ATE445231T1 - Wafer mit verbesserten leitenden schleifen im ritzrahmen - Google Patents
Wafer mit verbesserten leitenden schleifen im ritzrahmenInfo
- Publication number
- ATE445231T1 ATE445231T1 AT05772266T AT05772266T ATE445231T1 AT E445231 T1 ATE445231 T1 AT E445231T1 AT 05772266 T AT05772266 T AT 05772266T AT 05772266 T AT05772266 T AT 05772266T AT E445231 T1 ATE445231 T1 AT E445231T1
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- ritting
- frame
- protecting
- conductive loop
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Semiconductor Integrated Circuits (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04103570 | 2004-07-26 | ||
| PCT/IB2005/052428 WO2006013508A2 (en) | 2004-07-26 | 2005-07-20 | Wafer with improved conductive loops in the dicing lines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE445231T1 true ATE445231T1 (de) | 2009-10-15 |
Family
ID=35583335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05772266T ATE445231T1 (de) | 2004-07-26 | 2005-07-20 | Wafer mit verbesserten leitenden schleifen im ritzrahmen |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7576412B2 (de) |
| EP (1) | EP1774587B1 (de) |
| JP (1) | JP2008507852A (de) |
| KR (1) | KR20070038549A (de) |
| CN (1) | CN101006578B (de) |
| AT (1) | ATE445231T1 (de) |
| DE (1) | DE602005017045D1 (de) |
| WO (1) | WO2006013508A2 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101689541B (zh) | 2007-07-12 | 2012-01-25 | Nxp股份有限公司 | 晶片上的集成电路和制造集成电路的方法 |
| US10896878B2 (en) * | 2019-06-18 | 2021-01-19 | Nxp B.V. | Integrated circuit saw bow break point |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5596226A (en) * | 1994-09-06 | 1997-01-21 | International Business Machines Corporation | Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module |
| EP0843476A1 (de) | 1996-11-19 | 1998-05-20 | Deutsche Thomson-Brandt Gmbh | Verfahren und Dekoder zur Datenverarbeitung in Teletextseiten |
| JPH10163522A (ja) * | 1996-11-29 | 1998-06-19 | Kyocera Corp | Ｌｅｄアレイの製造方法 |
| JP3410371B2 (ja) * | 1998-08-18 | 2003-05-26 | リンテック株式会社 | ウエハ裏面研削時の表面保護シートおよびその利用方法 |
| CN1322574C (zh) * | 1999-07-30 | 2007-06-20 | 日本板硝子株式会社 | 在切割区中设置的槽的结构及其应用 |
| JP3339485B2 (ja) * | 2000-01-24 | 2002-10-28 | 日本電気株式会社 | 半導体装置 |
| ATE334479T1 (de) * | 2000-07-21 | 2006-08-15 | Koninkl Philips Electronics Nv | VERFAHREN ZUR HERSTELLUNG INTEGRIERTER SCHALTUNGEN MIT VERBESSERTEN LEITERBAHNEN IN SOGENANNTER ßSÄGEBÜGELß-FORM |
| US6492247B1 (en) * | 2000-11-21 | 2002-12-10 | International Business Machines Corporation | Method for eliminating crack damage induced by delaminating gate conductor interfaces in integrated circuits |
| JP4405719B2 (ja) * | 2002-10-17 | 2010-01-27 | 株式会社ルネサステクノロジ | 半導体ウエハ |
-
2005
- 2005-07-20 WO PCT/IB2005/052428 patent/WO2006013508A2/en active Application Filing
- 2005-07-20 EP EP05772266A patent/EP1774587B1/de not_active Not-in-force
- 2005-07-20 US US11/572,753 patent/US7576412B2/en active Active
- 2005-07-20 CN CN2005800251884A patent/CN101006578B/zh not_active Expired - Fee Related
- 2005-07-20 AT AT05772266T patent/ATE445231T1/de not_active IP Right Cessation
- 2005-07-20 JP JP2007523209A patent/JP2008507852A/ja not_active Withdrawn
- 2005-07-20 DE DE602005017045T patent/DE602005017045D1/de active Active
- 2005-07-20 KR KR1020077003156A patent/KR20070038549A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1774587B1 (de) | 2009-10-07 |
| US7576412B2 (en) | 2009-08-18 |
| JP2008507852A (ja) | 2008-03-13 |
| CN101006578A (zh) | 2007-07-25 |
| EP1774587A2 (de) | 2007-04-18 |
| DE602005017045D1 (de) | 2009-11-19 |
| CN101006578B (zh) | 2010-06-23 |
| WO2006013508A3 (en) | 2006-04-06 |
| US20080001259A1 (en) | 2008-01-03 |
| KR20070038549A (ko) | 2007-04-10 |
| WO2006013508A2 (en) | 2006-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |