ATE251969T1 - CHEMICAL SUPPLY SYSTEM AND USE THEREOF - Google Patents

CHEMICAL SUPPLY SYSTEM AND USE THEREOF

Info

Publication number
ATE251969T1
ATE251969T1 AT98922664T AT98922664T ATE251969T1 AT E251969 T1 ATE251969 T1 AT E251969T1 AT 98922664 T AT98922664 T AT 98922664T AT 98922664 T AT98922664 T AT 98922664T AT E251969 T1 ATE251969 T1 AT E251969T1
Authority
AT
Austria
Prior art keywords
supply system
chemical supply
useful
system allows
prepared directly
Prior art date
Application number
AT98922664T
Other languages
German (de)
Inventor
Ulrich Finkenzeller
Claus Dusemund
Thomas Schwortschik
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Application granted granted Critical
Publication of ATE251969T1 publication Critical patent/ATE251969T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

A new chemicals supply system allows solid-containing suspensions, useful for example for polishing wafers or in the semiconductor manufacture, to be prepared directly at their utilisation site.
AT98922664T 1997-04-17 1998-04-08 CHEMICAL SUPPLY SYSTEM AND USE THEREOF ATE251969T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19715974A DE19715974A1 (en) 1997-04-17 1997-04-17 Chemical supply system and its use
PCT/EP1998/002035 WO1998047661A1 (en) 1997-04-17 1998-04-08 Chemicals supply system and its use

Publications (1)

Publication Number Publication Date
ATE251969T1 true ATE251969T1 (en) 2003-11-15

Family

ID=7826736

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98922664T ATE251969T1 (en) 1997-04-17 1998-04-08 CHEMICAL SUPPLY SYSTEM AND USE THEREOF

Country Status (6)

Country Link
EP (1) EP1009589B1 (en)
JP (1) JP2001520589A (en)
AT (1) ATE251969T1 (en)
DE (2) DE19715974A1 (en)
TW (1) TW392248B (en)
WO (1) WO1998047661A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6241586B1 (en) 1998-10-06 2001-06-05 Rodel Holdings Inc. CMP polishing slurry dewatering and reconstitution
US6447375B2 (en) * 2000-04-19 2002-09-10 Rodel Holdings Inc. Polishing method using a reconstituted dry particulate polishing composition
DE10060697B4 (en) * 2000-12-07 2005-10-06 Siltronic Ag Double-sided polishing method with reduced scratch rate and apparatus for carrying out the method
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7218983B2 (en) 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
TWI316044B (en) 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface
US7274971B2 (en) 2004-02-28 2007-09-25 Applied Materials, Inc. Methods and apparatus for electronic device manufacturing system monitoring and control
TWI290875B (en) 2004-02-28 2007-12-11 Applied Materials Inc Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
DE102009058436A1 (en) 2009-12-16 2011-01-20 Siltronic Ag Method for manufacturing semiconductor wafers, involves spraying tooth of polishing machine with watery alkaline solution that is supplied to semiconductor wafer in closed feeding device, where volume flow carries polishing medium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2082255A5 (en) * 1970-03-09 1971-12-10 Barragan Jacques
DE2336735A1 (en) * 1973-07-19 1975-02-06 Licentia Gmbh Semiconductor surface polishing medium - prepd. by two-stage counterflow elutriation and agglomerant admixture
US4678119A (en) * 1982-10-12 1987-07-07 Buehler Ltd. Abrasive slurry supply system for use in metallographic sample preparation
KR930008856B1 (en) * 1991-05-15 1993-09-16 금성일렉트론 주식회사 Mixing apparatus for constant ratio of chemical source
TW402542B (en) * 1994-10-24 2000-08-21 Motorola Inc Improvements in timing and location for mixing polishing fluid in a process of polishing a semiconductor substrate

Also Published As

Publication number Publication date
TW392248B (en) 2000-06-01
EP1009589A1 (en) 2000-06-21
DE59809935D1 (en) 2003-11-20
WO1998047661A1 (en) 1998-10-29
DE19715974A1 (en) 1998-10-22
JP2001520589A (en) 2001-10-30
EP1009589B1 (en) 2003-10-15

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Legal Events

Date Code Title Description
EEIH Change in the person of patent owner
REN Ceased due to non-payment of the annual fee