ATE407098T1 - METHOD FOR PRODUCING PATTERNS ON A SUBSTRATE SURFACE - Google Patents
METHOD FOR PRODUCING PATTERNS ON A SUBSTRATE SURFACEInfo
- Publication number
- ATE407098T1 ATE407098T1 AT04770195T AT04770195T ATE407098T1 AT E407098 T1 ATE407098 T1 AT E407098T1 AT 04770195 T AT04770195 T AT 04770195T AT 04770195 T AT04770195 T AT 04770195T AT E407098 T1 ATE407098 T1 AT E407098T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- elastomeric stamp
- ink
- protruding features
- contact
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
- B05D1/283—Transferring monomolecular layers or solutions of molecules adapted for forming monomolecular layers from carrying elements
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
An elastomeric stamp has a bulk surface from which protruding features extend. A barrier layer covers the bulk surface and the protruding features. After applying an ink solution to the elastomeric stamp and drying the elastomeric stamp, the elastomeric stamp is brought into contact with a surface of a first substrate. The surface of the first substrate has a high affinity with the ink molecules, which is utilized to effectively remove the ink molecules from the contact surfaces of the protruding features. Subsequently, the elastomeric stamp is brought into contact with the surface of a second substrate. Ink molecules are transferred from the edges of the protruding features to the surface of a second substrate, thus forming an ink pattern in the form of a self assembled monolayer on this surface.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0323902.7A GB0323902D0 (en) | 2003-10-11 | 2003-10-11 | Method for patterning a substrate surface |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE407098T1 true ATE407098T1 (en) | 2008-09-15 |
Family
ID=29433771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04770195T ATE407098T1 (en) | 2003-10-11 | 2004-10-07 | METHOD FOR PRODUCING PATTERNS ON A SUBSTRATE SURFACE |
Country Status (10)
Country | Link |
---|---|
US (1) | US8714082B2 (en) |
EP (1) | EP1675802B1 (en) |
JP (1) | JP4649412B2 (en) |
KR (1) | KR101098317B1 (en) |
CN (1) | CN1863729B (en) |
AT (1) | ATE407098T1 (en) |
DE (1) | DE602004016360D1 (en) |
GB (1) | GB0323902D0 (en) |
TW (1) | TWI362687B (en) |
WO (1) | WO2005035438A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0323903D0 (en) * | 2003-10-11 | 2003-11-12 | Koninkl Philips Electronics Nv | Elastomeric stamp,patterning method using such a stamp and method for producing such a stamp |
US7632087B2 (en) * | 2003-12-19 | 2009-12-15 | Wd Media, Inc. | Composite stamper for imprint lithography |
KR100784827B1 (en) * | 2006-12-29 | 2007-12-14 | 한국기계연구원 | Imprinting apparatus for making uniform contact between stamp and wafer and/or substract |
EP3614418B1 (en) | 2008-02-28 | 2023-11-01 | 3M Innovative Properties Company | Touch screen sensor |
JP2011514597A (en) | 2008-02-28 | 2011-05-06 | スリーエム イノベイティブ プロパティズ カンパニー | Touch screen sensor with varying sheet resistance |
JP2011517367A (en) | 2008-02-28 | 2011-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | Method for patterning a conductor on a substrate |
KR101397200B1 (en) | 2008-02-28 | 2014-05-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Touch screen sensor with low visibility conductors |
US8284332B2 (en) | 2008-08-01 | 2012-10-09 | 3M Innovative Properties Company | Touch screen sensor with low visibility conductors |
KR20100046778A (en) * | 2008-10-28 | 2010-05-07 | 삼성전자주식회사 | Printing mold, manufacturing method using the same and fabricating method of thin film using the same |
CN102803562B (en) * | 2009-06-25 | 2015-09-30 | 3M创新有限公司 | The method of Wet-type etching self-assembled monolayer patterned substrate and metal pattern goods |
JP2011054683A (en) * | 2009-08-31 | 2011-03-17 | Asahi Kasei E-Materials Corp | Method for manufacturing metal wiring board and metal wiring board |
JP5224203B1 (en) | 2012-07-11 | 2013-07-03 | 大日本印刷株式会社 | Touch panel sensor, touch panel device, and display device |
CN107175939B (en) * | 2016-03-09 | 2020-02-28 | 华邦电子股份有限公司 | Stamp for printed circuit manufacturing process, manufacturing method thereof and printed circuit manufacturing process |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6048623A (en) | 1996-12-18 | 2000-04-11 | Kimberly-Clark Worldwide, Inc. | Method of contact printing on gold coated films |
US6517995B1 (en) * | 1999-09-14 | 2003-02-11 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
US6380101B1 (en) * | 2000-04-18 | 2002-04-30 | International Business Machines Corporation | Method of forming patterned indium zinc oxide and indium tin oxide films via microcontact printing and uses thereof |
US7476523B2 (en) * | 2000-08-14 | 2009-01-13 | Surface Logix, Inc. | Method of patterning a surface using a deformable stamp |
US6596346B2 (en) * | 2000-09-29 | 2003-07-22 | International Business Machines Corporation | Silicone elastomer stamp with hydrophilic surfaces and method of making same |
GB0105145D0 (en) * | 2001-03-02 | 2001-04-18 | Koninkl Philips Electronics Nv | Thin film transistors and method of manufacture |
US20050120902A1 (en) * | 2001-04-25 | 2005-06-09 | David Adams | Edge transfer lithography |
US7338613B2 (en) * | 2001-09-10 | 2008-03-04 | Surface Logix, Inc. | System and process for automated microcontact printing |
US6860956B2 (en) * | 2003-05-23 | 2005-03-01 | Agency For Science, Technology & Research | Methods of creating patterns on substrates and articles of manufacture resulting therefrom |
-
2003
- 2003-10-11 GB GBGB0323902.7A patent/GB0323902D0/en not_active Ceased
-
2004
- 2004-10-07 AT AT04770195T patent/ATE407098T1/en not_active IP Right Cessation
- 2004-10-07 KR KR1020067006964A patent/KR101098317B1/en active IP Right Grant
- 2004-10-07 DE DE602004016360T patent/DE602004016360D1/en active Active
- 2004-10-07 US US10/575,437 patent/US8714082B2/en active Active
- 2004-10-07 JP JP2006530986A patent/JP4649412B2/en active Active
- 2004-10-07 WO PCT/IB2004/052009 patent/WO2005035438A1/en active IP Right Grant
- 2004-10-07 CN CN2004800295784A patent/CN1863729B/en active Active
- 2004-10-07 EP EP04770195A patent/EP1675802B1/en active Active
- 2004-10-08 TW TW093130627A patent/TWI362687B/en active
Also Published As
Publication number | Publication date |
---|---|
CN1863729A (en) | 2006-11-15 |
DE602004016360D1 (en) | 2008-10-16 |
JP2007508453A (en) | 2007-04-05 |
US8714082B2 (en) | 2014-05-06 |
GB0323902D0 (en) | 2003-11-12 |
KR20060126953A (en) | 2006-12-11 |
TWI362687B (en) | 2012-04-21 |
CN1863729B (en) | 2010-06-16 |
EP1675802B1 (en) | 2008-09-03 |
EP1675802A1 (en) | 2006-07-05 |
US20070125255A1 (en) | 2007-06-07 |
JP4649412B2 (en) | 2011-03-09 |
TW200524000A (en) | 2005-07-16 |
KR101098317B1 (en) | 2011-12-26 |
WO2005035438A1 (en) | 2005-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |