ATE48779T1 - Lotflussmittel und verfahren zu dessen herstellung. - Google Patents

Lotflussmittel und verfahren zu dessen herstellung.

Info

Publication number
ATE48779T1
ATE48779T1 AT84303590T AT84303590T ATE48779T1 AT E48779 T1 ATE48779 T1 AT E48779T1 AT 84303590 T AT84303590 T AT 84303590T AT 84303590 T AT84303590 T AT 84303590T AT E48779 T1 ATE48779 T1 AT E48779T1
Authority
AT
Austria
Prior art keywords
soldering
normally liquid
soldered
member selected
amino group
Prior art date
Application number
AT84303590T
Other languages
English (en)
Inventor
Masayuki Hasegawa
Original Assignee
Nihon Almit Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Almit Kk filed Critical Nihon Almit Kk
Application granted granted Critical
Publication of ATE48779T1 publication Critical patent/ATE48779T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616Halogen compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT84303590T 1983-06-01 1984-05-29 Lotflussmittel und verfahren zu dessen herstellung. ATE48779T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58095745A JPS59222591A (ja) 1983-06-01 1983-06-01 金属材料の表面活性化剤
EP84303590A EP0127993B1 (de) 1983-06-01 1984-05-29 Lotflussmittel und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
ATE48779T1 true ATE48779T1 (de) 1990-01-15

Family

ID=14146024

Family Applications (1)

Application Number Title Priority Date Filing Date
AT84303590T ATE48779T1 (de) 1983-06-01 1984-05-29 Lotflussmittel und verfahren zu dessen herstellung.

Country Status (5)

Country Link
US (1) US4533404A (de)
EP (1) EP0127993B1 (de)
JP (1) JPS59222591A (de)
AT (1) ATE48779T1 (de)
DE (1) DE3480770D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948032A (en) * 1988-11-21 1990-08-14 Atmel Corporation Fluxing agent
WO2003064102A1 (en) * 2002-01-30 2003-08-07 Showa Denko K.K. Solder metal, soldering flux and solder paste
US20080156852A1 (en) * 2006-12-29 2008-07-03 Prakash Anna M Solder flux composition and process of using same
CN102294556B (zh) * 2011-08-16 2013-04-10 刘茂平 综合利用镍铁合金渣制备焊剂的工艺方法
CN102814603A (zh) * 2012-08-23 2012-12-12 广东普赛特电子科技股份有限公司 一种纳米原料的水基助焊剂及其制备工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2155307A (en) * 1935-11-02 1939-04-18 Kuppers Metallwerk Kom Ges Bon Soldering agent
GB715106A (en) * 1951-11-05 1954-09-08 Fry S Metal Foundries Ltd Improvements in soldering fluxes
US3840411A (en) * 1972-06-14 1974-10-08 Blackstone Corp Solder flux compositions
DE2243374C3 (de) * 1972-09-02 1975-11-13 Stannol-Loetmittelfabrik Wilhelm Paff, 5600 Wuppertal Flußmittel für Weichlote
US3895973A (en) * 1973-12-17 1975-07-22 Chevron Res Activated soldering flux
GB1517116A (en) * 1976-05-27 1978-07-12 Frys Metals Ltd Soldering fluxes
US4194931A (en) * 1977-05-16 1980-03-25 Western Electric Co. Soldering flux
US4168996A (en) * 1977-05-16 1979-09-25 Western Electric Company, Inc. Soldering flux
US4151015A (en) * 1977-12-02 1979-04-24 Lake Chemical Company Flux for use in soldering

Also Published As

Publication number Publication date
DE3480770D1 (de) 1990-01-25
JPS59222591A (ja) 1984-12-14
EP0127993B1 (de) 1989-12-20
US4533404A (en) 1985-08-06
EP0127993A3 (en) 1986-06-11
JPH0357197B2 (de) 1991-08-30
EP0127993A2 (de) 1984-12-12

Similar Documents

Publication Publication Date Title
ES517620A0 (es) Un procedimiento para la eliminacion quimica de soldantes de estano y de aleacion de estano-plomo de un substrato.
ZA873843B (en) Process for stripping tin or tin-lead alloy from copper
GB2139132B (en) Vapour phase soldering
DE3584024D1 (de) Verfahren zur rueckgewinnung von kupfer aus einer ammoniakalischen kupfer-aetzloesung und rekonditionierung derselben.
ATE48779T1 (de) Lotflussmittel und verfahren zu dessen herstellung.
US3666913A (en) Method of bonding a component lead to a copper etched circuit board lead
GB1449154A (en) Connector members for circuit boards
DE3478999D1 (en) Process for manufacturing electronic components using soft soldering flux based on carboxylic acids
ATE4092T1 (de) Lotlegierungen zum direkten aufloeten von oxidhaltigen silberkontakten auf kontakttraeger.
GB585670A (en) Improvements in electrical connectors
Buchoff Advanced Non-Soldering Interconnection
AU7489987A (en) Process and apparatus for the electro-deposition of copper or other metals on bipolar electrodes made of lead
US4838478A (en) Halogen-free flux mixture and use thereof
JPH0356031Y2 (de)
ATE34783T1 (de) Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen; sowie durchkontaktierte leiterplatte.
IT8722933A0 (it) Apparecchio portatile che utilizza lega per saldature fusa per procedimenti quali la saldatura ela dissaldatura.
DE3479178D1 (en) Wave soldering process and capillary solder means for carrying out the process
IE790296L (en) Effecting a solder connection
IT1199074B (it) Procedimento per il trattamento di soluzioni corrosive contenenti metalli e per il ricupero dei metalli
SU1184633A1 (ru) Флюс дл лужени и пайки легкоплавкими припо ми
ES2128989A1 (es) Mejoras introducidas en la patente de invencion n-9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de ss partes.
CH595930A5 (en) Heated wick for melting and removing solder from joints
Grinchenko Strength and Creep of Soldered Joints of Nickel-Coated Parts Prepared by Flux-Free Soldering With Solder PSr 2. 5
ATE35648T1 (de) Polymere gegenstaende mit verbindungsstellen.
Kosnac Problem of Fluxes in Mass Soldering in the Electronics Industry