ATE48779T1 - Lotflussmittel und verfahren zu dessen herstellung. - Google Patents
Lotflussmittel und verfahren zu dessen herstellung.Info
- Publication number
- ATE48779T1 ATE48779T1 AT84303590T AT84303590T ATE48779T1 AT E48779 T1 ATE48779 T1 AT E48779T1 AT 84303590 T AT84303590 T AT 84303590T AT 84303590 T AT84303590 T AT 84303590T AT E48779 T1 ATE48779 T1 AT E48779T1
- Authority
- AT
- Austria
- Prior art keywords
- soldering
- normally liquid
- soldered
- member selected
- amino group
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58095745A JPS59222591A (ja) | 1983-06-01 | 1983-06-01 | 金属材料の表面活性化剤 |
EP84303590A EP0127993B1 (de) | 1983-06-01 | 1984-05-29 | Lotflussmittel und Verfahren zu dessen Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE48779T1 true ATE48779T1 (de) | 1990-01-15 |
Family
ID=14146024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT84303590T ATE48779T1 (de) | 1983-06-01 | 1984-05-29 | Lotflussmittel und verfahren zu dessen herstellung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4533404A (de) |
EP (1) | EP0127993B1 (de) |
JP (1) | JPS59222591A (de) |
AT (1) | ATE48779T1 (de) |
DE (1) | DE3480770D1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4948032A (en) * | 1988-11-21 | 1990-08-14 | Atmel Corporation | Fluxing agent |
WO2003064102A1 (en) * | 2002-01-30 | 2003-08-07 | Showa Denko K.K. | Solder metal, soldering flux and solder paste |
US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
CN102294556B (zh) * | 2011-08-16 | 2013-04-10 | 刘茂平 | 综合利用镍铁合金渣制备焊剂的工艺方法 |
CN102814603A (zh) * | 2012-08-23 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | 一种纳米原料的水基助焊剂及其制备工艺 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2155307A (en) * | 1935-11-02 | 1939-04-18 | Kuppers Metallwerk Kom Ges Bon | Soldering agent |
GB715106A (en) * | 1951-11-05 | 1954-09-08 | Fry S Metal Foundries Ltd | Improvements in soldering fluxes |
US3840411A (en) * | 1972-06-14 | 1974-10-08 | Blackstone Corp | Solder flux compositions |
DE2243374C3 (de) * | 1972-09-02 | 1975-11-13 | Stannol-Loetmittelfabrik Wilhelm Paff, 5600 Wuppertal | Flußmittel für Weichlote |
US3895973A (en) * | 1973-12-17 | 1975-07-22 | Chevron Res | Activated soldering flux |
GB1517116A (en) * | 1976-05-27 | 1978-07-12 | Frys Metals Ltd | Soldering fluxes |
US4194931A (en) * | 1977-05-16 | 1980-03-25 | Western Electric Co. | Soldering flux |
US4168996A (en) * | 1977-05-16 | 1979-09-25 | Western Electric Company, Inc. | Soldering flux |
US4151015A (en) * | 1977-12-02 | 1979-04-24 | Lake Chemical Company | Flux for use in soldering |
-
1983
- 1983-06-01 JP JP58095745A patent/JPS59222591A/ja active Granted
-
1984
- 1984-05-25 US US06/614,737 patent/US4533404A/en not_active Expired - Lifetime
- 1984-05-29 EP EP84303590A patent/EP0127993B1/de not_active Expired
- 1984-05-29 DE DE8484303590T patent/DE3480770D1/de not_active Expired - Lifetime
- 1984-05-29 AT AT84303590T patent/ATE48779T1/de active
Also Published As
Publication number | Publication date |
---|---|
DE3480770D1 (de) | 1990-01-25 |
JPS59222591A (ja) | 1984-12-14 |
EP0127993B1 (de) | 1989-12-20 |
US4533404A (en) | 1985-08-06 |
EP0127993A3 (en) | 1986-06-11 |
JPH0357197B2 (de) | 1991-08-30 |
EP0127993A2 (de) | 1984-12-12 |
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