ATE485536T1 - THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY) - Google Patents
THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY)Info
- Publication number
- ATE485536T1 ATE485536T1 AT05771292T AT05771292T ATE485536T1 AT E485536 T1 ATE485536 T1 AT E485536T1 AT 05771292 T AT05771292 T AT 05771292T AT 05771292 T AT05771292 T AT 05771292T AT E485536 T1 ATE485536 T1 AT E485536T1
- Authority
- AT
- Austria
- Prior art keywords
- chip
- ink
- deposition
- dpn
- dip
- Prior art date
Links
Abstract
PROBLEM TO BE SOLVED: To provide a device capable of depositing ink in a vacuum without the risk of contamination using a fine chip, capable of changing a deposition rate without cutting-off the chip with a substrate, further capable of making the deposition of ink on-off, and capable of obtaining high spatial resolution.SOLUTION: Ink 20 coated on the surface of a chip 10 formed on a cantilever 40 is contacted with a substrate 30. The chip 10 is actually very small to the cantilever 40. Since the chip 10 is heated with a resistivity element 60, a heating element 50 is fitted to the cantilever 40. The deposition of the ink 20 to the substrate 30 is made on-off by increasing the temperature of the tip of the chip 10 to the melting temperature of the ink 20 or higher by heating or stopping the heating and decreasing the temperature to the melting temperature of the ink 20 or lower.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60351804P | 2004-08-18 | 2004-08-18 | |
US10/956,596 US7541062B2 (en) | 2004-08-18 | 2004-09-29 | Thermal control of deposition in dip pen nanolithography |
PCT/US2005/015966 WO2006036217A2 (en) | 2004-08-18 | 2005-05-10 | Thermal control of deposition in dip pen nanolithography |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE485536T1 true ATE485536T1 (en) | 2010-11-15 |
Family
ID=43028828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05771292T ATE485536T1 (en) | 2004-08-18 | 2005-05-10 | THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY) |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5867970B2 (en) |
AT (1) | ATE485536T1 (en) |
DE (1) | DE602005024312D1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997034122A1 (en) * | 1996-03-13 | 1997-09-18 | International Business Machines Corporation | Cantilever structures |
US6635311B1 (en) * | 1999-01-07 | 2003-10-21 | Northwestern University | Methods utilizing scanning probe microscope tips and products therefor or products thereby |
KR100389903B1 (en) * | 2000-12-01 | 2003-07-04 | 삼성전자주식회사 | Mass data storage and the method of writing and reading therof by contact resitance measurement |
AU2003287618A1 (en) * | 2002-11-12 | 2004-06-03 | Nanoink, Inc. | Methods and apparatus for ink delivery to nanolithographic probe systems |
-
2005
- 2005-05-10 AT AT05771292T patent/ATE485536T1/en not_active IP Right Cessation
- 2005-05-10 DE DE602005024312T patent/DE602005024312D1/en active Active
-
2014
- 2014-07-07 JP JP2014139896A patent/JP5867970B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5867970B2 (en) | 2016-02-24 |
JP2015006726A (en) | 2015-01-15 |
DE602005024312D1 (en) | 2010-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1229571A4 (en) | Hot plate | |
DE602005021808D1 (en) | METHOD OF MANUFACTURING A LIGHT-EMITTING DEVICE WITH SEMICONDUCTOR ANOKRISTALS | |
CN109580723B (en) | Preparation method of flexible humidity sensor and product | |
EP2233599A3 (en) | Method for microstructure control of ceramic thermally sprayed coatings | |
TW201041114A (en) | Substrate fitted with sensor and method for manufacturing substrate fitted with sensor | |
MY122886A (en) | Method and materials for patterning of an amorphous, non-polymeric, organic matrix with electrically active material disposed therein. | |
DE69801987D1 (en) | SUSZEPTOR VERSIONS FOR SILICON CARBIDE THIN LAYERS | |
WO2002009171A1 (en) | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober | |
WO2007141668A3 (en) | Indirectly heated capillary aerosol generator | |
WO2002019400A1 (en) | Ceramic heater for semiconductor manufacturing and inspecting equipment | |
CA2471268A1 (en) | Method for the production of an electrically conductive resistive layer and heating and/or cooling device | |
JP2000236015A5 (en) | ||
ATE224045T1 (en) | PLANT TEMPERATURE SENSOR AND PROCESS FOR PRODUCTION THEREOF | |
TW200625517A (en) | Gradient deposition of low-k CVD materials | |
ATE409860T1 (en) | GAS SENSOR WITH A THIN SEMICONDUCTIVE LAYER | |
WO2006061784A3 (en) | Substrate temperature control for combustion chemical vapor deposition | |
ATE485536T1 (en) | THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY) | |
ATE463837T1 (en) | INLINE HEATING ELEMENT FOR USE IN SEMICONDUCTOR CHEMICAL WET MACHINING AND PRODUCTION PROCESS THEREOF | |
JP2012516064A5 (en) | ||
WO2008129738A1 (en) | Patterning method and method for fabricating electronic element | |
ATE492027T1 (en) | ELECTRICAL DEVICE COMPRISING A HEAT GENERATING ELECTRICAL RESISTANCE ELEMENT AND HEAT DISSIPATION MEANS THEREOF | |
FR2912505B1 (en) | METHOD FOR MANUFACTURING CONTACT TEMPERATURE SENSOR AND METHOD FOR CALIBRATING SENSOR THEREFOR. | |
SE0401499D0 (en) | Coated member and method of manufacture | |
CN206486584U (en) | A kind of linear evaporation source and vacuum deposition apparatus | |
ATE249639T1 (en) | ARRANGEMENT FOR TEMPERATURE MEASUREMENT AND CONTROL |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |