ATE445909T1 - CONTACTLESS TRANSPORT DEVICE - Google Patents

CONTACTLESS TRANSPORT DEVICE

Info

Publication number
ATE445909T1
ATE445909T1 AT01306016T AT01306016T ATE445909T1 AT E445909 T1 ATE445909 T1 AT E445909T1 AT 01306016 T AT01306016 T AT 01306016T AT 01306016 T AT01306016 T AT 01306016T AT E445909 T1 ATE445909 T1 AT E445909T1
Authority
AT
Austria
Prior art keywords
recess
inner peripheral
peripheral surface
transport device
transfer device
Prior art date
Application number
AT01306016T
Other languages
German (de)
Inventor
Hitoshi Iwasaka
Hideyuki Tokunaga
Original Assignee
Harmotec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001044173A external-priority patent/JP3981241B2/en
Application filed by Harmotec Corp filed Critical Harmotec Corp
Application granted granted Critical
Publication of ATE445909T1 publication Critical patent/ATE445909T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Abstract

PURPOSE: To provide a non-contact transfer device which can reduce its manufacturing cost, can be easily miniaturized, can expand its field of action, and can realize also its energy saving. CONSTITUTION: This non-contact transfer device 1 is a device which holds an object 9 in a non-contact state and transfers the object. The device 1 is provided with a recess 3 with the inner peripheral surface formed into a circular shape or a polygonal shape, a flat end surface 2b which is formed on the side of an aperture provided in the recess 3 and opposes to the object 9, and a fluid passage 5 which discharges a feeding fluid from a jet hole 4 facing the inner peripheral surface of the recess 3 to the interior of the recess 3 along the inner peripheral direction of the recess 3.
AT01306016T 2001-02-20 2001-07-12 CONTACTLESS TRANSPORT DEVICE ATE445909T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001044173A JP3981241B2 (en) 2000-06-09 2001-02-20 Swirl flow forming body and non-contact transfer device

Publications (1)

Publication Number Publication Date
ATE445909T1 true ATE445909T1 (en) 2009-10-15

Family

ID=18906206

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01306016T ATE445909T1 (en) 2001-02-20 2001-07-12 CONTACTLESS TRANSPORT DEVICE

Country Status (4)

Country Link
KR (1) KR100630360B1 (en)
AT (1) ATE445909T1 (en)
DE (1) DE60140172D1 (en)
TW (1) TW500651B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100859835B1 (en) * 2008-05-13 2008-09-23 한국뉴매틱(주) Non-contact vacuum pads
US8905680B2 (en) * 2011-10-31 2014-12-09 Masahiro Lee Ultrathin wafer transport systems
KR101258405B1 (en) * 2012-01-19 2013-04-26 로체 시스템즈(주) Apparatus for conveyance of glass disk
KR101423822B1 (en) * 2012-06-28 2014-07-28 세메스 주식회사 Contactless chuck for transferring a wafer
TWI569355B (en) * 2014-07-23 2017-02-01 Harmotec Co Ltd Control device and control method
KR102053435B1 (en) * 2019-08-12 2019-12-06 주식회사 디에스이엔티 Printed Circuit Board Loading Device for Automatic Reversing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6353945A (en) * 1986-08-25 1988-03-08 Hitachi Ltd Delivery mechanism
JPH0346250A (en) * 1989-07-14 1991-02-27 Kawasaki Steel Corp Wafer transfer device
JPH04341438A (en) * 1991-05-16 1992-11-27 Toshiba Corp Noncontact handling device
JPH0722175B2 (en) * 1991-05-24 1995-03-08 九州電子金属株式会社 Non-contact transfer device for semiconductor substrate
JP2000511354A (en) * 1996-05-31 2000-08-29 アイペック・プリシジョン・インコーポレーテッド Non-contact cage for wafer-like articles
JP3725615B2 (en) * 1996-06-21 2005-12-14 大日本スクリーン製造株式会社 Substrate processing equipment
JP3445138B2 (en) * 1998-03-06 2003-09-08 株式会社西部技研 Non-contact transfer device
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods

Also Published As

Publication number Publication date
TW500651B (en) 2002-09-01
KR100630360B1 (en) 2006-09-29
DE60140172D1 (en) 2009-11-26
KR20020068245A (en) 2002-08-27

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties