ATE115195T1 - Leitungssystem zur gasversorgung einer prozessanlage. - Google Patents
Leitungssystem zur gasversorgung einer prozessanlage.Info
- Publication number
- ATE115195T1 ATE115195T1 AT89908265T AT89908265T ATE115195T1 AT E115195 T1 ATE115195 T1 AT E115195T1 AT 89908265 T AT89908265 T AT 89908265T AT 89908265 T AT89908265 T AT 89908265T AT E115195 T1 ATE115195 T1 AT E115195T1
- Authority
- AT
- Austria
- Prior art keywords
- gas supply
- pipe system
- processing plant
- pipelines
- appts
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
- B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
- B08B9/0325—Control mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4402—Reduction of impurities in the source gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Pipeline Systems (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63171383A JPH0647073B2 (ja) | 1988-07-08 | 1988-07-08 | プロセス装置用ガス供給配管装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE115195T1 true ATE115195T1 (de) | 1994-12-15 |
Family
ID=15922160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT89908265T ATE115195T1 (de) | 1988-07-08 | 1989-07-07 | Leitungssystem zur gasversorgung einer prozessanlage. |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0379594B1 (de) |
JP (1) | JPH0647073B2 (de) |
AT (1) | ATE115195T1 (de) |
DE (1) | DE68919819T2 (de) |
WO (1) | WO1990000633A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2889752B2 (ja) * | 1992-01-29 | 1999-05-10 | 株式会社東芝 | ガス供給システムおよびガス供給装置 |
US5455014A (en) * | 1993-07-20 | 1995-10-03 | Hughes Aircraft Company | Liquid deposition source gas delivery system |
FI100409B (fi) | 1994-11-28 | 1997-11-28 | Asm Int | Menetelmä ja laitteisto ohutkalvojen valmistamiseksi |
US6436353B1 (en) | 1997-06-13 | 2002-08-20 | Tadahiro Ohmi | Gas recovering apparatus |
US20060156980A1 (en) * | 2005-01-19 | 2006-07-20 | Samsung Electronics Co., Ltd. | Apparatus including 4-way valve for fabricating semiconductor device, method of controlling valve, and method of fabricating semiconductor device using the apparatus |
JP4606396B2 (ja) * | 2006-09-15 | 2011-01-05 | 東京エレクトロン株式会社 | 処理ガス供給システム及び処理ガス供給方法 |
JP5436248B2 (ja) * | 2010-02-03 | 2014-03-05 | 和三 長谷川 | 低圧空気供給システム |
JP2012199511A (ja) * | 2011-03-04 | 2012-10-18 | Stanley Electric Co Ltd | 気相成長装置及び気相成長方法 |
CN102853255A (zh) * | 2012-08-29 | 2013-01-02 | 昆山书豪仪器科技有限公司 | 直读光谱供气系统 |
KR102260840B1 (ko) * | 2020-02-25 | 2021-06-07 | 주식회사 케이씨 | 가스 공급 시스템 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH643469A5 (fr) * | 1981-12-22 | 1984-06-15 | Siv Soc Italiana Vetro | Installation pour deposer en continu, sur la surface d'un substrat porte a haute temperature, une couche d'une matiere solide. |
JPH0442913Y2 (de) * | 1984-11-30 | 1992-10-12 | ||
JPS6259133U (de) * | 1985-10-02 | 1987-04-13 | ||
JPS63291895A (ja) * | 1987-05-26 | 1988-11-29 | Sumitomo Metal Ind Ltd | 気相表面処理反応装置 |
JPH0682668A (ja) * | 1992-09-04 | 1994-03-25 | Canon Inc | レンズ駆動装置及びカメラのレンズ移動装置 |
-
1988
- 1988-07-08 JP JP63171383A patent/JPH0647073B2/ja not_active Expired - Fee Related
-
1989
- 1989-07-07 EP EP89908265A patent/EP0379594B1/de not_active Expired - Lifetime
- 1989-07-07 WO PCT/JP1989/000690 patent/WO1990000633A1/ja active IP Right Grant
- 1989-07-07 AT AT89908265T patent/ATE115195T1/de active
- 1989-07-07 DE DE68919819T patent/DE68919819T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1990000633A1 (en) | 1990-01-25 |
DE68919819D1 (de) | 1995-01-19 |
EP0379594A1 (de) | 1990-08-01 |
DE68919819T2 (de) | 1995-05-04 |
EP0379594B1 (de) | 1994-12-07 |
JPH0647073B2 (ja) | 1994-06-22 |
JPH0221618A (ja) | 1990-01-24 |
EP0379594A4 (en) | 1991-07-03 |
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