ATE366995T1 - Vorrichtung und verfahren zur bestückungsbehandlung - Google Patents

Vorrichtung und verfahren zur bestückungsbehandlung

Info

Publication number
ATE366995T1
ATE366995T1 AT02252010T AT02252010T ATE366995T1 AT E366995 T1 ATE366995 T1 AT E366995T1 AT 02252010 T AT02252010 T AT 02252010T AT 02252010 T AT02252010 T AT 02252010T AT E366995 T1 ATE366995 T1 AT E366995T1
Authority
AT
Austria
Prior art keywords
components
separated
assembling treatment
pick
engage
Prior art date
Application number
AT02252010T
Other languages
English (en)
Inventor
Yiu Ming Cheung
Pei Wei Tsai
Yu Sze Cheung
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/920,016 external-priority patent/US6655045B2/en
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Application granted granted Critical
Publication of ATE366995T1 publication Critical patent/ATE366995T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Specific Conveyance Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Steel Electrode Plates (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Processing Of Meat And Fish (AREA)
  • Pretreatment Of Seeds And Plants (AREA)
AT02252010T 2001-03-22 2002-03-20 Vorrichtung und verfahren zur bestückungsbehandlung ATE366995T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81421701A 2001-03-22 2001-03-22
US09/920,016 US6655045B2 (en) 2001-03-22 2001-08-02 Apparatus and method for pick and place handling

Publications (1)

Publication Number Publication Date
ATE366995T1 true ATE366995T1 (de) 2007-08-15

Family

ID=27123822

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02252010T ATE366995T1 (de) 2001-03-22 2002-03-20 Vorrichtung und verfahren zur bestückungsbehandlung

Country Status (4)

Country Link
EP (1) EP1244137B1 (de)
CN (2) CN1198315C (de)
AT (1) ATE366995T1 (de)
DE (1) DE60221060T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6991967B2 (en) * 2004-02-23 2006-01-31 Asm Assembly Automation Ltd. Apparatus and method for die attachment
AT516417B1 (de) 2014-10-29 2018-10-15 Zkw Group Gmbh Begrenzung für das Ablegen von elektronischen Bauteilen auf eine Unterlage

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773765B2 (ja) * 1990-06-05 1995-08-09 株式会社アマダ 多数個取り小製品の仕分け集積装置
US5710065A (en) * 1995-01-03 1998-01-20 Texas Instruments Incorporated Method and apparatus for breaking and separating dies from a wafer
JP3265252B2 (ja) * 1998-01-13 2002-03-11 山形日本電気株式会社 半導体収納治具、ハンドリング方法及び生産システム
US6165232A (en) * 1998-03-13 2000-12-26 Towa Corporation Method and apparatus for securely holding a substrate during dicing
US6187654B1 (en) * 1998-03-13 2001-02-13 Intercon Tools, Inc. Techniques for maintaining alignment of cut dies during substrate dicing
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法

Also Published As

Publication number Publication date
CN1198315C (zh) 2005-04-20
DE60221060T2 (de) 2008-03-20
HK1050669A1 (en) 2003-07-04
DE60221060D1 (de) 2007-08-23
CN1311521C (zh) 2007-04-18
CN1606126A (zh) 2005-04-13
CN1376623A (zh) 2002-10-30
EP1244137A3 (de) 2005-02-02
EP1244137B1 (de) 2007-07-11
EP1244137A2 (de) 2002-09-25

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