ATE200596T1 - FILMS AND COATINGS WITH ANISOTROPIC CONDUCTIVE PATHS THEREIN - Google Patents

FILMS AND COATINGS WITH ANISOTROPIC CONDUCTIVE PATHS THEREIN

Info

Publication number
ATE200596T1
ATE200596T1 AT96305657T AT96305657T ATE200596T1 AT E200596 T1 ATE200596 T1 AT E200596T1 AT 96305657 T AT96305657 T AT 96305657T AT 96305657 T AT96305657 T AT 96305657T AT E200596 T1 ATE200596 T1 AT E200596T1
Authority
AT
Austria
Prior art keywords
composition
ferrofluid
coating
film
solidification
Prior art date
Application number
AT96305657T
Other languages
German (de)
Inventor
Ciaran Bernard Mcardle
Joseph Burke
Original Assignee
Loctite Ireland Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Ireland Ltd filed Critical Loctite Ireland Ltd
Application granted granted Critical
Publication of ATE200596T1 publication Critical patent/ATE200596T1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The present invention discloses an anisotropically conductive film or a substrate having a surface covered with an anisotropically conductive coating, said film or coating being formed by solidification of a composition comprising: (i) a solidifiable ferrofluid composition, the ferrofluid comprising a ferromagnetic particle colloidal suspension in a non-magnetic carrier, and (ii) a plurality of electrically conductive particles dispersed in said ferrofluid, the electrically conductive particles having a non-random pattern arrangement by application of a substantially uniform magnetic field to the composition, in a liquid state, and being securely positioned by solidification of said composition. The composition is solidified in a step A of a process, which usually involves a primary curing. In a final use application of the particle or coating, the composition usually is subjected to a step B, or secondary curing. The film or substrate so coated is suitable as an article for the manufacture of joint conductors in the electrical industry.
AT96305657T 1995-08-01 1996-07-31 FILMS AND COATINGS WITH ANISOTROPIC CONDUCTIVE PATHS THEREIN ATE200596T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IE950589 1995-08-01

Publications (1)

Publication Number Publication Date
ATE200596T1 true ATE200596T1 (en) 2001-04-15

Family

ID=11040839

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96305657T ATE200596T1 (en) 1995-08-01 1996-07-31 FILMS AND COATINGS WITH ANISOTROPIC CONDUCTIVE PATHS THEREIN

Country Status (3)

Country Link
KR (1) KR100397063B1 (en)
AT (1) ATE200596T1 (en)
DE (1) DE69612437T2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101532981B1 (en) * 2014-10-02 2015-07-02 (주)포웰 System applied to treatment methods majesty can highly granular carrier is filled with the intermittent aeration process
KR101785151B1 (en) * 2015-08-05 2017-10-18 한국과학기술원 Anisotropic Conductive Films using Non-Sphere type Conductive Particles for Electrical Connection in Curvy Substrates
KR101746334B1 (en) * 2016-03-25 2017-06-13 한국과학기술원 Adhesive film for electric connection of eletronic fabric and connection method thereof
KR102062482B1 (en) * 2019-01-24 2020-01-03 한국과학기술원 Method for uniformly dispersing single layer nickel plated conductive particle in polymer film by applying megnetic field and method for producing anisotropic conductive file using the same
KR20240036325A (en) * 2022-09-13 2024-03-20 주식회사 아이에스시 Method of manufacturing conductive particles with magnetic particles aligned inside, conductive particles, and sheet-form connector

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4960614A (en) * 1987-02-06 1990-10-02 Key-Tech, Inc. Printed circuit board

Also Published As

Publication number Publication date
MX9603138A (en) 1997-07-31
DE69612437D1 (en) 2001-05-17
HK1004246A1 (en) 1998-11-20
KR970012799A (en) 1997-03-29
KR100397063B1 (en) 2003-11-10
DE69612437T2 (en) 2001-09-27

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties