ATA17652000A - METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD - Google Patents
METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHODInfo
- Publication number
- ATA17652000A ATA17652000A AT17652000A AT17652000A ATA17652000A AT A17652000 A ATA17652000 A AT A17652000A AT 17652000 A AT17652000 A AT 17652000A AT 17652000 A AT17652000 A AT 17652000A AT A17652000 A ATA17652000 A AT A17652000A
- Authority
- AT
- Austria
- Prior art keywords
- disc
- producing
- carrying
- semiconductor substrate
- shaped semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT17652000A AT411856B (en) | 2000-10-16 | 2000-10-16 | METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT17652000A AT411856B (en) | 2000-10-16 | 2000-10-16 | METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA17652000A true ATA17652000A (en) | 2003-11-15 |
AT411856B AT411856B (en) | 2004-06-25 |
Family
ID=29274640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT17652000A AT411856B (en) | 2000-10-16 | 2000-10-16 | METHOD FOR PRODUCING AN ADHESIVE CONNECTION FROM A DISC-SHAPED SEMICONDUCTOR SUBSTRATE TO A FLEXIBLE ADHESIVE TRANSPORT CARRIER, AND DEVICE FOR CARRYING OUT THIS METHOD |
Country Status (1)
Country | Link |
---|---|
AT (1) | AT411856B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008041250A1 (en) * | 2008-08-13 | 2010-02-25 | Ers Electronic Gmbh | Method and device for the thermal processing of plastic discs, in particular mold wafers |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4603466A (en) * | 1984-02-17 | 1986-08-05 | Gca Corporation | Wafer chuck |
JPS60226124A (en) * | 1984-04-25 | 1985-11-11 | Toshiba Corp | Resist coating apparatus |
JPH0651251B2 (en) * | 1987-11-18 | 1994-07-06 | 三菱化成株式会社 | Wafer manufacturing method and manufacturing apparatus therefor |
JPH01321655A (en) * | 1988-06-24 | 1989-12-27 | Oki Electric Ind Co Ltd | Device for bonding adhesive tape on semiconductor wafer |
JPH02137352A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Picking-up of semiconductor element |
US5131968A (en) * | 1990-07-31 | 1992-07-21 | Motorola, Inc. | Gradient chuck method for wafer bonding employing a convex pressure |
US5273615A (en) * | 1992-04-06 | 1993-12-28 | Motorola, Inc. | Apparatus and method for handling fragile semiconductor wafers |
GB9618620D0 (en) * | 1996-09-06 | 1996-10-16 | Electrotech Equipments Ltd | A method of forming a layer |
US5809987A (en) * | 1996-11-26 | 1998-09-22 | Micron Technology,Inc. | Apparatus for reducing damage to wafer cutting blades during wafer dicing |
US6080263A (en) * | 1997-05-30 | 2000-06-27 | Lintec Corporation | Method and apparatus for applying a protecting film to a semiconductor wafer |
DE69914418T2 (en) * | 1998-08-10 | 2004-12-02 | Lintec Corp. | Dicing tape and method for cutting a semiconductor wafer |
-
2000
- 2000-10-16 AT AT17652000A patent/AT411856B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AT411856B (en) | 2004-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |