ATA14152003A - THIN-LAYER ASSEMBLY AND METHOD FOR PRODUCING SUCH A THIN-LAYER ASSEMBLY - Google Patents

THIN-LAYER ASSEMBLY AND METHOD FOR PRODUCING SUCH A THIN-LAYER ASSEMBLY

Info

Publication number
ATA14152003A
ATA14152003A AT0141503A AT14152003A ATA14152003A AT A14152003 A ATA14152003 A AT A14152003A AT 0141503 A AT0141503 A AT 0141503A AT 14152003 A AT14152003 A AT 14152003A AT A14152003 A ATA14152003 A AT A14152003A
Authority
AT
Austria
Prior art keywords
thin
layer assembly
producing
assembly
layer
Prior art date
Application number
AT0141503A
Other languages
German (de)
Other versions
AT413170B (en
Inventor
Markus Dipl Ing Dr Wuchse
Nikolai Dipl Ing Haslebner
Ronald Frosch
Manfred Dipl Ing Dr Riedler
Guenther Dipl Ing Dr Leising
Original Assignee
Austria Tech & System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Austria Tech & System Tech filed Critical Austria Tech & System Tech
Priority to AT0141503A priority Critical patent/AT413170B/en
Priority to AT0089404A priority patent/AT500259B1/en
Priority to PCT/AT2004/000308 priority patent/WO2005025282A1/en
Priority to US10/568,563 priority patent/US7551454B2/en
Priority to CA002537998A priority patent/CA2537998A1/en
Priority to CNA2004800259133A priority patent/CN1849852A/en
Priority to DE502004007078T priority patent/DE502004007078D1/en
Priority to EP04761030A priority patent/EP1665911B1/en
Priority to JP2006525565A priority patent/JP5154080B2/en
Priority to KR1020067004783A priority patent/KR101120003B1/en
Priority to AT04761030T priority patent/ATE394909T1/en
Publication of ATA14152003A publication Critical patent/ATA14152003A/en
Application granted granted Critical
Publication of AT413170B publication Critical patent/AT413170B/en
Priority to US12/412,934 priority patent/US20090184090A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
AT0141503A 2003-09-09 2003-09-09 Thin film arrangement has substrate in form of circuit board with insulating material base body, metal lamination as conducting coating forming base electrode and flattened at thin film component position AT413170B (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
AT0141503A AT413170B (en) 2003-09-09 2003-09-09 Thin film arrangement has substrate in form of circuit board with insulating material base body, metal lamination as conducting coating forming base electrode and flattened at thin film component position
AT0089404A AT500259B1 (en) 2003-09-09 2004-05-24 THIN-LAYER ASSEMBLY AND METHOD FOR PRODUCING SUCH A THIN-LAYER ASSEMBLY
US10/568,563 US7551454B2 (en) 2003-09-09 2004-09-09 Thin-film assembly and method for producing said assembly
CA002537998A CA2537998A1 (en) 2003-09-09 2004-09-09 Thin-film assembly and method for producing said assembly
CNA2004800259133A CN1849852A (en) 2003-09-09 2004-09-09 Thin-film assembly and method for producing said assembly
DE502004007078T DE502004007078D1 (en) 2003-09-09 2004-09-09 THIN-LAYER ASSEMBLY AND METHOD FOR PRODUCING SUCH A THIN-LAYER ASSEMBLY
PCT/AT2004/000308 WO2005025282A1 (en) 2003-09-09 2004-09-09 Thin-film assembly and method for producing said assembly
EP04761030A EP1665911B1 (en) 2003-09-09 2004-09-09 Thin-film assembly and method for producing said assembly
JP2006525565A JP5154080B2 (en) 2003-09-09 2004-09-09 Thin film assembly and method of manufacturing thin film assembly
KR1020067004783A KR101120003B1 (en) 2003-09-09 2004-09-09 Thin-film assembly and method for producing said assembly
AT04761030T ATE394909T1 (en) 2003-09-09 2004-09-09 THIN FILM ARRANGEMENT AND METHOD FOR PRODUCING SUCH A THIN FILM ARRANGEMENT
US12/412,934 US20090184090A1 (en) 2003-09-09 2009-03-27 Thin-film assembly and method for producing said assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0141503A AT413170B (en) 2003-09-09 2003-09-09 Thin film arrangement has substrate in form of circuit board with insulating material base body, metal lamination as conducting coating forming base electrode and flattened at thin film component position

Publications (2)

Publication Number Publication Date
ATA14152003A true ATA14152003A (en) 2005-04-15
AT413170B AT413170B (en) 2005-11-15

Family

ID=34427297

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0141503A AT413170B (en) 2003-09-09 2003-09-09 Thin film arrangement has substrate in form of circuit board with insulating material base body, metal lamination as conducting coating forming base electrode and flattened at thin film component position

Country Status (2)

Country Link
CN (1) CN1849852A (en)
AT (1) AT413170B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474394B (en) * 2013-09-11 2015-07-08 华进半导体封装先导技术研发中心有限公司 TSV process method without metal CMP
CN103884751A (en) * 2014-04-18 2014-06-25 苏州怡拓生物传感技术有限公司 Continuous production method of serial biosensor for blood quick detection
KR102524535B1 (en) * 2016-03-29 2023-04-24 삼성디스플레이 주식회사 Display device
US10178764B2 (en) * 2017-06-05 2019-01-08 Waymo Llc PCB optical isolation by nonuniform catch pad stack

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216259A (en) * 1986-03-17 1987-09-22 Fujitsu Ltd Manufacture and structure of hybrid integrated circuit
US4839558A (en) * 1988-05-23 1989-06-13 Hamilton Standard Controls, Inc. Integrated DC electroluminescent display system
WO1997003460A1 (en) * 1995-07-12 1997-01-30 Hoya Corporation Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip
JP4345153B2 (en) * 1999-09-27 2009-10-14 ソニー株式会社 Manufacturing method of video display device

Also Published As

Publication number Publication date
AT413170B (en) 2005-11-15
CN1849852A (en) 2006-10-18

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Legal Events

Date Code Title Description
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