AU1730301A - Method and system for endpoint detection - Google Patents

Method and system for endpoint detection

Info

Publication number
AU1730301A
AU1730301A AU17303/01A AU1730301A AU1730301A AU 1730301 A AU1730301 A AU 1730301A AU 17303/01 A AU17303/01 A AU 17303/01A AU 1730301 A AU1730301 A AU 1730301A AU 1730301 A AU1730301 A AU 1730301A
Authority
AU
Australia
Prior art keywords
endpoint detection
endpoint
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU17303/01A
Inventor
Moshe Finarov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nova Ltd
Original Assignee
Nova Measuring Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instruments Ltd filed Critical Nova Measuring Instruments Ltd
Publication of AU1730301A publication Critical patent/AU1730301A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
AU17303/01A 1999-12-06 2000-12-06 Method and system for endpoint detection Abandoned AU1730301A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IL13332699A IL133326A0 (en) 1999-12-06 1999-12-06 Method and system for endpoint detection
IL133326 1999-12-06
PCT/IL2000/000822 WO2001042866A1 (en) 1999-12-06 2000-12-06 Method and system for endpoint detection

Publications (1)

Publication Number Publication Date
AU1730301A true AU1730301A (en) 2001-06-18

Family

ID=11073569

Family Applications (1)

Application Number Title Priority Date Filing Date
AU17303/01A Abandoned AU1730301A (en) 1999-12-06 2000-12-06 Method and system for endpoint detection

Country Status (5)

Country Link
US (6) US6764379B2 (en)
EP (1) EP1410118A1 (en)
AU (1) AU1730301A (en)
IL (1) IL133326A0 (en)
WO (1) WO2001042866A1 (en)

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US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
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US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6939198B1 (en) * 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
KR100434189B1 (en) * 2002-03-21 2004-06-04 삼성전자주식회사 Apparatus and method for chemically and mechanically polishing semiconductor wafer
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6672716B2 (en) * 2002-04-29 2004-01-06 Xerox Corporation Multiple portion solid ink stick
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US20050067103A1 (en) * 2003-09-26 2005-03-31 Applied Materials, Inc. Interferometer endpoint monitoring device
US20070145538A1 (en) * 2005-12-28 2007-06-28 Tsang-Jung Lin Cmp apparatus for polishing dielectric layer and method of controlling dielectric layer thickness
US20090287340A1 (en) * 2008-05-15 2009-11-19 Confluense Llc In-line effluent analysis method and apparatus for CMP process control
US8579675B2 (en) * 2008-11-26 2013-11-12 Applied Materials, Inc. Methods of using optical metrology for feed back and feed forward process control
US9358660B2 (en) 2011-11-07 2016-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Grinding wheel design with elongated teeth arrangement
US9960088B2 (en) * 2011-11-07 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. End point detection in grinding
GB2504282A (en) * 2012-07-24 2014-01-29 Royal Mint Ltd Method of manufacturing a coining die
JP6000743B2 (en) * 2012-08-10 2016-10-05 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
KR102205682B1 (en) 2012-08-15 2021-01-21 노바 메주어링 인스트루먼츠 엘티디. Optical metrology for in-situ measurements
US20140093987A1 (en) * 2012-10-02 2014-04-03 Applied Materials, Inc. Residue Detection with Spectrographic Sensor
CN103144038A (en) * 2013-03-05 2013-06-12 昆山允可精密工业技术有限公司 Grinding wheel follow-up type cutting tool bar processing control system
CN105336641B (en) * 2014-06-20 2018-02-02 中芯国际集成电路制造(上海)有限公司 The weighting calibration method of CMP terminal detecting systems
US9752981B2 (en) 2015-04-30 2017-09-05 Lam Research Corporation Apparatus with a spectral reflectometer for processing substrates
KR20170002764A (en) 2015-06-29 2017-01-09 삼성전자주식회사 Method of fabricating semiconductor device
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
WO2018071716A1 (en) 2016-10-13 2018-04-19 Kla-Tencor Corporation Metrology systems and methods for process control
US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
US20220020617A1 (en) * 2020-07-17 2022-01-20 Applied Materials, Inc. Low open area and coupon endpoint detection
CN114749342B (en) * 2022-04-20 2023-09-26 华南理工大学 Lithium battery pole piece coating defect identification method, device and medium

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US4618262A (en) 1984-04-13 1986-10-21 Applied Materials, Inc. Laser interferometer system and method for monitoring and controlling IC processing
JPH06103687B2 (en) 1988-08-12 1994-12-14 大日本スクリーン製造株式会社 Rotational surface treatment method, treatment end point detection method in rotation type surface treatment, and rotation type surface treatment device
JPH02137852A (en) 1988-11-18 1990-05-28 Dainippon Screen Mfg Co Ltd Development end point detecting method for photoresist
US4977330A (en) 1989-02-13 1990-12-11 Batchelder Tom W In-line photoresist thickness monitor
US5124927A (en) 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
US5293216A (en) 1990-12-31 1994-03-08 Texas Instruments Incorporated Sensor for semiconductor device manufacturing process control
US5290383A (en) 1991-03-24 1994-03-01 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
US5240552A (en) 1991-12-11 1993-08-31 Micron Technology, Inc. Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection
US5222329A (en) * 1992-03-26 1993-06-29 Micron Technology, Inc. Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials
US5245794A (en) * 1992-04-09 1993-09-21 Advanced Micro Devices, Inc. Audio end point detector for chemical-mechanical polishing and method therefor
US7037403B1 (en) * 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
JP3069004B2 (en) * 1993-06-30 2000-07-24 チッソ株式会社 Smectic C liquid crystal composition and liquid crystal display device
US5700180A (en) 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
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US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
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US6271047B1 (en) * 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
US6106662A (en) * 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US5964980A (en) 1998-06-23 1999-10-12 Vlsi Technology, Inc. Fitted endpoint system
US6276987B1 (en) * 1998-08-04 2001-08-21 International Business Machines Corporation Chemical mechanical polishing endpoint process control
US6204922B1 (en) * 1998-12-11 2001-03-20 Filmetrics, Inc. Rapid and accurate thin film measurement of individual layers in a multi-layered or patterned sample
IL133326A0 (en) * 1999-12-06 2001-04-30 Nova Measuring Instr Ltd Method and system for endpoint detection
US7128803B2 (en) * 2002-06-28 2006-10-31 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools

Also Published As

Publication number Publication date
IL133326A0 (en) 2001-04-30
US20110189926A1 (en) 2011-08-04
US8277281B2 (en) 2012-10-02
US20070238394A1 (en) 2007-10-11
EP1410118A1 (en) 2004-04-21
US20100048100A1 (en) 2010-02-25
US6764379B2 (en) 2004-07-20
US8858296B2 (en) 2014-10-14
US20010003084A1 (en) 2001-06-07
US7195540B2 (en) 2007-03-27
US7614932B2 (en) 2009-11-10
US20040249614A1 (en) 2004-12-09
US7927184B2 (en) 2011-04-19
US20130087098A1 (en) 2013-04-11
WO2001042866A1 (en) 2001-06-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase