AU2001211669A1 - Apparatus for attaching resists and wafers to substrates - Google Patents

Apparatus for attaching resists and wafers to substrates

Info

Publication number
AU2001211669A1
AU2001211669A1 AU2001211669A AU1166901A AU2001211669A1 AU 2001211669 A1 AU2001211669 A1 AU 2001211669A1 AU 2001211669 A AU2001211669 A AU 2001211669A AU 1166901 A AU1166901 A AU 1166901A AU 2001211669 A1 AU2001211669 A1 AU 2001211669A1
Authority
AU
Australia
Prior art keywords
resists
wafers
substrates
attaching
attaching resists
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001211669A
Inventor
Stanley Lai
Jack Lin
William John Nelson
Larry Shen
Shyan-I Wu Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Semiconductor of Taiwan Ltd
Original Assignee
SHYAN I WU WU
General Semiconductor of Taiwan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHYAN I WU WU, General Semiconductor of Taiwan Ltd filed Critical SHYAN I WU WU
Publication of AU2001211669A1 publication Critical patent/AU2001211669A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AU2001211669A 2000-10-12 2000-10-12 Apparatus for attaching resists and wafers to substrates Abandoned AU2001211669A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2000/001542 WO2001029884A1 (en) 2000-10-12 2000-10-12 Apparatus for attaching resists and wafers to substrates

Publications (1)

Publication Number Publication Date
AU2001211669A1 true AU2001211669A1 (en) 2001-04-30

Family

ID=11003990

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001211669A Abandoned AU2001211669A1 (en) 2000-10-12 2000-10-12 Apparatus for attaching resists and wafers to substrates

Country Status (3)

Country Link
EP (1) EP1325511A1 (en)
AU (1) AU2001211669A1 (en)
WO (1) WO2001029884A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2678161B2 (en) * 1991-10-30 1997-11-17 九州電子金属 株式会社 Vacuum bonding equipment for semiconductor wafers
JPH0770568B2 (en) * 1992-04-06 1995-07-31 カシオ計算機株式会社 Etching resist supply method and apparatus therefor
US5401690A (en) * 1993-07-08 1995-03-28 Goodark Electronic Corp. Method for making circular diode chips through glass passivation
JPH108267A (en) * 1996-06-27 1998-01-13 Nitto Denko Corp Method for removing resist film image and adhesive material for removing resist

Also Published As

Publication number Publication date
WO2001029884A8 (en) 2001-09-27
WO2001029884A1 (en) 2001-04-26
EP1325511A1 (en) 2003-07-09

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