ATE28709T1 - Zusammenbau-anordnung fuer elektronische leistungsbauelemente auf einem kuehlkoerper und anwendung fuer monophasen- oder polyphasenbr¨cken. - Google Patents

Zusammenbau-anordnung fuer elektronische leistungsbauelemente auf einem kuehlkoerper und anwendung fuer monophasen- oder polyphasenbr¨cken.

Info

Publication number
ATE28709T1
ATE28709T1 AT84400444T AT84400444T ATE28709T1 AT E28709 T1 ATE28709 T1 AT E28709T1 AT 84400444 T AT84400444 T AT 84400444T AT 84400444 T AT84400444 T AT 84400444T AT E28709 T1 ATE28709 T1 AT E28709T1
Authority
AT
Austria
Prior art keywords
heat sink
power components
monophase
polyphase
bridges
Prior art date
Application number
AT84400444T
Other languages
English (en)
Inventor
Roger Sacco
Original Assignee
Telemecanique Electrique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telemecanique Electrique filed Critical Telemecanique Electrique
Application granted granted Critical
Publication of ATE28709T1 publication Critical patent/ATE28709T1/de

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Conversion In General (AREA)
AT84400444T 1983-03-07 1984-03-06 Zusammenbau-anordnung fuer elektronische leistungsbauelemente auf einem kuehlkoerper und anwendung fuer monophasen- oder polyphasenbr¨cken. ATE28709T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8303681A FR2542501B1 (fr) 1983-03-07 1983-03-07 Dispositif d'assemblage de composants electroniques de puissance sur un dissipateur thermique et application
EP84400444A EP0119134B1 (de) 1983-03-07 1984-03-06 Zusammenbau-Anordnung für elektronische Leistungsbauelemente auf einem Kühlkörper und Anwendung für Monophasen- oder Polyphasen-Brücken

Publications (1)

Publication Number Publication Date
ATE28709T1 true ATE28709T1 (de) 1987-08-15

Family

ID=9286557

Family Applications (1)

Application Number Title Priority Date Filing Date
AT84400444T ATE28709T1 (de) 1983-03-07 1984-03-06 Zusammenbau-anordnung fuer elektronische leistungsbauelemente auf einem kuehlkoerper und anwendung fuer monophasen- oder polyphasenbr¨cken.

Country Status (4)

Country Link
EP (1) EP0119134B1 (de)
AT (1) ATE28709T1 (de)
DE (1) DE3465153D1 (de)
FR (1) FR2542501B1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0933867A1 (de) * 1998-01-28 1999-08-04 Gec Alsthom Acec Transport S.A. Stromrichtermodul

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1516046A (en) * 1977-05-10 1978-06-28 Philcom Electronics Ltd Full wave rectifier assemblies
FR2477828A1 (fr) * 1980-03-07 1981-09-11 Thomson Csf Mat Tel Systeme d'interconnexion electrique et thermique pour des cartes a circuits electroniques, et armoire electrique equipee d'un tel systeme
US4322776A (en) * 1980-08-04 1982-03-30 Hughes Aircraft Company Thermal interconnection

Also Published As

Publication number Publication date
FR2542501A1 (fr) 1984-09-14
DE3465153D1 (en) 1987-09-03
EP0119134B1 (de) 1987-07-29
EP0119134A1 (de) 1984-09-19
FR2542501B1 (fr) 1987-04-03

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee