ATE346T1 - PROCESS FOR MANUFACTURING A COPPER-BASED MULTI-LAYER GLASS-CERAMIC STRUCTURE WITH INTERIOR SUPPLY LINES. - Google Patents

PROCESS FOR MANUFACTURING A COPPER-BASED MULTI-LAYER GLASS-CERAMIC STRUCTURE WITH INTERIOR SUPPLY LINES.

Info

Publication number
ATE346T1
ATE346T1 AT80100192T AT80100192T ATE346T1 AT E346 T1 ATE346 T1 AT E346T1 AT 80100192 T AT80100192 T AT 80100192T AT 80100192 T AT80100192 T AT 80100192T AT E346 T1 ATE346 T1 AT E346T1
Authority
AT
Austria
Prior art keywords
copper
manufacturing
supply lines
layer glass
ceramic structure
Prior art date
Application number
AT80100192T
Other languages
German (de)
Inventor
Lester Wynn Herron
Raj Navinchandra Master
Rao Ramamahara Tummala
Original Assignee
International Business Machines Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21813197&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE346(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by International Business Machines Corporation filed Critical International Business Machines Corporation
Application granted granted Critical
Publication of ATE346T1 publication Critical patent/ATE346T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
  • Surface Treatment Of Glass (AREA)
  • Communication Cables (AREA)
  • Insulated Conductors (AREA)

Abstract

The formation of sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H2O at temperatures below the melting point of copper.
AT80100192T 1979-03-23 1980-01-16 PROCESS FOR MANUFACTURING A COPPER-BASED MULTI-LAYER GLASS-CERAMIC STRUCTURE WITH INTERIOR SUPPLY LINES. ATE346T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/023,112 US4234367A (en) 1979-03-23 1979-03-23 Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
EP80100192A EP0016307B1 (en) 1979-03-23 1980-01-16 Method of making a multi-layer glass-ceramic structure having copper-based internal conductors

Publications (1)

Publication Number Publication Date
ATE346T1 true ATE346T1 (en) 1981-11-15

Family

ID=21813197

Family Applications (1)

Application Number Title Priority Date Filing Date
AT80100192T ATE346T1 (en) 1979-03-23 1980-01-16 PROCESS FOR MANUFACTURING A COPPER-BASED MULTI-LAYER GLASS-CERAMIC STRUCTURE WITH INTERIOR SUPPLY LINES.

Country Status (7)

Country Link
US (1) US4234367A (en)
EP (1) EP0016307B1 (en)
JP (1) JPS55128899A (en)
AT (1) ATE346T1 (en)
CA (1) CA1123115A (en)
DE (1) DE3060057D1 (en)
IT (1) IT1150089B (en)

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Also Published As

Publication number Publication date
DE3060057D1 (en) 1982-01-14
EP0016307A1 (en) 1980-10-01
JPS55128899A (en) 1980-10-06
CA1123115A (en) 1982-05-04
US4234367A (en) 1980-11-18
IT8020408A0 (en) 1980-03-07
EP0016307B1 (en) 1981-11-04
IT1150089B (en) 1986-12-10
JPS6245720B2 (en) 1987-09-28

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