AT283847B - Process for increasing the adhesion between metal plating and polymeric substrates - Google Patents

Process for increasing the adhesion between metal plating and polymeric substrates

Info

Publication number
AT283847B
AT283847B AT158567A AT158567A AT283847B AT 283847 B AT283847 B AT 283847B AT 158567 A AT158567 A AT 158567A AT 158567 A AT158567 A AT 158567A AT 283847 B AT283847 B AT 283847B
Authority
AT
Austria
Prior art keywords
adhesion
increasing
metal plating
polymeric substrates
polymeric
Prior art date
Application number
AT158567A
Other languages
German (de)
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Application granted granted Critical
Publication of AT283847B publication Critical patent/AT283847B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/927—Polyolefin, e.g. polyethylene, polypropylene
AT158567A 1966-02-18 1967-02-17 Process for increasing the adhesion between metal plating and polymeric substrates AT283847B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52838966A 1966-02-18 1966-02-18

Publications (1)

Publication Number Publication Date
AT283847B true AT283847B (en) 1970-08-25

Family

ID=24105494

Family Applications (1)

Application Number Title Priority Date Filing Date
AT158567A AT283847B (en) 1966-02-18 1967-02-17 Process for increasing the adhesion between metal plating and polymeric substrates

Country Status (7)

Country Link
US (1) US3556955A (en)
AT (1) AT283847B (en)
CH (1) CH487255A (en)
DE (1) DE1621372B2 (en)
GB (1) GB1183763A (en)
NL (1) NL142456B (en)
SE (1) SE348005B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6908381A (en) * 1969-06-03 1970-12-07
US3866288A (en) * 1969-07-01 1975-02-18 Jean Claude Bernard Electroplated isotactic polypropylene
US3663377A (en) * 1970-05-08 1972-05-16 Habet M Khelghatian Electroplatable polyolefins
US3716392A (en) * 1970-05-11 1973-02-13 Macdermid Inc Compositions for and methods of improving adhesion of plated metal on plastic substrates
US4071656A (en) * 1971-01-22 1978-01-31 Arco Polymers, Inc. Plated polypropylene composition
US3751287A (en) * 1971-06-11 1973-08-07 Union Carbide Corp Method for incorporating an adhesion promoter into a polymeric substrate
US3769061A (en) * 1971-06-14 1973-10-30 Shipley Co Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
US3935081A (en) * 1973-08-14 1976-01-27 Phillips Petroleum Company Density control for electroplatable polymer compositions
JPS5911249A (en) * 1982-07-09 1984-01-20 住友化学工業株式会社 Polypropylene group resin film for evaporating aluminum
US5264288A (en) * 1992-10-01 1993-11-23 Ppg Industries, Inc. Electroless process using silylated polyamine-noble metal complexes
US5332465A (en) * 1993-09-08 1994-07-26 Macdermid, Incorporated Process for preparing plastic surfaces to be plated
US5413817A (en) * 1993-11-05 1995-05-09 General Electric Company Method for adhering metal coatings to polyphenylene ether-polystyrene articles
DE19536961A1 (en) * 1995-10-04 1997-04-10 Henkel Kgaa Polyolefin-based molded parts and films with permanently improved surface properties
WO2001077419A2 (en) * 2000-04-05 2001-10-18 Decoma Exterior Trim Inc. Process for the direct metal-plating of a plastic substrate
US6981318B2 (en) * 2002-10-22 2006-01-03 Jetta Company Limited Printed circuit board manufacturing method
JP2007051886A (en) * 2005-08-16 2007-03-01 Fujifilm Corp Substrate for sensor
US9044715B2 (en) * 2007-08-22 2015-06-02 Colorado School Of Mines Unsupported palladium alloy membranes and methods of making same
US8974860B2 (en) * 2009-06-19 2015-03-10 Robert Hamilton Selective deposition of metal on plastic substrates
WO2016103160A1 (en) 2014-12-23 2016-06-30 Sabic Global Technologies B.V. Platable resin compositions

Also Published As

Publication number Publication date
GB1183763A (en) 1970-03-11
NL142456B (en) 1974-06-17
SE348005B (en) 1972-08-21
NL6702406A (en) 1967-08-21
DE1621372B2 (en) 1976-02-12
US3556955A (en) 1971-01-19
CH487255A (en) 1970-03-15
DE1621372A1 (en) 1971-05-06

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee