ATE371266T1 - IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH - Google Patents
IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATHInfo
- Publication number
- ATE371266T1 ATE371266T1 AT00870141T AT00870141T ATE371266T1 AT E371266 T1 ATE371266 T1 AT E371266T1 AT 00870141 T AT00870141 T AT 00870141T AT 00870141 T AT00870141 T AT 00870141T AT E371266 T1 ATE371266 T1 AT E371266T1
- Authority
- AT
- Austria
- Prior art keywords
- metal
- containing layer
- plating bath
- quality
- improvement
- Prior art date
Links
Abstract
PROBLEM TO BE SOLVED: To improve the quality of a metal layer deposited from a plating bath. SOLUTION: A method for depositing a film containing such metal as Cu and Co from a metal plating bath on a substrate having at least one hole in an insulation layer comprises a step of depositing a metal-containing layer until the hole is substantially filled, a step of executing a heating step and/or a vacuum step on the deposited metal-containing layer, and a step of depositing a metal-containing layer from a metal plating bath on the deposited metal- containing layer. By including the heating step and/or the vacuum step, impurities included in the metal deposition film or attaching to the surface of the film can be eliminated.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14048499P | 1999-06-22 | 1999-06-22 | |
EP99870194A EP1087432A1 (en) | 1999-09-24 | 1999-09-24 | A method for improving the quality of a metal layer deposited from a plating bath |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE371266T1 true ATE371266T1 (en) | 2007-09-15 |
Family
ID=26153854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00870141T ATE371266T1 (en) | 1999-06-22 | 2000-06-22 | IMPROVEMENT OF THE QUALITY OF A METAL-CONTAINING LAYER DEPOSITED IN A PLATING BATH |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4937437B2 (en) |
AT (1) | ATE371266T1 (en) |
DE (1) | DE60036052T2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4961185B2 (en) * | 2006-09-28 | 2012-06-27 | 株式会社日立製作所 | Manufacturing method of semiconductor device |
US7843063B2 (en) | 2008-02-14 | 2010-11-30 | International Business Machines Corporation | Microstructure modification in copper interconnect structure |
JP5968657B2 (en) * | 2012-03-22 | 2016-08-10 | 東京エレクトロン株式会社 | Plating treatment method, plating treatment system, and storage medium |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3187011B2 (en) * | 1998-08-31 | 2001-07-11 | 日本電気株式会社 | Method for manufacturing semiconductor device |
-
2000
- 2000-06-22 AT AT00870141T patent/ATE371266T1/en not_active IP Right Cessation
- 2000-06-22 JP JP2000187840A patent/JP4937437B2/en not_active Expired - Fee Related
- 2000-06-22 DE DE2000636052 patent/DE60036052T2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2001118848A (en) | 2001-04-27 |
JP4937437B2 (en) | 2012-05-23 |
DE60036052T2 (en) | 2008-05-08 |
DE60036052D1 (en) | 2007-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |