ATE540337T1 - Spaltachsenstufengestaltung für halbleiteranwendungen - Google Patents
Spaltachsenstufengestaltung für halbleiteranwendungenInfo
- Publication number
- ATE540337T1 ATE540337T1 AT08719741T AT08719741T ATE540337T1 AT E540337 T1 ATE540337 T1 AT E540337T1 AT 08719741 T AT08719741 T AT 08719741T AT 08719741 T AT08719741 T AT 08719741T AT E540337 T1 ATE540337 T1 AT E540337T1
- Authority
- AT
- Austria
- Prior art keywords
- stage
- freedom
- base frame
- axis stage
- motion
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Details Of Measuring And Other Instruments (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90821407P | 2007-03-27 | 2007-03-27 | |
PCT/IB2008/051006 WO2008117197A1 (en) | 2007-03-27 | 2008-03-17 | Split axes stage design for semiconductor applications |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE540337T1 true ATE540337T1 (de) | 2012-01-15 |
Family
ID=39683777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08719741T ATE540337T1 (de) | 2007-03-27 | 2008-03-17 | Spaltachsenstufengestaltung für halbleiteranwendungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100044943A1 (de) |
EP (1) | EP2132600B1 (de) |
JP (1) | JP2010522981A (de) |
AT (1) | ATE540337T1 (de) |
TW (1) | TW200903703A (de) |
WO (1) | WO2008117197A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2004735A (en) * | 2009-07-06 | 2011-01-10 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
KR101710024B1 (ko) | 2012-10-24 | 2017-02-24 | 에이에스엠엘 네델란즈 비.브이. | 기판 위치설정 시스템, 리소그래피 장치 및 디바이스 제조 방법 |
US10192773B2 (en) * | 2016-06-20 | 2019-01-29 | Nexperia B.V. | Semiconductor device positioning system and method for semiconductor device positioning |
CN117954375B (zh) * | 2024-03-27 | 2024-07-02 | 上海图双精密装备有限公司 | 用于双轴平台的旋转驱动装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6408045B1 (en) | 1997-11-11 | 2002-06-18 | Canon Kabushiki Kaisha | Stage system and exposure apparatus with the same |
KR20020054368A (ko) * | 1999-12-16 | 2002-07-06 | 시마무라 테루오 | 노광방법 및 장치 |
US20020075467A1 (en) * | 2000-12-20 | 2002-06-20 | Nikon Corporation | Exposure apparatus and method |
US6885430B2 (en) | 2000-11-16 | 2005-04-26 | Nikon Corporation | System and method for resetting a reaction mass assembly of a stage assembly |
US6519045B2 (en) * | 2001-01-31 | 2003-02-11 | Rudolph Technologies, Inc. | Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment |
US6842659B2 (en) * | 2001-08-24 | 2005-01-11 | Applied Materials Inc. | Method and apparatus for providing intra-tool monitoring and control |
US20050052197A1 (en) * | 2003-07-14 | 2005-03-10 | Cory Watkins | Multi-tool manager |
US7440091B2 (en) * | 2004-10-26 | 2008-10-21 | Applied Materials, Inc. | Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate |
JP2007019269A (ja) * | 2005-07-07 | 2007-01-25 | Ultrasonic Engineering Co Ltd | Xyステージおよびこれを備えた半導体製造装置 |
US7880155B2 (en) * | 2006-06-15 | 2011-02-01 | Brooks Automation, Inc. | Substrate alignment apparatus comprising a controller to measure alignment during transport |
US7959141B2 (en) * | 2008-12-23 | 2011-06-14 | Sumitomo Heavy Industries, Ltd. | Stage apparatus |
-
2008
- 2008-03-17 JP JP2010500397A patent/JP2010522981A/ja not_active Ceased
- 2008-03-17 EP EP08719741A patent/EP2132600B1/de not_active Not-in-force
- 2008-03-17 WO PCT/IB2008/051006 patent/WO2008117197A1/en active Application Filing
- 2008-03-17 US US12/593,182 patent/US20100044943A1/en not_active Abandoned
- 2008-03-17 AT AT08719741T patent/ATE540337T1/de active
- 2008-03-24 TW TW097110389A patent/TW200903703A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW200903703A (en) | 2009-01-16 |
US20100044943A1 (en) | 2010-02-25 |
EP2132600B1 (de) | 2012-01-04 |
JP2010522981A (ja) | 2010-07-08 |
WO2008117197A1 (en) | 2008-10-02 |
EP2132600A1 (de) | 2009-12-16 |
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