AU1545997A - Process and device for radioscopically inspecting soldered points in electronic units - Google Patents

Process and device for radioscopically inspecting soldered points in electronic units

Info

Publication number
AU1545997A
AU1545997A AU15459/97A AU1545997A AU1545997A AU 1545997 A AU1545997 A AU 1545997A AU 15459/97 A AU15459/97 A AU 15459/97A AU 1545997 A AU1545997 A AU 1545997A AU 1545997 A AU1545997 A AU 1545997A
Authority
AU
Australia
Prior art keywords
radioscopically
electronic units
soldered points
inspecting
inspecting soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU15459/97A
Other languages
English (en)
Inventor
Norbert Bauer
Randolf Hanke
Gunther Kostka
Peter Schmitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of AU1545997A publication Critical patent/AU1545997A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/16—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the material being a moving sheet or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints

Landscapes

  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Engineering & Computer Science (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AU15459/97A 1996-03-08 1997-01-28 Process and device for radioscopically inspecting soldered points in electronic units Withdrawn AU1545997A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19609097 1996-03-08
DE19609097 1996-03-08
PCT/EP1997/000374 WO1997033159A1 (de) 1996-03-08 1997-01-28 Verfahren und vorrichtung zur radioskopischen lötstelleninspektion von elektronischen baugruppen

Publications (1)

Publication Number Publication Date
AU1545997A true AU1545997A (en) 1997-09-22

Family

ID=7787685

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15459/97A Withdrawn AU1545997A (en) 1996-03-08 1997-01-28 Process and device for radioscopically inspecting soldered points in electronic units

Country Status (2)

Country Link
AU (1) AU1545997A (de)
WO (1) WO1997033159A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116260962A (zh) * 2023-01-29 2023-06-13 电信科学技术仪表研究所有限公司 一种监控摄像机传感器的耐辐射检测装置及方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7009163B2 (en) 2001-06-22 2006-03-07 Orbotech Ltd. High-sensitivity optical scanning using memory integration
JP6512980B2 (ja) * 2015-07-29 2019-05-15 株式会社日立ハイテクサイエンス Ｘ線透過検査装置及びｘ線透過検査方法
DE102015016513B4 (de) 2015-12-18 2021-08-05 Audi Ag Online-Prozessüberwachung und Online-Prozessregelung beim Verfahren zum form- oder stoffschlüssigen Verbinden zumindest zweier Bauteile durch ein Fügeverfahren mittels einer Radiometrievorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2718943A1 (de) * 1977-04-28 1978-11-02 Philips Patentverwaltung Anordnung zur herstellung von roentgenschichtaufnahmen
US5097492A (en) * 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US4910757A (en) * 1987-11-06 1990-03-20 Hitachi, Ltd. Method and apparatus for X-ray imaging
US5199054A (en) * 1990-08-30 1993-03-30 Four Pi Systems Corporation Method and apparatus for high resolution inspection of electronic items
DE4136461C2 (de) * 1991-11-06 1999-04-08 Roland Man Druckmasch Vorrichtung und Verfahren zur großflächigen Bildinspektion
CA2113752C (en) * 1994-01-19 1999-03-02 Stephen Michael Rooks Inspection system for cross-sectional imaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116260962A (zh) * 2023-01-29 2023-06-13 电信科学技术仪表研究所有限公司 一种监控摄像机传感器的耐辐射检测装置及方法
CN116260962B (zh) * 2023-01-29 2024-04-26 电信科学技术仪表研究所有限公司 一种监控摄像机传感器的耐辐射检测装置及方法

Also Published As

Publication number Publication date
WO1997033159A1 (de) 1997-09-12

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