ATE371266T1 - IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH - Google Patents

IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH

Info

Publication number
ATE371266T1
ATE371266T1 AT00870141T AT00870141T ATE371266T1 AT E371266 T1 ATE371266 T1 AT E371266T1 AT 00870141 T AT00870141 T AT 00870141T AT 00870141 T AT00870141 T AT 00870141T AT E371266 T1 ATE371266 T1 AT E371266T1
Authority
AT
Austria
Prior art keywords
metal
containing layer
plating bath
quality
improvement
Prior art date
Application number
AT00870141T
Other languages
German (de)
Inventor
Sywert H Brongersma
Emmanuel Richard
Iwan Vervoort
Karen Maex
Original Assignee
Imec Inter Uni Micro Electr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP99870194A external-priority patent/EP1087432A1/en
Application filed by Imec Inter Uni Micro Electr filed Critical Imec Inter Uni Micro Electr
Application granted granted Critical
Publication of ATE371266T1 publication Critical patent/ATE371266T1/en

Links

Abstract

PROBLEM TO BE SOLVED: To improve the quality of a metal layer deposited from a plating bath. SOLUTION: A method for depositing a film containing such metal as Cu and Co from a metal plating bath on a substrate having at least one hole in an insulation layer comprises a step of depositing a metal-containing layer until the hole is substantially filled, a step of executing a heating step and/or a vacuum step on the deposited metal-containing layer, and a step of depositing a metal-containing layer from a metal plating bath on the deposited metal- containing layer. By including the heating step and/or the vacuum step, impurities included in the metal deposition film or attaching to the surface of the film can be eliminated.
AT00870141T 1999-06-22 2000-06-22 IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH ATE371266T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14048499P 1999-06-22 1999-06-22
EP99870194A EP1087432A1 (en) 1999-09-24 1999-09-24 A method for improving the quality of a metal layer deposited from a plating bath

Publications (1)

Publication Number Publication Date
ATE371266T1 true ATE371266T1 (en) 2007-09-15

Family

ID=26153854

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00870141T ATE371266T1 (en) 1999-06-22 2000-06-22 IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH

Country Status (3)

Country Link
JP (1) JP4937437B2 (en)
AT (1) ATE371266T1 (en)
DE (1) DE60036052T2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4961185B2 (en) * 2006-09-28 2012-06-27 株式会社日立製作所 Manufacturing method of semiconductor device
US7843063B2 (en) 2008-02-14 2010-11-30 International Business Machines Corporation Microstructure modification in copper interconnect structure
JP5968657B2 (en) * 2012-03-22 2016-08-10 東京エレクトロン株式会社 Plating treatment method, plating treatment system, and storage medium

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3187011B2 (en) * 1998-08-31 2001-07-11 日本電気株式会社 Method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP2001118848A (en) 2001-04-27
JP4937437B2 (en) 2012-05-23
DE60036052T2 (en) 2008-05-08
DE60036052D1 (en) 2007-10-04

Similar Documents

Publication Publication Date Title
TW200506107A (en) Multiple-step electrodeposition process for direct copper plating on barrier metals
WO2007111676A3 (en) Method of direct plating of copper on a substrate structure
TW200513549A (en) Electroplating composite substrates
TW200644164A (en) Method for forming a barrier/seed layer for copper metallization
JP2003511858A5 (en)
ATE282248T1 (en) METHOD FOR GALVANICALLY FORMING CONDUCTOR STRUCTURES FROM HIGH PURITY COPPER IN THE PRODUCTION OF INTEGRATED CIRCUITS
KR20140033700A (en) Circuit board and method for preparing thereof
CA2292370A1 (en) Improved coating and method for minimizing consumption of base material during high temperature service
JP2004513221A5 (en)
US5391402A (en) Immersion plating of tin-bismuth solder
ATE371266T1 (en) IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH
UA91995C2 (en) Methods for application of metal coating on substrate by autocatalytic deposition, bath for implementation of methods and article with applied coating
DE60206012D1 (en) Method of making a T-shaped electrode
WO2000011233A3 (en) Fluxing process for galvanization of steel
WO2004050959A3 (en) Reduction of surface oxidation during electroplating
KR20010042625A (en) Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer
SG109558A1 (en) Method for removing a composite coating containing tantalum deposition and arc sprayed aluminum from ceramic substrates
AU2003292060A1 (en) Method for the electrolytic deposition of magnesium or magnesium-zinc on galvanised sheet metal
MY143782A (en) Method for coating substrates containing antimony compounds with tin and tin alloys
KR20100099234A (en) Method of metal coating and coating produced thereby
ATE378693T1 (en) METHOD FOR DEPOSING HIGH-QUALITY SEMICONDUCTOR LAYERS
WO2003085166A3 (en) Electroless deposition methods
JPH116047A (en) Base metal for hot dip zinc alloy coating bath, hot dip coating bath, hot dip zinc alloy coated steel and its production
KR100347664B1 (en) Producing method for outer skin of melting alloy by duplicate gilding
JPS5266374A (en) Galvanization of non electrolytic nickel for semiconductor substrate

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties