AU2000278226A1 - A ball forming process - Google Patents

A ball forming process

Info

Publication number
AU2000278226A1
AU2000278226A1 AU2000278226A AU7822600A AU2000278226A1 AU 2000278226 A1 AU2000278226 A1 AU 2000278226A1 AU 2000278226 A AU2000278226 A AU 2000278226A AU 7822600 A AU7822600 A AU 7822600A AU 2000278226 A1 AU2000278226 A1 AU 2000278226A1
Authority
AU
Australia
Prior art keywords
forming process
ball forming
ball
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU2000278226A
Inventor
Guoshen Hu
Lu Jiang
Ka Shing Kenny Kwan
Boon Khway Tan
Yi Bin Wang
Yam Mo Wong
Hong Hai Zhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT Singapore Pte Ltd
Original Assignee
ASM Technology Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Technology Singapore Pte Ltd filed Critical ASM Technology Singapore Pte Ltd
Publication of AU2000278226A1 publication Critical patent/AU2000278226A1/en
Withdrawn legal-status Critical Current

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    • H01L2924/20757—Diameter ranges larger or equal to 70 microns less than 80 microns

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
AU2000278226A 2000-09-29 2000-09-29 A ball forming process Withdrawn AU2000278226A1 (en)

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PCT/SG2000/000161 WO2002027781A1 (en) 2000-09-29 2000-09-29 A ball forming process

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AU2000278226A1 true AU2000278226A1 (en) 2002-04-08

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AU (1) AU2000278226A1 (en)
WO (1) WO2002027781A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764944A (en) * 1980-10-08 1982-04-20 Hitachi Ltd Forming and bonding methods for ball of metallic wire
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
JPH1154541A (en) * 1997-08-07 1999-02-26 Shinko Electric Ind Co Ltd Method and device for wire bonding
JP2000124254A (en) * 1998-10-12 2000-04-28 Shibaura Mechatronics Corp Wire bonder

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