AT290650B - Verfahren zur Herstellung von mindestens einem Träger mit teilweise frei aus dem Träger herausragenden Zuleitungen für eine miniaturisierte Schaltung mit einem oder mehreren miniaturisierten Schaltelementen - Google Patents

Verfahren zur Herstellung von mindestens einem Träger mit teilweise frei aus dem Träger herausragenden Zuleitungen für eine miniaturisierte Schaltung mit einem oder mehreren miniaturisierten Schaltelementen

Info

Publication number
AT290650B
AT290650B AT577367A AT577367A AT290650B AT 290650 B AT290650 B AT 290650B AT 577367 A AT577367 A AT 577367A AT 577367 A AT577367 A AT 577367A AT 290650 B AT290650 B AT 290650B
Authority
AT
Austria
Prior art keywords
carrier
miniaturized
production
switching elements
partially protruding
Prior art date
Application number
AT577367A
Other languages
German (de)
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT290650B publication Critical patent/AT290650B/de

Links

Classifications

    • H10W99/00—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AT577367A 1966-06-23 1967-06-21 Verfahren zur Herstellung von mindestens einem Träger mit teilweise frei aus dem Träger herausragenden Zuleitungen für eine miniaturisierte Schaltung mit einem oder mehreren miniaturisierten Schaltelementen AT290650B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6608701A NL6608701A (enExample) 1966-06-23 1966-06-23

Publications (1)

Publication Number Publication Date
AT290650B true AT290650B (de) 1971-06-11

Family

ID=19796957

Family Applications (1)

Application Number Title Priority Date Filing Date
AT577367A AT290650B (de) 1966-06-23 1967-06-21 Verfahren zur Herstellung von mindestens einem Träger mit teilweise frei aus dem Träger herausragenden Zuleitungen für eine miniaturisierte Schaltung mit einem oder mehreren miniaturisierten Schaltelementen

Country Status (9)

Country Link
US (1) US3575822A (enExample)
AT (1) AT290650B (enExample)
BE (1) BE700288A (enExample)
CH (1) CH475687A (enExample)
DE (1) DE1665248C3 (enExample)
ES (1) ES342139A1 (enExample)
GB (1) GB1194894A (enExample)
NL (1) NL6608701A (enExample)
SE (1) SE330564B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
US3698076A (en) * 1970-08-03 1972-10-17 Motorola Inc Method of applying leads to an integrated circuit
US3769108A (en) * 1971-12-03 1973-10-30 Bell Telephone Labor Inc Manufacture of beam-crossovers for integrated circuits
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits

Also Published As

Publication number Publication date
US3575822A (en) 1971-04-20
BE700288A (enExample) 1967-12-21
DE1665248A1 (de) 1971-03-11
DE1665248B2 (de) 1973-04-05
CH475687A (de) 1969-07-15
SE330564B (enExample) 1970-11-23
GB1194894A (en) 1970-06-17
DE1665248C3 (de) 1973-10-18
ES342139A1 (es) 1968-10-16
NL6608701A (enExample) 1967-12-27

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee