ATE249679T1 - Durchführvorrichtungen - Google Patents
DurchführvorrichtungenInfo
- Publication number
- ATE249679T1 ATE249679T1 AT00310767T AT00310767T ATE249679T1 AT E249679 T1 ATE249679 T1 AT E249679T1 AT 00310767 T AT00310767 T AT 00310767T AT 00310767 T AT00310767 T AT 00310767T AT E249679 T1 ATE249679 T1 AT E249679T1
- Authority
- AT
- Austria
- Prior art keywords
- insulating material
- ferrule
- gap
- coupled
- ground wire
- Prior art date
Links
- 239000011810 insulating material Substances 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
- H01B17/303—Sealing of leads to lead-through insulators
- H01B17/305—Sealing of leads to lead-through insulators by embedding in glass or ceramic material
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3752—Details of casing-lead connections
- A61N1/3754—Feedthroughs
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Electrotherapy Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Glass Compositions (AREA)
- Paper (AREA)
- Insulating Bodies (AREA)
- Cable Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16893799P | 1999-12-03 | 1999-12-03 | |
US09/557,336 US6586675B1 (en) | 1999-12-03 | 2000-04-24 | Feedthrough devices |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE249679T1 true ATE249679T1 (de) | 2003-09-15 |
Family
ID=26864603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00310767T ATE249679T1 (de) | 1999-12-03 | 2000-12-04 | Durchführvorrichtungen |
Country Status (5)
Country | Link |
---|---|
US (1) | US6586675B1 (de) |
EP (1) | EP1107264B1 (de) |
AT (1) | ATE249679T1 (de) |
DE (1) | DE60005118T2 (de) |
ES (1) | ES2203401T3 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6877431B2 (en) * | 2002-10-21 | 2005-04-12 | Schott Glas | Hermetically sealed electrical feed-through device with a bent isolated pin in a circular glass seal |
US6874423B2 (en) * | 2002-10-21 | 2005-04-05 | Schott Glas | Hermetically sealed electrical feed-through device with a straight isolated pin in an offset oval glass seal |
US6768629B1 (en) * | 2003-06-02 | 2004-07-27 | Greatbatch-Hittman, Inc. | Multipin feedthrough containing a ground pin passing through an insulator and directly brazed to a ferrule |
DE10329261A1 (de) * | 2003-06-23 | 2005-01-13 | Biotronik Meß- und Therapiegeräte GmbH & Co. Ingenieurbüro Berlin | Gehäusedurchführung für implantierbare elektronische Geräte |
US6989200B2 (en) * | 2003-10-30 | 2006-01-24 | Alfred E. Mann Foundation For Scientific Research | Ceramic to noble metal braze and method of manufacture |
US7046499B1 (en) | 2004-10-04 | 2006-05-16 | Pacesetter, Inc. | Internally grounded filtering feedthrough |
US8329314B1 (en) | 2004-10-12 | 2012-12-11 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a palladium braze |
US7771838B1 (en) | 2004-10-12 | 2010-08-10 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a Ti-Pd braze interface |
US8560079B2 (en) * | 2005-12-23 | 2013-10-15 | Cochlear Limited | Braze join |
US8160707B2 (en) * | 2006-01-30 | 2012-04-17 | Medtronic, Inc. | Method and apparatus for minimizing EMI coupling in a feedthrough array having at least one unfiltered feedthrough |
US7498516B1 (en) * | 2006-06-14 | 2009-03-03 | Boston Scientific Neuromodulation Corporation | Feedthru assembly |
US8581108B1 (en) | 2006-08-23 | 2013-11-12 | Rockwell Collins, Inc. | Method for providing near-hermetically coated integrated circuit assemblies |
US8076185B1 (en) | 2006-08-23 | 2011-12-13 | Rockwell Collins, Inc. | Integrated circuit protection and ruggedization coatings and methods |
US7915527B1 (en) * | 2006-08-23 | 2011-03-29 | Rockwell Collins, Inc. | Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings |
US8617913B2 (en) | 2006-08-23 | 2013-12-31 | Rockwell Collins, Inc. | Alkali silicate glass based coating and method for applying |
US7969712B2 (en) * | 2007-04-19 | 2011-06-28 | Oracle America, Inc. | Power integrity circuits with EMI benefits |
US8550974B2 (en) * | 2008-11-13 | 2013-10-08 | Robert Jarvik | Sub-miniature electromechanical medical implants with integrated hermetic feedthroughs |
EP2437850B1 (de) | 2009-06-04 | 2014-11-19 | Morgan Advanced Ceramics, Inc. | Durchführungen aus einbrand-metall- und keramikverbund, zumindest für die verwendung für implantierbare medizinische vorrichtungen, und herstellungsverfahren dafür |
DE102009035971B4 (de) * | 2009-08-04 | 2013-01-17 | Heraeus Precious Metals Gmbh & Co. Kg | Elektrische Durchführung für eine medizinisch implantierbare Vorrichtung |
DE102009035972B4 (de) | 2009-08-04 | 2011-11-17 | W.C. Heraeus Gmbh | Cermethaltige Durchführung für eine medizinisch implantierbare Vorrichtung |
AU2009213037A1 (en) * | 2009-09-09 | 2011-03-24 | Cochlear Limited | Braze join |
US8487187B2 (en) * | 2009-09-09 | 2013-07-16 | Emerson Electric Co. | Solid core glass bead seal with stiffening rib |
DE102010006689B4 (de) * | 2010-02-02 | 2013-04-18 | Heraeus Precious Metals Gmbh & Co. Kg | Verfahren zum Herstellen einer elektrischen Durchführung, elektrische Durchführung sowie implantierbare Vorrichtung |
DE102010006690B4 (de) | 2010-02-02 | 2013-03-28 | Heraeus Precious Metals Gmbh & Co. Kg | Verfahren zum Herstellen einer elektrischen Durchführung, elektrische Durchführung sowie implantierbare Vorrichtung |
US8604341B2 (en) | 2010-07-08 | 2013-12-10 | Cardiac Pacemakers, Inc. | Feedthrough assembly for an implantable device |
EP2527000B1 (de) * | 2011-04-15 | 2015-11-25 | LITRONIK Entwicklungs GmbH | Leitungs-Durchführung und elektrische Funktionseinheit |
US8841558B2 (en) | 2011-08-02 | 2014-09-23 | Medtronic Inc. | Hermetic feedthrough |
US8588916B2 (en) | 2011-08-02 | 2013-11-19 | Medtronic, Inc. | Feedthrough configured for interconnect |
US9008779B2 (en) | 2011-08-02 | 2015-04-14 | Medtronic, Inc. | Insulator for a feedthrough |
US8670829B2 (en) | 2011-08-02 | 2014-03-11 | Medtronic, Inc. | Insulator for a feedthrough |
US9627833B2 (en) | 2011-08-02 | 2017-04-18 | Medtronic, Inc. | Electrical leads for a feedthrough |
US8872035B2 (en) | 2011-08-02 | 2014-10-28 | Medtronic, Inc. | Hermetic feedthrough |
US9724524B2 (en) | 2011-08-02 | 2017-08-08 | Medtronic, Inc. | Interconnection of conductor to feedthrough |
US20150250386A1 (en) * | 2012-09-28 | 2015-09-10 | Csem Centre Suisse D'electronique Et De Microtechnique Sa -Recherche Et Developpement | Implantable devices |
US20140178185A1 (en) * | 2012-12-21 | 2014-06-26 | United Technologies Corporation | Egress seal assembly |
US9478959B2 (en) | 2013-03-14 | 2016-10-25 | Heraeus Deutschland GmbH & Co. KG | Laser welding a feedthrough |
US9431801B2 (en) | 2013-05-24 | 2016-08-30 | Heraeus Deutschland GmbH & Co. KG | Method of coupling a feedthrough assembly for an implantable medical device |
US9403023B2 (en) | 2013-08-07 | 2016-08-02 | Heraeus Deutschland GmbH & Co. KG | Method of forming feedthrough with integrated brazeless ferrule |
FR3012965B1 (fr) | 2013-11-14 | 2016-01-08 | Commissariat Energie Atomique | Dispositif de traversee notamment pour systeme d'implant medical et procede de realisation. |
US9610451B2 (en) | 2013-12-12 | 2017-04-04 | Heraeus Deutschland GmbH & Co. KG | Direct integration of feedthrough to implantable medical device housing using a gold alloy |
US9504841B2 (en) | 2013-12-12 | 2016-11-29 | Heraeus Deutschland GmbH & Co. KG | Direct integration of feedthrough to implantable medical device housing with ultrasonic welding |
US9610452B2 (en) | 2013-12-12 | 2017-04-04 | Heraeus Deutschland GmbH & Co. KG | Direct integration of feedthrough to implantable medical device housing by sintering |
US9138821B2 (en) | 2014-01-17 | 2015-09-22 | Medtronic, Inc. | Methods for simultaneously brazing a ferrule and lead pins |
EP3069758A1 (de) * | 2015-03-20 | 2016-09-21 | BIOTRONIK SE & Co. KG | Gestanzte flansche für elektrische durchführungen mit integriertem massestift |
DE102015117935A1 (de) * | 2015-10-21 | 2017-04-27 | Biotronik Se & Co. Kg | Durchführung eines medizinelektronischen Gerätes und medizinelektronisches Gerät |
DE102016103485A1 (de) * | 2016-02-26 | 2017-08-31 | Schott Ag | Durchführungen für Anwendungen bei hohem Aussendruck sowie Verfahren zu deren Herstellung |
US10874865B2 (en) | 2017-11-06 | 2020-12-29 | Avx Corporation | EMI feedthrough filter terminal assembly containing a resin coating over a hermetically sealing material |
US11648408B2 (en) * | 2018-11-07 | 2023-05-16 | Pacesetter, Inc. | Filtered feedthrough assembly for use in implantable medical device and method of manufacturing the same |
EP3900783B1 (de) | 2020-02-21 | 2023-08-16 | Heraeus Medical Components, LLC | Hülse für ein nicht-planares gehäuse einer medizinischen vorrichtung |
EP3900782B1 (de) | 2020-02-21 | 2023-08-09 | Heraeus Medical Components, LLC | Hülse mit zugentlastendem abstandshalter für implantierbare medizinische vorrichtung |
EP4169570A1 (de) * | 2021-10-20 | 2023-04-26 | BIOTRONIK SE & Co. KG | Verfahren zur herstellung einer elektrischen durchführung |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4180700A (en) | 1978-03-13 | 1979-12-25 | Medtronic, Inc. | Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs |
US5046242A (en) * | 1982-07-27 | 1991-09-10 | Commonwealth Of Australia | Method of making feedthrough assemblies having hermetic seals between electrical feedthrough elements and ceramic carriers therefor |
DE3434086A1 (de) | 1984-09-17 | 1986-03-27 | Siemens Ag | Bauelementegehaeuse |
US4835365A (en) * | 1986-09-29 | 1989-05-30 | Etheridge David R | De-ionized fluid heater and control system |
EP0277645A1 (de) * | 1987-02-02 | 1988-08-10 | Sumitomo Electric Industries Limited | Verbindung metallischer und keramischer Gegenstände |
US4940858A (en) | 1989-08-18 | 1990-07-10 | Medtronic, Inc. | Implantable pulse generator feedthrough |
US4991582A (en) | 1989-09-22 | 1991-02-12 | Alfred E. Mann Foundation For Scientific Research | Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies |
US5455206A (en) * | 1990-09-14 | 1995-10-03 | Kaun; Thomas D. | Corrosion resistant ceramic materials |
US5368220A (en) | 1992-08-04 | 1994-11-29 | Morgan Crucible Company Plc | Sealed conductive active alloy feedthroughs |
US5440447A (en) | 1993-07-02 | 1995-08-08 | The Morgan Crucible Company, Plc | High temperature feed-through system and method for making same |
US5700724A (en) * | 1994-08-02 | 1997-12-23 | Philips Electronic North America Corporation | Hermetically sealed package for a high power hybrid circuit |
US5817984A (en) | 1995-07-28 | 1998-10-06 | Medtronic Inc | Implantable medical device wtih multi-pin feedthrough |
US5750926A (en) | 1995-08-16 | 1998-05-12 | Alfred E. Mann Foundation For Scientific Research | Hermetically sealed electrical feedthrough for use with implantable electronic devices |
US5681172A (en) * | 1995-11-01 | 1997-10-28 | Cooper Industries, Inc. | Multi-pole electrical connector with ground continuity |
US5650759A (en) | 1995-11-09 | 1997-07-22 | Hittman Materials & Medical Components, Inc. | Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture therefor |
US5833714A (en) * | 1996-01-18 | 1998-11-10 | Loeb; Gerald E. | Cochlear electrode array employing tantalum metal |
US5825608A (en) | 1996-10-18 | 1998-10-20 | Novacap, Inc. | Feed-through filter capacitor assembly |
US5896267A (en) | 1997-07-10 | 1999-04-20 | Greatbatch-Hittman, Inc. | Substrate mounted filter for feedthrough devices |
US5905627A (en) | 1997-09-10 | 1999-05-18 | Maxwell Energy Products, Inc. | Internally grounded feedthrough filter capacitor |
-
2000
- 2000-04-24 US US09/557,336 patent/US6586675B1/en not_active Expired - Lifetime
- 2000-12-04 ES ES00310767T patent/ES2203401T3/es not_active Expired - Lifetime
- 2000-12-04 AT AT00310767T patent/ATE249679T1/de active
- 2000-12-04 DE DE60005118T patent/DE60005118T2/de not_active Expired - Lifetime
- 2000-12-04 EP EP00310767A patent/EP1107264B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60005118D1 (de) | 2003-10-16 |
DE60005118T2 (de) | 2004-07-08 |
EP1107264A3 (de) | 2002-08-21 |
EP1107264A2 (de) | 2001-06-13 |
ES2203401T3 (es) | 2004-04-16 |
EP1107264B1 (de) | 2003-09-10 |
US6586675B1 (en) | 2003-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
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