ATE399146T1 - METHOD FOR GENERATING A PREFINED INTERNAL PRESSURE IN A CAVITY OF A SEMICONDUCTOR COMPONENT - Google Patents
METHOD FOR GENERATING A PREFINED INTERNAL PRESSURE IN A CAVITY OF A SEMICONDUCTOR COMPONENTInfo
- Publication number
- ATE399146T1 ATE399146T1 AT06700450T AT06700450T ATE399146T1 AT E399146 T1 ATE399146 T1 AT E399146T1 AT 06700450 T AT06700450 T AT 06700450T AT 06700450 T AT06700450 T AT 06700450T AT E399146 T1 ATE399146 T1 AT E399146T1
- Authority
- AT
- Austria
- Prior art keywords
- semiconductor device
- cavity
- internal pressure
- temperature
- prefined
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Gyroscopes (AREA)
- Micromachines (AREA)
Abstract
A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005001449A DE102005001449B3 (en) | 2005-01-12 | 2005-01-12 | A method for generating a predetermined internal pressure in a cavity of a semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE399146T1 true ATE399146T1 (en) | 2008-07-15 |
Family
ID=36001141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06700450T ATE399146T1 (en) | 2005-01-12 | 2006-01-04 | METHOD FOR GENERATING A PREFINED INTERNAL PRESSURE IN A CAVITY OF A SEMICONDUCTOR COMPONENT |
Country Status (6)
Country | Link |
---|---|
US (1) | US7410828B2 (en) |
EP (1) | EP1836123B1 (en) |
JP (1) | JP4809848B2 (en) |
AT (1) | ATE399146T1 (en) |
DE (2) | DE102005001449B3 (en) |
WO (1) | WO2006074871A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2126155B1 (en) * | 2006-12-15 | 2019-03-13 | BAE Systems PLC | Improvements relating to thin film getter devices |
DE102007008518A1 (en) * | 2007-02-21 | 2008-08-28 | Infineon Technologies Ag | Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips |
US7557417B2 (en) | 2007-02-21 | 2009-07-07 | Infineon Technologies Ag | Module comprising a semiconductor chip comprising a movable element |
JP5096761B2 (en) * | 2007-02-23 | 2012-12-12 | パナソニック株式会社 | Manufacturing method of vacuum sealing device |
JP4370339B2 (en) * | 2007-03-23 | 2009-11-25 | Okiセミコンダクタ株式会社 | Manufacturing method of MEMS vibrator and MEMS vibrator |
DE102008042347B4 (en) * | 2008-09-25 | 2016-11-10 | Robert Bosch Gmbh | Micromechanical sensor and method for its production |
US9870968B2 (en) | 2011-10-27 | 2018-01-16 | Global Circuit Innovations Incorporated | Repackaged integrated circuit and assembly method |
US10147660B2 (en) | 2011-10-27 | 2018-12-04 | Global Circuits Innovations, Inc. | Remapped packaged extracted die with 3D printed bond connections |
US9935028B2 (en) | 2013-03-05 | 2018-04-03 | Global Circuit Innovations Incorporated | Method and apparatus for printing integrated circuit bond connections |
US9966319B1 (en) | 2011-10-27 | 2018-05-08 | Global Circuit Innovations Incorporated | Environmental hardening integrated circuit method and apparatus |
US10128161B2 (en) | 2011-10-27 | 2018-11-13 | Global Circuit Innovations, Inc. | 3D printed hermetic package assembly and method |
US10109606B2 (en) | 2011-10-27 | 2018-10-23 | Global Circuit Innovations, Inc. | Remapped packaged extracted die |
US10002846B2 (en) | 2011-10-27 | 2018-06-19 | Global Circuit Innovations Incorporated | Method for remapping a packaged extracted die with 3D printed bond connections |
US10177054B2 (en) | 2011-10-27 | 2019-01-08 | Global Circuit Innovations, Inc. | Method for remapping a packaged extracted die |
FR2994332B1 (en) | 2012-07-31 | 2015-05-15 | Commissariat Energie Atomique | METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE |
EP2883242A1 (en) | 2012-08-10 | 2015-06-17 | Gottfried Wilhelm Leibniz Universität Hannover | Method for producing a hermetically sealed housing |
US8748205B1 (en) * | 2012-11-30 | 2014-06-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS structure with adaptable inter-substrate bond |
FR3005648B1 (en) * | 2013-05-15 | 2016-02-12 | Commissariat Energie Atomique | METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE COMPRISING A NOVEL GAS INJECTION THROUGH A MATERIAL PERMEABLE TO THIS NOBLE GAS |
EP2871152B1 (en) * | 2013-11-06 | 2017-05-24 | Sensirion AG | Sensor device |
FR3028508B1 (en) | 2014-11-13 | 2016-12-30 | Commissariat Energie Atomique | ENCAPSULATION STRUCTURE COMPRISING A CAVITY COUPLED WITH A GAS INJECTION CHANNEL FORMED BY A PERMEABLE MATERIAL |
FR3047842B1 (en) * | 2016-02-12 | 2018-05-18 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | ELECTRONIC COMPONENT WITH METALLIC RESISTANCE SUSPENDED IN A CLOSED CAVITY |
US10115645B1 (en) | 2018-01-09 | 2018-10-30 | Global Circuit Innovations, Inc. | Repackaged reconditioned die method and assembly |
DE102018221108A1 (en) | 2018-12-06 | 2020-06-10 | Robert Bosch Gmbh | Method for setting a pressure in a cavern formed with the aid of a substrate and a substrate cap, semiconductor system, in particular wafer system |
DE102020104613A1 (en) | 2020-02-21 | 2021-08-26 | Schott Ag | Hermetically sealed glass casing |
US11508680B2 (en) | 2020-11-13 | 2022-11-22 | Global Circuit Innovations Inc. | Solder ball application for singular die |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL230797A (en) * | 1957-10-01 | |||
US4975390A (en) | 1986-12-18 | 1990-12-04 | Nippondenso Co. Ltd. | Method of fabricating a semiconductor pressure sensor |
US5323051A (en) * | 1991-12-16 | 1994-06-21 | Motorola, Inc. | Semiconductor wafer level package |
DE19648759A1 (en) | 1996-11-25 | 1998-05-28 | Max Planck Gesellschaft | Method of manufacturing microstructures |
DE19651384A1 (en) * | 1996-12-11 | 1998-06-18 | Bosch Gmbh Robert | Packaging seal verification method with acceleration or rotation sensor |
DE19739961C1 (en) * | 1997-09-11 | 1999-04-15 | Siemens Ag | Gas pressure determining method for cavity of semiconductor micro-m-mechanical sensor chamber with deformable wall of semiconductor component |
US6467354B1 (en) * | 1998-09-08 | 2002-10-22 | Silicon Microstructures, Inc. | Anodically bonded, gas impervious cavity structures fabricated in silicon |
DE19961578A1 (en) | 1999-12-21 | 2001-06-28 | Bosch Gmbh Robert | Sensor comprises a micromechanical structure based on silicon integrated in the sensor chamber of a base wafer and a cover made of a transparent deposition layer and a sealing layer |
US6969667B2 (en) * | 2002-04-01 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Electrical device and method of making |
JP4515261B2 (en) | 2002-08-29 | 2010-07-28 | ノーコム システムズ インク. | System and process for detecting leakage of seal products |
US6929974B2 (en) * | 2002-10-18 | 2005-08-16 | Motorola, Inc. | Feedthrough design and method for a hermetically sealed microdevice |
ITMI20030069A1 (en) * | 2003-01-17 | 2004-07-18 | Getters Spa | MICROMECHANICAL OR MICROOPTOELECTRONIC DEVICES WITH STORAGE OF GETTER MATERIAL AND INTEGRATED HEATER. |
US7482193B2 (en) * | 2004-12-20 | 2009-01-27 | Honeywell International Inc. | Injection-molded package for MEMS inertial sensor |
-
2005
- 2005-01-12 DE DE102005001449A patent/DE102005001449B3/en active Active
-
2006
- 2006-01-04 EP EP06700450A patent/EP1836123B1/en active Active
- 2006-01-04 JP JP2007550731A patent/JP4809848B2/en active Active
- 2006-01-04 WO PCT/EP2006/000040 patent/WO2006074871A1/en active IP Right Grant
- 2006-01-04 DE DE502006000989T patent/DE502006000989D1/en active Active
- 2006-01-04 AT AT06700450T patent/ATE399146T1/en active
-
2007
- 2007-07-12 US US11/777,162 patent/US7410828B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20070259470A1 (en) | 2007-11-08 |
EP1836123B1 (en) | 2008-06-25 |
EP1836123A1 (en) | 2007-09-26 |
JP2008527730A (en) | 2008-07-24 |
DE102005001449B3 (en) | 2006-07-20 |
JP4809848B2 (en) | 2011-11-09 |
US7410828B2 (en) | 2008-08-12 |
WO2006074871A1 (en) | 2006-07-20 |
DE502006000989D1 (en) | 2008-08-07 |
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