ATE540337T1 - Spaltachsenstufengestaltung für halbleiteranwendungen - Google Patents

Spaltachsenstufengestaltung für halbleiteranwendungen

Info

Publication number
ATE540337T1
ATE540337T1 AT08719741T AT08719741T ATE540337T1 AT E540337 T1 ATE540337 T1 AT E540337T1 AT 08719741 T AT08719741 T AT 08719741T AT 08719741 T AT08719741 T AT 08719741T AT E540337 T1 ATE540337 T1 AT E540337T1
Authority
AT
Austria
Prior art keywords
stage
freedom
base frame
axis stage
motion
Prior art date
Application number
AT08719741T
Other languages
English (en)
Inventor
Johannes Petrus Martinus Bernardus Vermeulen
Antonius T A Peijnenburg
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE540337T1 publication Critical patent/ATE540337T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H10P72/57—
    • H10P72/7618—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT08719741T 2007-03-27 2008-03-17 Spaltachsenstufengestaltung für halbleiteranwendungen ATE540337T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90821407P 2007-03-27 2007-03-27
PCT/IB2008/051006 WO2008117197A1 (en) 2007-03-27 2008-03-17 Split axes stage design for semiconductor applications

Publications (1)

Publication Number Publication Date
ATE540337T1 true ATE540337T1 (de) 2012-01-15

Family

ID=39683777

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08719741T ATE540337T1 (de) 2007-03-27 2008-03-17 Spaltachsenstufengestaltung für halbleiteranwendungen

Country Status (6)

Country Link
US (1) US20100044943A1 (de)
EP (1) EP2132600B1 (de)
JP (1) JP2010522981A (de)
AT (1) ATE540337T1 (de)
TW (1) TW200903703A (de)
WO (1) WO2008117197A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2004735A (en) * 2009-07-06 2011-01-10 Asml Netherlands Bv Imprint lithography apparatus and method.
CN104756013B (zh) 2012-10-24 2017-09-29 Asml荷兰有限公司 衬底定位系统、光刻设备以及器件制造方法
US10192773B2 (en) * 2016-06-20 2019-01-29 Nexperia B.V. Semiconductor device positioning system and method for semiconductor device positioning
CN117954375B (zh) * 2024-03-27 2024-07-02 上海图双精密装备有限公司 用于双轴平台的旋转驱动装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408045B1 (en) 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
AU1554901A (en) * 1999-12-16 2001-06-25 Nikon Corporation Exposure method and exposure apparatus
US20020075467A1 (en) * 2000-12-20 2002-06-20 Nikon Corporation Exposure apparatus and method
US6885430B2 (en) 2000-11-16 2005-04-26 Nikon Corporation System and method for resetting a reaction mass assembly of a stage assembly
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
US6842659B2 (en) * 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
WO2005008737A2 (en) * 2003-07-14 2005-01-27 August Technology Corporation Inspection and metrology module cluster tool with multi-tool manager
US7440091B2 (en) * 2004-10-26 2008-10-21 Applied Materials, Inc. Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
JP2007019269A (ja) * 2005-07-07 2007-01-25 Ultrasonic Engineering Co Ltd Ｘｙステージおよびこれを備えた半導体製造装置
US7880155B2 (en) * 2006-06-15 2011-02-01 Brooks Automation, Inc. Substrate alignment apparatus comprising a controller to measure alignment during transport
US7959141B2 (en) * 2008-12-23 2011-06-14 Sumitomo Heavy Industries, Ltd. Stage apparatus

Also Published As

Publication number Publication date
JP2010522981A (ja) 2010-07-08
EP2132600B1 (de) 2012-01-04
TW200903703A (en) 2009-01-16
WO2008117197A1 (en) 2008-10-02
EP2132600A1 (de) 2009-12-16
US20100044943A1 (en) 2010-02-25

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