-electrode Array Package using Liquid Crystal Polymer
US8877558B2 (en) 2013-02-07 2014-11-04 Harris Corporation Method for making electronic device with liquid crystal polymer and related devices
US9293438B2 (en) 2013-07-03 2016-03-22 Harris Corporation Method for making electronic device with cover layer with openings and related devices

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JPS61130046A (en) 1984-11-28 1986-06-17 ポリプラスチックス株式会社 Manufacture of laminated film
US4876120A (en) * 1987-04-21 1989-10-24 General Electric Company Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion
US4975312A (en) 1988-06-20 1990-12-04 Foster-Miller, Inc. Multiaxially oriented thermotropic polymer substrate for printed wire board
JP3245437B2 (en) 1991-04-05 2002-01-15 株式会社クラレ Manufacturing method of laminate
JP3090706B2 (en) 1991-04-08 2000-09-25 株式会社クラレ Method for producing film composed of liquid crystal polymer
US5248530A (en) 1991-11-27 1993-09-28 Hoechst Celanese Corp. Heat sealable coextruded lcp film
JP2570336Y2 (en) * 1991-11-28 1998-05-06 矢崎総業株式会社 Tape wire
JP2939477B2 (en) 1994-08-16 1999-08-25 エイチエヌエイ・ホールディングス・インコーポレーテッド Liquid crystal polymer-metal laminate and method for producing the laminate
US5719354A (en) 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
JP3618152B2 (en) 1995-09-22 2005-02-09 ジャパンゴアテックス株式会社 Hollow molded product having a liquid crystal polymer layer
JP3659721B2 (en) * 1995-12-22 2005-06-15 ジャパンゴアテックス株式会社 Liquid crystal polymer film stretched product having adhesive surface or metal surface
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JP4216433B2 (en) 1999-03-29 2009-01-28 株式会社クラレ Method for producing metal-clad laminate for circuit board
JP4138995B2 (en) * 1999-03-31 2008-08-27 株式会社クラレ Circuit board and manufacturing method thereof
DE102005011644A1 (en) * 2005-03-14 2006-09-21 AS Lüngen GmbH & Co. KG Exothermic and insulating feeder inserts with high gas permeability

Also Published As

Publication number Publication date
KR20030034249A (en) 2003-05-01
TW516341B (en) 2003-01-01
US6372992B1 (en) 2002-04-16
WO2002028638A1 (en) 2002-04-11
KR100793454B1 (en) 2008-01-14
KR20070090275A (en) 2007-09-05
JP2004510604A (en) 2004-04-08
EP1324880A1 (en) 2003-07-09
CN1468172A (en) 2004-01-14
MXPA03002830A (en) 2003-10-14
CN100413684C (en) 2008-08-27

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