ATE338342T1 - WAFER PROCESSING APPARATUS AND ASSOCIATED METHOD - Google Patents

WAFER PROCESSING APPARATUS AND ASSOCIATED METHOD

Info

Publication number
ATE338342T1
ATE338342T1 AT04018148T AT04018148T ATE338342T1 AT E338342 T1 ATE338342 T1 AT E338342T1 AT 04018148 T AT04018148 T AT 04018148T AT 04018148 T AT04018148 T AT 04018148T AT E338342 T1 ATE338342 T1 AT E338342T1
Authority
AT
Austria
Prior art keywords
processing apparatus
wafer processing
associated method
unit
processing
Prior art date
Application number
AT04018148T
Other languages
German (de)
Inventor
Andreas Behr
Original Assignee
Innolas Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolas Gmbh filed Critical Innolas Gmbh
Application granted granted Critical
Publication of ATE338342T1 publication Critical patent/ATE338342T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37571—Camera detecting reflected light from laser
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49113—Align elements like hole and drill, centering tool, probe, workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A wafer (10) processing unit, especially for laser marking or writing, comprises a displacement determining unit (9) to produce a signal, information or data on the difference between the target position for processing and the actual position determined by an alignment device. An independent claim is also included for a process for the above unit.
AT04018148T 2004-07-30 2004-07-30 WAFER PROCESSING APPARATUS AND ASSOCIATED METHOD ATE338342T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04018148A EP1622196B1 (en) 2004-07-30 2004-07-30 Apparatus for treating a wafer and a method therefor

Publications (1)

Publication Number Publication Date
ATE338342T1 true ATE338342T1 (en) 2006-09-15

Family

ID=34926008

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04018148T ATE338342T1 (en) 2004-07-30 2004-07-30 WAFER PROCESSING APPARATUS AND ASSOCIATED METHOD

Country Status (3)

Country Link
EP (1) EP1622196B1 (en)
AT (1) ATE338342T1 (en)
DE (1) DE502004001360D1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUD20070199A1 (en) * 2007-10-24 2009-04-25 Baccini S P A CONTROL AND CORRECTION DEVICE OF THE PLATFORM POSITION FOR ELECTRONICS AND ITS PROCEDURE
US9245062B2 (en) 2012-03-22 2016-01-26 Virtek Vision International Inc. Laser projection system using variable part alignment
CN112330744B (en) * 2020-11-09 2024-07-12 上海原能细胞生物低温设备有限公司 Sample position determining method, sample position determining device, computer equipment and storage medium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461567A (en) * 1979-12-20 1984-07-24 Censor Patent- Und Versuchs-Anstalt Method of and apparatus for the positioning of disk-shaped workpieces, particularly semiconductor wafers
US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
US5308222A (en) * 1991-05-17 1994-05-03 Kensington Laboratories, Inc. Noncentering specimen prealigner
JP4255091B2 (en) * 1999-04-07 2009-04-15 株式会社日立国際電気 Semiconductor manufacturing method

Also Published As

Publication number Publication date
EP1622196B1 (en) 2006-08-30
DE502004001360D1 (en) 2006-10-12
EP1622196A1 (en) 2006-02-01

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee