AU2001225742A1 - Low haze adhesive sheet - Google Patents
Low haze adhesive sheetInfo
- Publication number
- AU2001225742A1 AU2001225742A1 AU2001225742A AU2574201A AU2001225742A1 AU 2001225742 A1 AU2001225742 A1 AU 2001225742A1 AU 2001225742 A AU2001225742 A AU 2001225742A AU 2574201 A AU2574201 A AU 2574201A AU 2001225742 A1 AU2001225742 A1 AU 2001225742A1
- Authority
- AU
- Australia
- Prior art keywords
- adhesive sheet
- low haze
- haze adhesive
- low
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09615389 | 2000-07-13 | ||
US09/615,389 US6472065B1 (en) | 2000-07-13 | 2000-07-13 | Clear adhesive sheet |
PCT/US2000/031587 WO2002006413A1 (en) | 2000-07-13 | 2000-11-16 | Low haze adhesive sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001225742A1 true AU2001225742A1 (en) | 2002-01-30 |
Family
ID=24465146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001225742A Abandoned AU2001225742A1 (en) | 2000-07-13 | 2000-11-16 | Low haze adhesive sheet |
Country Status (3)
Country | Link |
---|---|
US (1) | US6472065B1 (en) |
AU (1) | AU2001225742A1 (en) |
WO (1) | WO2002006413A1 (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6759121B2 (en) * | 2000-07-13 | 2004-07-06 | 3M Innovative Properties Company | Clear adhesive sheet |
JP4812963B2 (en) * | 2001-05-18 | 2011-11-09 | リンテック株式会社 | Adhesive sheet for processing semiconductor wafer and method for processing semiconductor wafer |
US6949297B2 (en) | 2001-11-02 | 2005-09-27 | 3M Innovative Properties Company | Hybrid adhesives, articles, and methods |
JP2003218063A (en) * | 2002-01-24 | 2003-07-31 | Canon Inc | Adhesive sheet for water sticking, and processing method using the sheet |
EP1391493A1 (en) * | 2002-08-22 | 2004-02-25 | Lintec Corporation | Surface protecting film for polycarbonate |
US6887917B2 (en) | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
KR20050116844A (en) | 2003-04-02 | 2005-12-13 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | Method of manufacturing a flexible electronic device and flexible device |
US7927703B2 (en) | 2003-04-11 | 2011-04-19 | 3M Innovative Properties Company | Adhesive blends, articles, and methods |
DE10322964B4 (en) | 2003-05-21 | 2006-03-23 | Seleon Gmbh | Control unit for anti-snoring device and anti-snoring device |
EP1655363A1 (en) * | 2003-06-20 | 2006-05-10 | Nitto Denko Corporation | Cell microchip |
JP2005027659A (en) * | 2003-06-20 | 2005-02-03 | Nitto Denko Corp | Cell microchip |
JP2005150235A (en) | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | Semiconductor surface protection sheet and method therefor |
JP4519476B2 (en) * | 2004-02-03 | 2010-08-04 | 株式会社東芝 | Wireless communication device |
US20060082002A1 (en) * | 2004-10-06 | 2006-04-20 | Lintec Corporation | Sheet for circuit substrates and sheet of a circuit substrate for displays |
US20070114366A1 (en) * | 2005-11-21 | 2007-05-24 | General Electric Company | Optical article having a multi-component structure as an anti-theft feature and a system and method for inhibiting theft of same |
JP4976075B2 (en) * | 2005-12-26 | 2012-07-18 | リンテック株式会社 | Adhesive for polarizing plate, polarizing plate with adhesive and method for producing the same |
US7807754B2 (en) * | 2006-03-13 | 2010-10-05 | 3M Innovative Properties Company | Dry apply adhesive graphic films |
JP2007273714A (en) * | 2006-03-31 | 2007-10-18 | Lintec Corp | Circuit board and manufacturing method therefor |
JP5057697B2 (en) * | 2006-05-12 | 2012-10-24 | 日東電工株式会社 | Adhesive sheet for processing semiconductor wafers or semiconductor substrates |
JP5863157B2 (en) * | 2006-12-18 | 2016-02-16 | 日東電工株式会社 | Adhesive sheet |
DE102007006251B4 (en) * | 2007-02-08 | 2016-07-07 | Lohmann Gmbh & Co. Kg | Method for the edge-side passivation of PSA tapes, PSA roll produced by the process and their use |
WO2008115711A1 (en) * | 2007-03-16 | 2008-09-25 | 3M Innovative Properties Company | Dicing and die attach adhesive |
US20090068458A1 (en) * | 2007-09-06 | 2009-03-12 | 3M Innovative Properties Company | Adhesive-coated backing for flexible circuit |
EP2231804B1 (en) | 2007-12-27 | 2016-09-07 | 3M Innovative Properties Company | Urea-based pressure sensitive adhesives |
JP5063389B2 (en) * | 2008-01-30 | 2012-10-31 | リンテック株式会社 | Circuit board resin sheet, circuit board sheet, and display circuit board |
KR20100122110A (en) * | 2008-03-07 | 2010-11-19 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Dicing tape and die attach adhesive with patterned backing |
US8488428B2 (en) | 2008-05-14 | 2013-07-16 | Nbcuniversal Media, Llc | Enhanced security of optical article |
EP2379666B1 (en) * | 2008-12-31 | 2016-03-23 | 3M Innovative Properties Company | Adhesive tape and articles comprising stretch releasable pressure-sensitive adhesive |
CN102459490B (en) | 2009-05-15 | 2014-04-23 | 3M创新有限公司 | Urethane-based pressure sensitive adhesives |
US20140178681A1 (en) * | 2011-09-14 | 2014-06-26 | 3M Innovative Properties Company | Methods of modulating tackiness |
EP2779265B1 (en) * | 2011-11-11 | 2018-07-18 | Dai Nippon Printing Co., Ltd. | Electrochemical cell packaging material |
WO2015105708A1 (en) * | 2014-01-08 | 2015-07-16 | Avery Dennison Corporation | Articles, compositions, systems, and methods using selectively detackified adhesives |
US10526511B2 (en) | 2016-12-22 | 2020-01-07 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639266A1 (en) | 1985-12-27 | 1987-07-02 | Fsk K K | ADHESIVE FILM |
DE3850451T2 (en) | 1987-07-08 | 1995-03-09 | Furukawa Electric Co Ltd | Radiation-crosslinkable adhesive strips. |
US5281473A (en) * | 1987-07-08 | 1994-01-25 | Furakawa Electric Co., Ltd. | Radiation-curable adhesive tape |
IT1224960B (en) | 1988-10-26 | 1990-10-29 | Castellini Spa | TARTAR SCALER WITH OWN LIGHTING |
JPH02164357A (en) | 1988-12-19 | 1990-06-25 | Toray Ind Inc | Method and device for producing cylindrical fiber body |
JP3410202B2 (en) | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | Adhesive sheet for attaching wafer and method for manufacturing semiconductor device using the same |
JP3348923B2 (en) * | 1993-07-27 | 2002-11-20 | リンテック株式会社 | Adhesive sheet for attaching wafer |
US5480842A (en) | 1994-04-11 | 1996-01-02 | At&T Corp. | Method for fabricating thin, strong, and flexible die for smart cards |
DE69507335T2 (en) | 1994-11-29 | 1999-09-09 | Dsm N.V. | OPTICAL FIBERGLASS COATED WITH A RADIATION-CURABLE COATING COMPOSITION |
JP3035179B2 (en) * | 1995-01-13 | 2000-04-17 | 住友ベークライト株式会社 | Adhesive sheet for semiconductor wafer processing |
KR100249313B1 (en) | 1997-07-25 | 2000-03-15 | 윤종용 | Tape laminating system for semiconductor device and its driving method |
US6013722A (en) | 1998-01-27 | 2000-01-11 | 3M Innovative Properties Company | Non-whitening emulsion pressure sensitive adhesives |
JP3669196B2 (en) | 1998-07-27 | 2005-07-06 | 日東電工株式会社 | UV curable adhesive sheet |
-
2000
- 2000-07-13 US US09/615,389 patent/US6472065B1/en not_active Expired - Fee Related
- 2000-11-16 AU AU2001225742A patent/AU2001225742A1/en not_active Abandoned
- 2000-11-16 WO PCT/US2000/031587 patent/WO2002006413A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US6472065B1 (en) | 2002-10-29 |
WO2002006413A1 (en) | 2002-01-24 |
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