ATE538632T1 - Elektronischer apparat mit einer kühlbaugruppe zum kühlen eines vom verbraucher einlegbaren moduls und kühlbaugruppe zur kühlung eines solchen moduls - Google Patents

Elektronischer apparat mit einer kühlbaugruppe zum kühlen eines vom verbraucher einlegbaren moduls und kühlbaugruppe zur kühlung eines solchen moduls

Info

Publication number
ATE538632T1
ATE538632T1 AT06745052T AT06745052T ATE538632T1 AT E538632 T1 ATE538632 T1 AT E538632T1 AT 06745052 T AT06745052 T AT 06745052T AT 06745052 T AT06745052 T AT 06745052T AT E538632 T1 ATE538632 T1 AT E538632T1
Authority
AT
Austria
Prior art keywords
cooling
module
assembly
sliding means
consumer
Prior art date
Application number
AT06745052T
Other languages
English (en)
Inventor
Dirck Seynaeve
Gratien Banckaert
Danny Delacroix
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE538632T1 publication Critical patent/ATE538632T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
AT06745052T 2005-06-02 2006-05-31 Elektronischer apparat mit einer kühlbaugruppe zum kühlen eines vom verbraucher einlegbaren moduls und kühlbaugruppe zur kühlung eines solchen moduls ATE538632T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05104804 2005-06-02
PCT/IB2006/051734 WO2006129281A2 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module

Publications (1)

Publication Number Publication Date
ATE538632T1 true ATE538632T1 (de) 2012-01-15

Family

ID=37401201

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06745052T ATE538632T1 (de) 2005-06-02 2006-05-31 Elektronischer apparat mit einer kühlbaugruppe zum kühlen eines vom verbraucher einlegbaren moduls und kühlbaugruppe zur kühlung eines solchen moduls

Country Status (5)

Country Link
US (1) US7800910B2 (de)
EP (1) EP1891847B1 (de)
AT (1) ATE538632T1 (de)
PL (1) PL1891847T3 (de)
WO (1) WO2006129281A2 (de)

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GB2463538B (en) * 2008-05-06 2012-04-25 Ibm Thermal link system for a computer system and computer system comprising a thermal link system
TWI357556B (en) * 2009-06-04 2012-02-01 Pegatron Corp Industrial computer
JP2013004783A (ja) * 2011-06-17 2013-01-07 Sony Corp 放熱構造および表示装置
CN105052249A (zh) * 2013-03-14 2015-11-11 惠普发展公司，有限责任合伙企业 支撑构件
TWM519879U (zh) * 2015-08-03 2016-04-01 Dowton Electronic Materials Co Ltd 電子裝置之改良散熱結構
US9910231B2 (en) * 2016-01-04 2018-03-06 Infinera Corporation Stacked cage optical module heat relay system
US10945357B2 (en) * 2019-02-21 2021-03-09 Cisco Technology, Inc. Optical module cage with configurable heatsink
US11917797B2 (en) * 2019-12-03 2024-02-27 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US20220082771A1 (en) * 2020-09-17 2022-03-17 TE Connectivity Services Gmbh Heat exchange assembly for a pluggable module
DE102021205301A1 (de) * 2021-05-25 2022-12-01 Robert Bosch Gesellschaft mit beschränkter Haftung Einschubmodul und Modulanordnung
US11864353B2 (en) * 2021-09-15 2024-01-02 Te Connectivity Solutions Gmbh Heat exchange assembly
DE102022200002A1 (de) 2022-01-03 2023-07-06 Continental Automotive Technologies GmbH Wärmeableitvorrichtung, elektronische Vorrichtung und Kraftfahrzeug
US20230239993A1 (en) * 2022-01-26 2023-07-27 Microsoft Technology Licensing, Llc Cooling systems for a circuit board

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US5414591A (en) * 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system
US5640302A (en) * 1992-06-29 1997-06-17 Elonex Ip Holdings Modular portable computer
US5473506A (en) * 1993-11-12 1995-12-05 Elonex Technologies, Inc. Cooling a large microprocessor in a small module
GB9215442D0 (en) 1992-07-21 1992-09-02 British Aerospace Cooling of electronic components
US5414592A (en) 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
SG64996A1 (en) * 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
US6191943B1 (en) * 1998-11-12 2001-02-20 Compaq Computer Corporation Docking station with thermoelectric heat dissipation system for docked portable computer
US6882533B2 (en) 2001-02-22 2005-04-19 Hewlett-Packard Development Company, L.P. Thermal connector for cooling electronics
WO2003077377A1 (en) 2002-03-06 2003-09-18 Tyco Electronics Corporation Receptacle assembly having shielded interface with pluggable electronic module
US20060126306A1 (en) * 2002-04-05 2006-06-15 Blair Thomas H Multi-power optoelectric packages
US6829142B2 (en) 2002-10-25 2004-12-07 Hewlett-Packard Development Company, L.P. Cell thermal connector
DE10319984B4 (de) 2003-05-05 2009-09-03 Qimonda Ag Vorrichtung zum Kühlen von Speichermodulen
US20050161195A1 (en) * 2003-07-22 2005-07-28 Hein Gerald K. System for reliably removing heat from a semiconductor junction
JP5068919B2 (ja) * 2003-09-25 2012-11-07 スリーエム イノベイティブ プロパティズ カンパニー 発泡シート形成性組成物、熱伝導性発泡シート及びその製造方法
US7133285B2 (en) * 2004-01-23 2006-11-07 Yamaichi Electronics U.S.A., Inc. Electronics connector with heat sink
CN2689318Y (zh) * 2004-02-27 2005-03-30 鸿富锦精密工业（深圳）有限公司 资料存取器固持装置
JP4321413B2 (ja) * 2004-09-02 2009-08-26 株式会社日立製作所 ディスクアレイ装置
KR20080029510A (ko) * 2006-09-29 2008-04-03 삼성전자주식회사 방송수신장치용 사용자인증카드 접속장치 및 이를 갖춘방송수신장치

Also Published As

Publication number Publication date
WO2006129281A2 (en) 2006-12-07
EP1891847B1 (de) 2011-12-21
WO2006129281A3 (en) 2007-08-02
EP1891847A2 (de) 2008-02-27
US7800910B2 (en) 2010-09-21
US20090279261A1 (en) 2009-11-12
PL1891847T3 (pl) 2012-05-31

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