ATE79982T1 - METHOD OF MANUFACTURING A RIBBON INTENDED FOR CIRCUITS FOR ELECTRONIC MODULES AND RIBBON MANUFACTURED ACCORDING TO THE PROCESS. - Google Patents

METHOD OF MANUFACTURING A RIBBON INTENDED FOR CIRCUITS FOR ELECTRONIC MODULES AND RIBBON MANUFACTURED ACCORDING TO THE PROCESS.

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Publication number
ATE79982T1
ATE79982T1 AT88109743T AT88109743T ATE79982T1 AT E79982 T1 ATE79982 T1 AT E79982T1 AT 88109743 T AT88109743 T AT 88109743T AT 88109743 T AT88109743 T AT 88109743T AT E79982 T1 ATE79982 T1 AT E79982T1
Authority
AT
Austria
Prior art keywords
ribbon
conductors
pct
circuits
sheets
Prior art date
Application number
AT88109743T
Other languages
German (de)
Inventor
Jean-Marcel Stampfli
Original Assignee
Ebauchesfabrik Eta Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebauchesfabrik Eta Ag filed Critical Ebauchesfabrik Eta Ag
Application granted granted Critical
Publication of ATE79982T1 publication Critical patent/ATE79982T1/en

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
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    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
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    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PCT No. PCT/CH88/00102 Sec. 371 Date Feb. 3, 1988 Sec. 102(e) Date Feb. 3, 1989 PCT Filed Jun. 6, 1988 PCT Pub. No. WO88/10509 PCT Pub. Date Dec. 29, 1988.The invention concerns a method of mass producing a tape intended to provide electrical circuits, the tape constituting an intermediate step in the production of electronic modules. The method comprises providing a metal strip (1) having openings defining a series of similar networks of conductors, each conductors being connected to the strip (1) by a bridge, and providing insulating sheets (18) having holes (19, . . . 27) and sticking these sheets to the metal strip in such a manner that the holes face the conductors. The thus-assembled strip (1) and sheets (18) constitute the tape, while the conductors with a part of the sheets define the circuits of the modules.
AT88109743T 1987-06-22 1988-06-18 METHOD OF MANUFACTURING A RIBBON INTENDED FOR CIRCUITS FOR ELECTRONIC MODULES AND RIBBON MANUFACTURED ACCORDING TO THE PROCESS. ATE79982T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8708790A FR2616995A1 (en) 1987-06-22 1987-06-22 METHOD FOR MANUFACTURING ELECTRONIC MODULES
EP88109743A EP0296511B1 (en) 1987-06-22 1988-06-18 Method of fabricating a tape intended to provide circuits for electronic modules, and tape obtained by this method

Publications (1)

Publication Number Publication Date
ATE79982T1 true ATE79982T1 (en) 1992-09-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
AT88109743T ATE79982T1 (en) 1987-06-22 1988-06-18 METHOD OF MANUFACTURING A RIBBON INTENDED FOR CIRCUITS FOR ELECTRONIC MODULES AND RIBBON MANUFACTURED ACCORDING TO THE PROCESS.

Country Status (9)

Country Link
US (1) US5023751A (en)
EP (1) EP0296511B1 (en)
JP (1) JP2632992B2 (en)
KR (1) KR970010149B1 (en)
AT (1) ATE79982T1 (en)
AU (1) AU599491B2 (en)
CA (1) CA1281436C (en)
FR (1) FR2616995A1 (en)
WO (1) WO1988010509A1 (en)

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Also Published As

Publication number Publication date
KR970010149B1 (en) 1997-06-21
JP2632992B2 (en) 1997-07-23
WO1988010509A1 (en) 1988-12-29
KR890702247A (en) 1989-12-23
EP0296511A1 (en) 1988-12-28
AU599491B2 (en) 1990-07-19
JPH02500231A (en) 1990-01-25
EP0296511B1 (en) 1992-08-26
AU1797488A (en) 1989-01-19
FR2616995A1 (en) 1988-12-23
CA1281436C (en) 1991-03-12
US5023751A (en) 1991-06-11

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