AT261767B - Verfahren zum Abtragen, insbesondere zum Perforieren von Kunststoffen - Google Patents

Verfahren zum Abtragen, insbesondere zum Perforieren von Kunststoffen

Info

Publication number
AT261767B
AT261767B AT677765A AT677765A AT261767B AT 261767 B AT261767 B AT 261767B AT 677765 A AT677765 A AT 677765A AT 677765 A AT677765 A AT 677765A AT 261767 B AT261767 B AT 261767B
Authority
AT
Austria
Prior art keywords
perforating
plastics
perforating plastics
Prior art date
Application number
AT677765A
Other languages
English (en)
Original Assignee
Steigerwald Gmbh K H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steigerwald Gmbh K H filed Critical Steigerwald Gmbh K H
Application granted granted Critical
Publication of AT261767B publication Critical patent/AT261767B/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • B23K15/085—Boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B26F1/31—Perforating by non-mechanical means, e.g. by fluid jet by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
AT677765A 1964-07-24 1965-07-23 Verfahren zum Abtragen, insbesondere zum Perforieren von Kunststoffen AT261767B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEST22452A DE1301209B (de) 1964-07-24 1964-07-24 Verfahren zum Abtragen, insbesondere zum Perforieren von flexiblen Kunststoffen

Publications (1)

Publication Number Publication Date
AT261767B true AT261767B (de) 1968-05-10

Family

ID=7459388

Family Applications (1)

Application Number Title Priority Date Filing Date
AT677765A AT261767B (de) 1964-07-24 1965-07-23 Verfahren zum Abtragen, insbesondere zum Perforieren von Kunststoffen

Country Status (7)

Country Link
US (1) US3371190A (de)
AT (1) AT261767B (de)
CH (1) CH426036A (de)
DE (1) DE1301209B (de)
FR (1) FR1441218A (de)
GB (1) GB1089285A (de)
NL (1) NL6509427A (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6807439A (de) * 1968-05-27 1969-12-01
US3622751A (en) * 1969-06-12 1971-11-23 Cons Paper Bahamas Ltd Method and apparatus for electrically perforating sheet or web material
US3696742A (en) * 1969-10-06 1972-10-10 Monsanto Res Corp Method of making a stencil for screen-printing using a laser beam
US3846521A (en) * 1971-02-03 1974-11-05 Union Carbide Corp Low energy electron beam treatment of polymeric films, and apparatus therefore
DE2449264A1 (de) * 1974-10-16 1976-04-22 Steigerwald Strahltech Verfahren zum energiestrahl-perforieren, insbesondere elektronenstrahl-perforieren, von mehrschichtigem kunstleder
US4032743A (en) * 1975-06-27 1977-06-28 Marvel Engineering Company Laser microperforator
JPS57209786A (en) * 1981-06-17 1982-12-23 Hitachi Ltd Electron beam machining device
DD225625A1 (de) * 1983-12-20 1985-08-07 Medizin Labortechnik Veb K Verfahren zur herstellung eines separators
US4879451A (en) * 1988-07-14 1989-11-07 Sun-Flex Company, Inc. Laser cut video display terminal filter screen
DE4031547A1 (de) * 1990-10-05 1992-04-09 Hell Rudolf Dr Ing Gmbh Verfahren und vorrichtung zur herstellung von texturwalzen
DE4031545A1 (de) * 1990-10-05 1992-04-09 Hell Rudolf Dr Ing Gmbh Verfahren und vorrichtung zur herstellung einer texturwalze
DE4031546A1 (de) * 1990-10-05 1992-04-09 Hell Rudolf Dr Ing Gmbh Verfahren und vorrichtung zur herstellung einer texturwalze
US5330908A (en) * 1992-12-23 1994-07-19 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration High density cell culture system
CN103448096B (zh) * 2013-08-27 2015-06-17 北京科电微波电子有限公司 高压电子束透气皮革微孔加工系统
DE102014004035A1 (de) * 2014-03-21 2015-10-08 Probeam Ag & Co. Kgaa Verfahren zum Erzeugen kleiner Bohrungen in Werkstücken
US9890310B2 (en) * 2014-08-15 2018-02-13 Douglas Dynamics, Llc Material mixing system
CN106564093B (zh) * 2016-06-15 2018-10-19 王小六 一种皮革电弧穿透系统的使用方法
AU2019383946A1 (en) * 2018-11-20 2021-09-02 Micon Technology, Inc. Electron beam irradiated product and methods
US11440151B2 (en) * 2019-06-07 2022-09-13 Applied Materials Israel Ltd. Milling a multi-layered object

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1033816B (de) * 1952-07-25 1958-07-10 Zeiss Carl Fa Verfahren zum Bohren feiner Loecher
US2668133A (en) * 1953-04-13 1954-02-02 United Shoe Machinery Corp Adhesive bonding processes
US2861166A (en) * 1955-03-14 1958-11-18 Jr William W Cargill Method and apparatus for hot machining
IT559958A (de) * 1955-07-06 1900-01-01
NL240710A (de) * 1958-07-01
US2978569A (en) * 1958-11-07 1961-04-04 Gen Motors Corp Method and apparatus for forming holes in sheet metal
FR1353054A (fr) * 1963-01-12 1964-02-21 Alsacienne D Electronique Et D Procédé de soudage par bombardement électronique
US3293587A (en) * 1965-10-20 1966-12-20 Sprague Electric Co Electrical resistor and the like

Also Published As

Publication number Publication date
US3371190A (en) 1968-02-27
DE1301209B (de) 1969-08-14
CH426036A (de) 1966-12-15
NL6509427A (de) 1966-01-25
FR1441218A (fr) 1966-06-03
GB1089285A (en) 1967-11-01

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