AR095295A1 - Dispositivo de sistema electromecánico (ems) y método para la elaboración de dicho dispositivo - Google Patents

Dispositivo de sistema electromecánico (ems) y método para la elaboración de dicho dispositivo

Info

Publication number
AR095295A1
AR095295A1 ARP140100089A ARP140100089A AR095295A1 AR 095295 A1 AR095295 A1 AR 095295A1 AR P140100089 A ARP140100089 A AR P140100089A AR P140100089 A ARP140100089 A AR P140100089A AR 095295 A1 AR095295 A1 AR 095295A1
Authority
AR
Argentina
Prior art keywords
wall
electrode
walls
transport
define
Prior art date
Application number
ARP140100089A
Other languages
English (en)
Inventor
J Brosnihan Timothy
S Payne Richard
B Andersson Mark
Lodewyk Steyn Jasper
W Iv Hagood Nesbitt
H Wu Joyce
Original Assignee
Pixtronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pixtronix Inc filed Critical Pixtronix Inc
Publication of AR095295A1 publication Critical patent/AR095295A1/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00166—Electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

Dispositivo y método para sistemas electromecánicos que tienen vigas de las paredes laterales. En un aspecto, un dispositivo incluye un sustrato que tiene un primer electrodo y un segundo electrodo, y un transporte móvil integrado en forma monolítica con el sustrato, y que tiene una primera pared, una segunda pared, y una base. Cada una de la primera y la segunda pared tiene una primera dimensión por lo menos cuatro veces más grande que una segunda dimensión. La primera y la segunda pared definen sustancialmente lados verticales paralelos del transporte, y la base está posicionada en forma ortogonal a la primera y la segunda pared y forma un fondo horizontal del transporte, lo que proporciona un soporte estructural a la primera y la segunda pared. La primera pared y el primer electrodo definen un primer condensador, y la segunda pared y el segundo electrodo definen un segundo condensador.
ARP140100089A 2013-01-09 2014-01-09 Dispositivo de sistema electromecánico (ems) y método para la elaboración de dicho dispositivo AR095295A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/737,439 US20140192061A1 (en) 2013-01-09 2013-01-09 Electromechanical systems having sidewall beams

Publications (1)

Publication Number Publication Date
AR095295A1 true AR095295A1 (es) 2015-10-07

Family

ID=50002879

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP140100089A AR095295A1 (es) 2013-01-09 2014-01-09 Dispositivo de sistema electromecánico (ems) y método para la elaboración de dicho dispositivo

Country Status (7)

Country Link
US (1) US20140192061A1 (es)
JP (1) JP2016511838A (es)
KR (1) KR20150106427A (es)
CN (1) CN105051548A (es)
AR (1) AR095295A1 (es)
TW (1) TW201439641A (es)
WO (1) WO2014109984A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9332368B1 (en) * 2013-07-08 2016-05-03 Google Inc. Accelerometer or transducer on a device
KR102098261B1 (ko) 2014-06-18 2020-04-08 엑스-셀레프린트 리미티드 마이크로 어셈블링된 led 디스플레이들
EP2966454B1 (fr) * 2014-07-07 2017-08-30 EM Microelectronic-Marin SA Procédé de mesure d'un paramètre physique, et circuit électronique pour sa mise en oeuvre
US10230048B2 (en) 2015-09-29 2019-03-12 X-Celeprint Limited OLEDs for micro transfer printing
JP6741933B2 (ja) 2015-10-02 2020-08-19 ミツミ電機株式会社 光走査モジュール、光走査制御装置
US10199546B2 (en) * 2016-04-05 2019-02-05 X-Celeprint Limited Color-filter device
US10867538B1 (en) * 2019-03-05 2020-12-15 Facebook Technologies, Llc Systems and methods for transferring an image to an array of emissive sub pixels
US11408911B2 (en) * 2019-07-17 2022-08-09 Honeywell International Inc. Optomechanical structure with corrugated edge
US11696252B2 (en) * 2019-09-13 2023-07-04 Hunter Douglas Inc. Systems and methods for determining proximity of architectural structure coverings
US11076225B2 (en) 2019-12-28 2021-07-27 Intel Corporation Haptics and microphone display integration
EP4162282A1 (en) 2020-06-08 2023-04-12 Analog Devices, Inc. Drive and sense stress relief apparatus
EP4162281A1 (en) 2020-06-08 2023-04-12 Analog Devices, Inc. Stress-relief mems gyroscope
US11698257B2 (en) 2020-08-24 2023-07-11 Analog Devices, Inc. Isotropic attenuated motion gyroscope

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149190A (en) * 1993-05-26 2000-11-21 Kionix, Inc. Micromechanical accelerometer for automotive applications
US7405852B2 (en) * 2005-02-23 2008-07-29 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US8413509B2 (en) * 2008-04-14 2013-04-09 Freescale Semiconductor, Inc. Spring member for use in a microelectromechanical systems sensor
US8169679B2 (en) * 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
JP5649810B2 (ja) * 2009-10-29 2015-01-07 日立オートモティブシステムズ株式会社 静電容量式センサ
KR101630493B1 (ko) * 2009-12-29 2016-06-14 퀄컴 엠이엠에스 테크놀로지스, 인크. 보조 전극 구조물을 갖는 코팅된 광 방향 전환 조명 장치

Also Published As

Publication number Publication date
US20140192061A1 (en) 2014-07-10
JP2016511838A (ja) 2016-04-21
TW201439641A (zh) 2014-10-16
KR20150106427A (ko) 2015-09-21
WO2014109984A1 (en) 2014-07-17
CN105051548A (zh) 2015-11-11

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