GB2446314A - Structure and method for simultaneously determining an overlay accuracy and pattern placement error - Google Patents

Structure and method for simultaneously determining an overlay accuracy and pattern placement error Download PDF

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Publication number
GB2446314A
GB2446314A GB0805209A GB0805209A GB2446314A GB 2446314 A GB2446314 A GB 2446314A GB 0805209 A GB0805209 A GB 0805209A GB 0805209 A GB0805209 A GB 0805209A GB 2446314 A GB2446314 A GB 2446314A
Authority
GB
United Kingdom
Prior art keywords
placement error
pattern placement
overlay accuracy
simultaneously determining
segmented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0805209A
Other versions
GB0805209D0 (en
GB2446314B (en
Inventor
Bernd Schulz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102005046973.6A external-priority patent/DE102005046973B4/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0805209D0 publication Critical patent/GB0805209D0/en
Publication of GB2446314A publication Critical patent/GB2446314A/en
Application granted granted Critical
Publication of GB2446314B publication Critical patent/GB2446314B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention provides a technique for obtaining overlay error and pattern placement error information from a single measurement structure (200). This is accomplished by forming periodic sub-structures (210, 220, 240, 250) in at least two different device layers in a single measurement structure (221,241), wherein at least one segmented (200) and one non-segmented (211,251) portion is provided in the two different device layers.
GB0805209A 2005-09-30 2008-03-20 Structure and method for simultaneously determining an overlay accuracy and pattern placement error Expired - Fee Related GB2446314B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005046973.6A DE102005046973B4 (en) 2005-09-30 2005-09-30 A structure and method for simultaneously determining overlay accuracy and pattern placement error
US11/421,099 US7667842B2 (en) 2005-09-30 2006-05-31 Structure and method for simultaneously determining an overlay accuracy and pattern placement error
PCT/US2006/032757 WO2007040855A1 (en) 2005-09-30 2006-08-23 Structure and method for simultaneously determining an overlay accuracy and pattern placement error

Publications (3)

Publication Number Publication Date
GB0805209D0 GB0805209D0 (en) 2008-04-30
GB2446314A true GB2446314A (en) 2008-08-06
GB2446314B GB2446314B (en) 2010-09-08

Family

ID=37496445

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0805209A Expired - Fee Related GB2446314B (en) 2005-09-30 2008-03-20 Structure and method for simultaneously determining an overlay accuracy and pattern placement error

Country Status (2)

Country Link
GB (1) GB2446314B (en)
WO (1) WO2007040855A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201003449A (en) * 2008-06-10 2010-01-16 Applied Materials Israel Ltd Method and system for evaluating an object that has a repetitive pattern
NL2003294A (en) 2008-08-19 2010-03-09 Asml Netherlands Bv A method of measuring overlay error and a device manufacturing method.
NL2003347A (en) * 2008-09-11 2010-03-16 Asml Netherlands Bv Imprint lithography.
US8822106B2 (en) * 2012-04-13 2014-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Grid refinement method
US9093458B2 (en) * 2012-09-06 2015-07-28 Kla-Tencor Corporation Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
US10474040B2 (en) * 2017-12-07 2019-11-12 Kla-Tencor Corporation Systems and methods for device-correlated overlay metrology

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030026471A1 (en) * 2000-08-30 2003-02-06 Michael Adel Overlay marks, methods of overlay mark design and methods of overlay measurements
WO2003071471A1 (en) * 2002-02-15 2003-08-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US20050174574A1 (en) * 2000-06-22 2005-08-11 Kla-Tencor Corporation Overlay alignment mark design

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174574A1 (en) * 2000-06-22 2005-08-11 Kla-Tencor Corporation Overlay alignment mark design
US20030026471A1 (en) * 2000-08-30 2003-02-06 Michael Adel Overlay marks, methods of overlay mark design and methods of overlay measurements
WO2003071471A1 (en) * 2002-02-15 2003-08-28 Kla-Tencor Technologies Corporation Overlay metrology and control method

Also Published As

Publication number Publication date
GB0805209D0 (en) 2008-04-30
GB2446314B (en) 2010-09-08
WO2007040855A1 (en) 2007-04-12

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20091210 AND 20091216

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110823