AU2001229001A1 - A method for printing a conductive coating on an electronic unit - Google Patents

A method for printing a conductive coating on an electronic unit

Info

Publication number
AU2001229001A1
AU2001229001A1 AU2001229001A AU2900101A AU2001229001A1 AU 2001229001 A1 AU2001229001 A1 AU 2001229001A1 AU 2001229001 A AU2001229001 A AU 2001229001A AU 2900101 A AU2900101 A AU 2900101A AU 2001229001 A1 AU2001229001 A1 AU 2001229001A1
Authority
AU
Australia
Prior art keywords
printing
electronic unit
conductive coating
conductive
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001229001A
Inventor
Lars Eriksson
Per Holmberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE0000862A external-priority patent/SE0000862D0/en
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU2001229001A1 publication Critical patent/AU2001229001A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Methods (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2001229001A 2000-03-14 2001-01-22 A method for printing a conductive coating on an electronic unit Abandoned AU2001229001A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
SE0000862 2000-03-14
SE0000862A SE0000862D0 (en) 2000-03-14 2000-03-14 Way of printing difficult spots with a conductive on an electrical unit
SE0002177 2000-04-13
SE0002177A SE517303C2 (en) 2000-03-14 2000-06-13 Method of printing an electrically conductive coating on an electronic device
PCT/SE2001/000105 WO2001069999A1 (en) 2000-03-14 2001-01-22 A method for printing a conductive coating on an electronic unit

Publications (1)

Publication Number Publication Date
AU2001229001A1 true AU2001229001A1 (en) 2001-09-24

Family

ID=26655022

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001229001A Abandoned AU2001229001A1 (en) 2000-03-14 2001-01-22 A method for printing a conductive coating on an electronic unit

Country Status (5)

Country Link
US (1) US6729238B2 (en)
JP (1) JP2004500262A (en)
AU (1) AU2001229001A1 (en)
SE (1) SE517303C2 (en)
WO (1) WO2001069999A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20070409A0 (en) * 2007-05-24 2007-05-24 Pintavision Oy Process for making circuit boards containing electronic, optical and functional characteristics
US9821546B2 (en) * 2009-01-13 2017-11-21 Illinois Tool Works Inc. Digital cliche pad printing system and method
FR2990382B1 (en) * 2012-05-10 2017-07-28 Sgd Sa METHOD AND MACHINE FOR DECORATING BOTTLES BY INDIRECT PAD PRINTING IN SHELL

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2748696A (en) * 1951-06-13 1956-06-05 Murray Lilian Printing or decoration of ceramic or other ware
JPS5822353B2 (en) * 1980-10-20 1983-05-09 日本曲面印刷機株式会社 Pad type intaglio offset printing equipment
ATE123698T1 (en) * 1991-11-25 1995-06-15 Georg Binnen MULTI-COLOR PAD PRINTING MACHINE.
DE4302445A1 (en) * 1993-01-29 1994-08-11 Lohmann Therapie Syst Lts Pad printing process
NZ331662A (en) * 1996-03-13 2000-04-28 Ericsson Telefon Ab L M Printing a metallic layer on the surface of a detail for shielding against electromagnetic radiation
SE9703410D0 (en) * 1997-09-22 1997-09-22 Ericsson Telefon Ab L M Ways to transfer an image to irregular surfaces

Also Published As

Publication number Publication date
SE517303C2 (en) 2002-05-21
SE0002177D0 (en) 2000-06-13
US6729238B2 (en) 2004-05-04
SE0002177L (en) 2001-09-15
WO2001069999A1 (en) 2001-09-20
JP2004500262A (en) 2004-01-08
US20020026876A1 (en) 2002-03-07

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