ATE538406T1 - Verfahren zur herstellung eines künstliches facettenauges - Google Patents

Verfahren zur herstellung eines künstliches facettenauges

Info

Publication number
ATE538406T1
ATE538406T1 AT09012409T AT09012409T ATE538406T1 AT E538406 T1 ATE538406 T1 AT E538406T1 AT 09012409 T AT09012409 T AT 09012409T AT 09012409 T AT09012409 T AT 09012409T AT E538406 T1 ATE538406 T1 AT E538406T1
Authority
AT
Austria
Prior art keywords
flexible substrate
layer
producing
image sensors
optical channels
Prior art date
Application number
AT09012409T
Other languages
English (en)
Inventor
Jacques Duparre
Andreas Brueckner
Frank Wippermann
Jean-Christophe Zufferey
Dario Floreano
Nicolas Franceschini
Stephane Viollet
Franck Ruffier
Original Assignee
Fraunhofer Ges Forschung
Ecole Polytech
Univ Aix Marseille Ii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung, Ecole Polytech, Univ Aix Marseille Ii filed Critical Fraunhofer Ges Forschung
Application granted granted Critical
Publication of ATE538406T1 publication Critical patent/ATE538406T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/06—Panoramic objectives; So-called "sky lenses" including panoramic objectives having reflecting surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
AT09012409T 2009-09-30 2009-09-30 Verfahren zur herstellung eines künstliches facettenauges ATE538406T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09012409A EP2306230B1 (de) 2009-09-30 2009-09-30 Verfahren zur Herstellung eines künstliches Facettenauges

Publications (1)

Publication Number Publication Date
ATE538406T1 true ATE538406T1 (de) 2012-01-15

Family

ID=41382353

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09012409T ATE538406T1 (de) 2009-09-30 2009-09-30 Verfahren zur herstellung eines künstliches facettenauges

Country Status (3)

Country Link
EP (1) EP2306230B1 (de)
AT (1) ATE538406T1 (de)
WO (1) WO2011039062A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2772210C (en) * 2011-03-24 2015-11-24 Kabushiki Kaisha Topcon Omnidirectional camera and lens hood
CN102201422B (zh) * 2011-04-26 2014-10-22 格科微电子（上海）有限公司 凹面cmos图像传感器及其制造方法
CN103178136B (zh) * 2011-12-22 2016-01-20 清华大学 太阳能电池组
DE102012202207B4 (de) * 2012-02-14 2017-02-16 Paul Metzger Kamera und Bildaufnahmeverfahren
DE102012218835B4 (de) * 2012-10-12 2016-09-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bildsensor und verfahren
US9113829B2 (en) 2013-03-27 2015-08-25 Google Inc. Systems and methods for encapsulating electronics in a mountable device
US9488837B2 (en) 2013-06-28 2016-11-08 Microsoft Technology Licensing, Llc Near eye display
CN104580869B (zh) * 2013-10-10 2018-06-05 华为技术有限公司 一种光场相机
CN107260121B (zh) * 2017-06-14 2023-11-21 苏州四海通仪器有限公司 一种复眼眼底相机
CN107872630A (zh) * 2017-12-25 2018-04-03 信利光电股份有限公司 一种图像传感器
CN108803016B (zh) * 2018-06-11 2022-08-30 北京理工大学 基于双焦距透镜和液体透镜的变焦窝区成像方法及系统
CN112866512B (zh) * 2019-11-26 2022-03-22 中国科学院上海微系统与信息技术研究所 复眼摄像装置及复眼系统
SG10202002922RA (en) * 2020-03-30 2021-10-28 Sharma Nishant SVVRON Effect - 3D TV & Camera (without Glasses)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO305728B1 (no) * 1997-11-14 1999-07-12 Reidar E Tangen Optoelektronisk kamera og fremgangsmÕte ved bildeformatering i samme
JP4012752B2 (ja) * 2002-03-25 2007-11-21 独立行政法人科学技術振興機構 複眼画像入力装置
DE102004003013B3 (de) * 2004-01-20 2005-06-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bilderfassungssystem und dessen Verwendung
US20060044451A1 (en) * 2004-08-30 2006-03-02 Eastman Kodak Company Wide angle lenslet camera
US8077235B2 (en) * 2008-01-22 2011-12-13 Palo Alto Research Center Incorporated Addressing of a three-dimensional, curved sensor or display back plane

Also Published As

Publication number Publication date
WO2011039062A1 (en) 2011-04-07
EP2306230A1 (de) 2011-04-06
EP2306230B1 (de) 2011-12-21

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