ATE543599T1 - Lötbad und verfahren zum erhitzen von lötmittel in einem lötbad - Google Patents

Lötbad und verfahren zum erhitzen von lötmittel in einem lötbad

Info

Publication number
ATE543599T1
ATE543599T1 AT09252889T AT09252889T ATE543599T1 AT E543599 T1 ATE543599 T1 AT E543599T1 AT 09252889 T AT09252889 T AT 09252889T AT 09252889 T AT09252889 T AT 09252889T AT E543599 T1 ATE543599 T1 AT E543599T1
Authority
AT
Austria
Prior art keywords
solder
solder bath
heating
bath
main body
Prior art date
Application number
AT09252889T
Other languages
English (en)
Inventor
Issaku Sato
Akira Takaguchi
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of ATE543599T1 publication Critical patent/ATE543599T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
AT09252889T 2008-12-27 2009-12-23 Lötbad und verfahren zum erhitzen von lötmittel in einem lötbad ATE543599T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008335448A JP2010155269A (ja) 2008-12-27 2008-12-27 はんだ槽及びはんだ槽に収容されたはんだの加熱方法

Publications (1)

Publication Number Publication Date
ATE543599T1 true ATE543599T1 (de) 2012-02-15

Family

ID=42110131

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09252889T ATE543599T1 (de) 2008-12-27 2009-12-23 Lötbad und verfahren zum erhitzen von lötmittel in einem lötbad

Country Status (5)

Country Link
US (2) US20100163600A1 (de)
EP (1) EP2202022B1 (de)
JP (1) JP2010155269A (de)
CN (1) CN101767239A (de)
AT (1) ATE543599T1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170508U (ja) * 2011-05-19 2011-09-22 勝美 釣賀 リフロー炉用保温体
JP5496968B2 (ja) * 2011-08-11 2014-05-21 有限会社森永技研 プリヒート付き卓上半田付け装置
JP5941282B2 (ja) * 2012-01-06 2016-06-29 株式会社タムラ製作所 はんだ槽
CN203636153U (zh) * 2014-01-08 2014-06-11 纬创资通股份有限公司 自动加锡机
CN109108416B (zh) * 2017-06-22 2024-01-19 中国航发常州兰翔机械有限责任公司 一种燃油盖真空钎焊结构及其加工方法
JP6590232B1 (ja) * 2019-04-22 2019-10-16 千住金属工業株式会社 はんだ付け装置及びはんだ付け方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1472170A (en) * 1921-03-30 1923-10-30 Westinghouse Electric Products Electrically-heated solder pot
US1745455A (en) * 1928-09-25 1930-02-04 Lenell R Seaborn Soldering ladle
US2770875A (en) * 1952-06-09 1956-11-20 Motorola Inc Soldering machine
US2869497A (en) * 1954-01-11 1959-01-20 Sylvania Electric Prod Soldering machine
JPS52127449A (en) 1976-04-19 1977-10-26 Inoue Japax Res Device for soldering or brazing
JPS63267312A (ja) * 1987-04-24 1988-11-04 松下電器産業株式会社 炊飯器
JPH03237926A (ja) * 1990-02-16 1991-10-23 Matsushita Electric Ind Co Ltd 炊飯器
JPH0671650B2 (ja) 1990-03-01 1994-09-14 富士プラント工業株式会社 回転式半田処理法での半田溶融液補給兼酸化膜除去方法および装置
JPH0518756A (ja) 1991-07-08 1993-01-26 Murata Mfg Co Ltd 振動ジヤイロ
JP2955726B2 (ja) * 1991-06-28 1999-10-04 イビデン株式会社 断熱材及びその製造方法
JPH0753979B2 (ja) 1992-06-06 1995-06-07 日本植生株式会社 植生袋
JP3195266B2 (ja) * 1997-02-12 2001-08-06 三菱重工業株式会社 複層断熱材及びその製造法
JP2000117842A (ja) * 1998-10-20 2000-04-25 Matsushita Electric Ind Co Ltd 多孔体の製造方法
CN1250477C (zh) * 2000-10-19 2006-04-12 日本核融合科学研究所 烧结炉、制造烧结物的方法和烧结物
US6726082B2 (en) * 2001-11-01 2004-04-27 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
JP2003136233A (ja) 2001-11-02 2003-05-14 Matsushita Electric Ind Co Ltd 噴流式自動半田付け装置
JP2004259963A (ja) * 2003-02-26 2004-09-16 Minebea Co Ltd 噴流式半田付け装置
JP2005007405A (ja) * 2003-06-17 2005-01-13 Ktt:Kk 噴流型半田槽
JP2005281731A (ja) * 2004-03-26 2005-10-13 Sony Corp オーステナイト系ステンレス鋼の製造方法、はんだ溶解槽及び自動はんだ付け装置
JP2007090379A (ja) * 2005-09-28 2007-04-12 Nihon Dennetsu Keiki Co Ltd はんだ付け装置及びはんだ付け装置の始動方法

Also Published As

Publication number Publication date
EP2202022A1 (de) 2010-06-30
US20100163600A1 (en) 2010-07-01
CN101767239A (zh) 2010-07-07
EP2202022B1 (de) 2012-02-01
JP2010155269A (ja) 2010-07-15
US20120224837A1 (en) 2012-09-06

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