ATE453203T1 - METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS - Google Patents

METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS

Info

Publication number
ATE453203T1
ATE453203T1 AT03746707T AT03746707T ATE453203T1 AT E453203 T1 ATE453203 T1 AT E453203T1 AT 03746707 T AT03746707 T AT 03746707T AT 03746707 T AT03746707 T AT 03746707T AT E453203 T1 ATE453203 T1 AT E453203T1
Authority
AT
Austria
Prior art keywords
carbon nanotubes
metallized carbon
methods
metallization
carbon nanotube
Prior art date
Application number
AT03746707T
Other languages
German (de)
Inventor
Dongsheng Mao
Zvi Yaniv
Richard Fink
Original Assignee
Applied Nanotech Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/372,006 external-priority patent/US20040018371A1/en
Priority claimed from US10/406,928 external-priority patent/US6975063B2/en
Application filed by Applied Nanotech Holdings Inc filed Critical Applied Nanotech Holdings Inc
Application granted granted Critical
Publication of ATE453203T1 publication Critical patent/ATE453203T1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1644Composition of the substrate porous substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/022Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/025Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00Electrodes common to discharge tubes
    • H01J2201/30Cold cathodes
    • H01J2201/304Field emission cathodes
    • H01J2201/30446Field emission cathodes characterised by the emitter material
    • H01J2201/30453Carbon types
    • H01J2201/30469Carbon nanotubes (CNTs)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Physics & Mathematics (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Chemically Coating (AREA)

Abstract

The present invention is directed towards metallized carbon nanotubes, methods for making metallized carbon nanotubes using an electroless plating technique, methods for dispensing metallized carbon nanotubes onto a substrate, and methods for aligning magnetically-active metallized carbon nanotubes. The present invention is also directed towards cold cathode field emitting materials comprising metallized carbon nanotubes, and methods of using metallized carbon nanotubes as cold cathode field emitters.
AT03746707T 2002-04-12 2003-04-11 METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS ATE453203T1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37206702P 2002-04-12 2002-04-12
US41724602P 2002-10-09 2002-10-09
US10/372,006 US20040018371A1 (en) 2002-04-12 2003-02-21 Metallization of carbon nanotubes for field emission applications
US10/406,928 US6975063B2 (en) 2002-04-12 2003-04-04 Metallization of carbon nanotubes for field emission applications
PCT/US2003/011053 WO2003087707A2 (en) 2002-04-12 2003-04-11 Metallization of carbon nanotubes for field emission applications

Publications (1)

Publication Number Publication Date
ATE453203T1 true ATE453203T1 (en) 2010-01-15

Family

ID=46123439

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03746707T ATE453203T1 (en) 2002-04-12 2003-04-11 METALLIZATION OF CARBON NANOTUBE FOR FIELD EMISSION APPLICATIONS

Country Status (4)

Country Link
JP (1) JP4727928B2 (en)
KR (1) KR100836538B1 (en)
CN (1) CN1732549B (en)
AT (1) ATE453203T1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261108A (en) * 2005-02-17 2006-09-28 Sonac Kk Cold-cathode electron source, its manufacturing method and display device
KR100688860B1 (en) * 2005-08-08 2007-03-02 삼성전기주식회사 Method for manufacturing a Field Emission Array
KR100749886B1 (en) * 2006-02-03 2007-08-21 (주) 나노텍 Heating element using Carbon Nano tube
JP4662877B2 (en) * 2006-03-29 2011-03-30 国立大学法人福井大学 Composite material and method for producing the same
KR100781190B1 (en) * 2006-06-13 2007-11-30 인하대학교 산학협력단 System for separating carbon nano-tube using inducing current and method thereof
CN101105488B (en) * 2006-07-14 2011-01-26 鸿富锦精密工业(深圳)有限公司 Work function measuring method
KR20080013366A (en) * 2006-08-08 2008-02-13 한국과학기술원 Method for manufacturing a field emitter electrode using the array of nanowires
KR100795903B1 (en) * 2006-08-10 2008-01-21 세메스 주식회사 Apparatus for trapping carbon nano tube and system and method producting carbon nano tube
KR101328765B1 (en) * 2006-12-29 2013-11-13 엘지디스플레이 주식회사 Nano powder patterning method
KR101281168B1 (en) 2007-01-05 2013-07-02 삼성전자주식회사 Field emission electrode, method for preparing the same and field emission device comprising the same
JP2009073692A (en) * 2007-09-20 2009-04-09 Toyota Motor Corp Carbon nanotube and its manufacturing method
JP5564508B2 (en) 2008-09-12 2014-07-30 エルジー・ケム・リミテッド Metal nanobelt, method for producing the same, conductive ink composition containing the same, and conductive film
KR101078079B1 (en) 2008-12-10 2011-10-28 엘에스전선 주식회사 Conductive Paste Containing Silver-Decorated Carbon Nanotubes
JP5551898B2 (en) * 2009-06-30 2014-07-16 京セラドキュメントソリューションズ株式会社 Manufacturing method of heating belt
KR101724064B1 (en) 2010-02-18 2017-04-10 삼성전자주식회사 Conductive carbon nanotube-metal composite ink
JP2012040664A (en) * 2010-08-23 2012-03-01 Nitto Denko Corp Fibrous columnar structure aggregate and adhesive member
CN102568977B (en) * 2012-03-16 2015-02-04 福州大学 Method for preparing metallized carbon nanotube cathode by electrophoretic deposition in assistance of magnetic field
JP6415540B2 (en) * 2013-04-21 2018-10-31 シェンジェン シェン ルイ グラフィン テクノロジー カンパニー リミテッド Carbon nanomaterial coating method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2546114B2 (en) * 1992-12-22 1996-10-23 日本電気株式会社 Foreign substance-encapsulated carbon nanotubes and method for producing the same
US6630772B1 (en) * 1998-09-21 2003-10-07 Agere Systems Inc. Device comprising carbon nanotube field emitter structure and process for forming device
JP2000233911A (en) * 1999-02-12 2000-08-29 Namiki Precision Jewel Co Ltd Method for processing carbon nanotube
US6504292B1 (en) * 1999-07-15 2003-01-07 Agere Systems Inc. Field emitting device comprising metallized nanostructures and method for making the same
US6741019B1 (en) * 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
JP2002056770A (en) * 2000-08-08 2002-02-22 Futaba Corp Electric field emission cathode and its manufacturing method
US6566983B2 (en) * 2000-09-02 2003-05-20 Lg Electronics Inc. Saw filter using a carbon nanotube and method for manufacturing the same
JP3573273B2 (en) * 2000-09-26 2004-10-06 シャープ株式会社 Electron emitting device and method of manufacturing the same

Also Published As

Publication number Publication date
CN1732549A (en) 2006-02-08
JP2005532915A (en) 2005-11-04
KR20040101280A (en) 2004-12-02
CN1732549B (en) 2010-11-10
JP4727928B2 (en) 2011-07-20
KR100836538B1 (en) 2008-06-10

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