AU1346088A - Ceramic substrate with conductively-filled vias and method for producing - Google Patents

Ceramic substrate with conductively-filled vias and method for producing

Info

Publication number
AU1346088A
AU1346088A AU13460/88A AU1346088A AU1346088A AU 1346088 A AU1346088 A AU 1346088A AU 13460/88 A AU13460/88 A AU 13460/88A AU 1346088 A AU1346088 A AU 1346088A AU 1346088 A AU1346088 A AU 1346088A
Authority
AU
Australia
Prior art keywords
conductively
producing
ceramic substrate
filled vias
vias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU13460/88A
Other languages
English (en)
Inventor
John Barker
Lawrence Cochran
Robert E. McReynolds
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coors Porcelain Co
Original Assignee
Coors Porcelain Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coors Porcelain Co filed Critical Coors Porcelain Co
Publication of AU1346088A publication Critical patent/AU1346088A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AU13460/88A 1987-02-04 1988-01-29 Ceramic substrate with conductively-filled vias and method for producing Abandoned AU1346088A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1090787A 1987-02-04 1987-02-04
US010907 1987-02-04

Publications (1)

Publication Number Publication Date
AU1346088A true AU1346088A (en) 1988-08-24

Family

ID=21747973

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13460/88A Abandoned AU1346088A (en) 1987-02-04 1988-01-29 Ceramic substrate with conductively-filled vias and method for producing

Country Status (2)

Country Link
AU (1) AU1346088A (fr)
WO (1) WO1988005959A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631544B2 (ja) * 1989-01-27 1997-07-16 日本シイエムケイ株式会社 プリント配線板
JPH0461293A (ja) * 1990-06-29 1992-02-27 Toshiba Corp 回路基板及びその製造方法
JP2584911B2 (ja) * 1991-06-18 1997-02-26 富士通株式会社 ガラス−セラミック多層回路基板の製造方法
DE19742072B4 (de) * 1997-09-24 2005-11-24 Robert Bosch Gmbh Verfahren zur Herstellung druckdichter Durchkontaktierungen
WO2009002355A1 (fr) 2007-06-25 2008-12-31 Second Sight Medical Products, Inc. Procédé permettant de fournir une traversée électrique hermétique
EP2230891A1 (fr) * 2009-03-20 2010-09-22 Eurocir, S.A. Procédure pour la fabrication de cartes de circuits imprimés avec des matériaux de base conducteurs hautement thermiques adaptés à l'insertion sur des composants non superficiels
US20170301585A1 (en) * 2015-04-02 2017-10-19 Abexl, Inc. Method for creating through-connected vias and conductors on a substrate
US10593562B2 (en) 2015-04-02 2020-03-17 Samtec, Inc. Method for creating through-connected vias and conductors on a substrate
US9691634B2 (en) 2015-04-02 2017-06-27 Abexl Inc. Method for creating through-connected vias and conductors on a substrate
CN107710891B (zh) * 2015-04-02 2021-07-09 申泰公司 在基板上形成贯通连接的过孔和导体的方法
EP3542396A4 (fr) 2016-11-18 2020-06-17 Samtec Inc. Matériaux de remplissage et procédés de remplissage de trous traversants d'un substrat
US12009225B2 (en) 2018-03-30 2024-06-11 Samtec, Inc. Electrically conductive vias and methods for producing same
TW202129882A (zh) 2019-09-30 2021-08-01 美商山姆科技公司 導電通孔和其製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2154288A (en) * 1936-07-02 1939-04-11 Siemens Ag Process for making electrical contacts
US2912748A (en) * 1956-05-28 1959-11-17 Erie Resistor Corp Method of making printed circuit panels
BE631489A (fr) * 1962-04-27
US3158503A (en) * 1962-05-11 1964-11-24 Young Res Lab Ltd Metallizing holes
US3340607A (en) * 1964-11-12 1967-09-12 Melpar Inc Multilayer printed circuits
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
US3798060A (en) * 1971-10-28 1974-03-19 Westinghouse Electric Corp Methods for fabricating ceramic circuit boards with conductive through holes
DE2306236C2 (de) * 1973-02-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
US4170819A (en) * 1978-04-10 1979-10-16 International Business Machines Corporation Method of making conductive via holes in printed circuit boards
US4302625A (en) * 1980-06-30 1981-11-24 International Business Machines Corp. Multi-layer ceramic substrate
US4434134A (en) * 1981-04-10 1984-02-28 International Business Machines Corporation Pinned ceramic substrate
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
US4446477A (en) * 1981-08-21 1984-05-01 Sperry Corporation Multichip thin film module
FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
US4521449A (en) * 1984-05-21 1985-06-04 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof

Also Published As

Publication number Publication date
WO1988005959A1 (fr) 1988-08-11

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