ATE553233T1 - Plattierungsvorrichtung und -verfahren mit befestigtem eingetauchtem plattierungswerkzeug - Google Patents

Plattierungsvorrichtung und -verfahren mit befestigtem eingetauchtem plattierungswerkzeug

Info

Publication number
ATE553233T1
ATE553233T1 AT03100234T AT03100234T ATE553233T1 AT E553233 T1 ATE553233 T1 AT E553233T1 AT 03100234 T AT03100234 T AT 03100234T AT 03100234 T AT03100234 T AT 03100234T AT E553233 T1 ATE553233 T1 AT E553233T1
Authority
AT
Austria
Prior art keywords
plating
basin
tool
coated
pipe
Prior art date
Application number
AT03100234T
Other languages
English (en)
Inventor
Pekka Laukkanen
Heikki Leinonen
Original Assignee
Stratum Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stratum Oy filed Critical Stratum Oy
Application granted granted Critical
Publication of ATE553233T1 publication Critical patent/ATE553233T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT03100234T 2002-02-08 2003-02-05 Plattierungsvorrichtung und -verfahren mit befestigtem eingetauchtem plattierungswerkzeug ATE553233T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20020261A FI114811B (fi) 2002-02-08 2002-02-08 Pinnoitusmenetelmä ja -laite

Publications (1)

Publication Number Publication Date
ATE553233T1 true ATE553233T1 (de) 2012-04-15

Family

ID=8563138

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03100234T ATE553233T1 (de) 2002-02-08 2003-02-05 Plattierungsvorrichtung und -verfahren mit befestigtem eingetauchtem plattierungswerkzeug

Country Status (4)

Country Link
EP (1) EP1347081B1 (de)
AT (1) ATE553233T1 (de)
CA (1) CA2417852C (de)
FI (1) FI114811B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105887175A (zh) * 2016-06-27 2016-08-24 无锡瑾宸表面处理有限公司 侧壁安装搅拌桨的电镀槽
CN108441931B (zh) * 2018-05-03 2020-05-08 台山永发五金制品有限公司 一种用于管件电镀加工的夹持装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2462490A1 (fr) * 1979-08-03 1981-02-13 Centre Techn Ind Mecanique Dispositif de revetement electrolytique
US4853099A (en) * 1988-03-28 1989-08-01 Sifco Industries, Inc. Selective electroplating apparatus
US5985123A (en) * 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating

Also Published As

Publication number Publication date
FI20020261L (fi) 2003-08-09
CA2417852C (en) 2012-01-10
EP1347081B1 (de) 2012-04-11
FI20020261A0 (fi) 2002-02-08
FI114811B (fi) 2004-12-31
CA2417852A1 (en) 2003-08-08
EP1347081A1 (de) 2003-09-24

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