AR080097A1 - Elemento de centro de procesamiento de datos modular y elemento de refrigeracion de centro de procesamiento de datos modular - Google Patents

Elemento de centro de procesamiento de datos modular y elemento de refrigeracion de centro de procesamiento de datos modular

Info

Publication number
AR080097A1
AR080097A1 ARP110100331A ARP110100331A AR080097A1 AR 080097 A1 AR080097 A1 AR 080097A1 AR P110100331 A ARP110100331 A AR P110100331A AR P110100331 A ARP110100331 A AR P110100331A AR 080097 A1 AR080097 A1 AR 080097A1
Authority
AR
Argentina
Prior art keywords
data processing
processing center
lower panel
modular data
supports
Prior art date
Application number
ARP110100331A
Other languages
English (en)
Spanish (es)
Inventor
Rolph Haspers
Nico Reuss
Original Assignee
Dataxenter Ip B V
Kgg Dataxenter Holding B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dataxenter Ip B V, Kgg Dataxenter Holding B V filed Critical Dataxenter Ip B V
Publication of AR080097A1 publication Critical patent/AR080097A1/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H5/00—Buildings or groups of buildings for industrial or agricultural purposes
    • E04H2005/005—Buildings for data processing centers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Telephone Exchanges (AREA)
ARP110100331A 2010-02-01 2011-02-01 Elemento de centro de procesamiento de datos modular y elemento de refrigeracion de centro de procesamiento de datos modular AR080097A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20100152323 EP2354378A1 (en) 2010-02-01 2010-02-01 Modular datacenter element and modular datacenter cooling element

Publications (1)

Publication Number Publication Date
AR080097A1 true AR080097A1 (es) 2012-03-14

Family

ID=42286678

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP110100331A AR080097A1 (es) 2010-02-01 2011-02-01 Elemento de centro de procesamiento de datos modular y elemento de refrigeracion de centro de procesamiento de datos modular

Country Status (7)

Country Link
US (1) US20130061624A1 (enExample)
EP (2) EP2354378A1 (enExample)
CN (1) CN102812192A (enExample)
AR (1) AR080097A1 (enExample)
IN (1) IN2012DN06568A (enExample)
TW (1) TW201209557A (enExample)
WO (1) WO2011092333A1 (enExample)

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US9927187B2 (en) 2012-09-28 2018-03-27 Hewlett Packard Enterprise Development Lp Cooling assembly
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US9803937B2 (en) 2013-01-31 2017-10-31 Hewlett Packard Enterprise Development Lp Liquid cooling
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US10455726B2 (en) 2014-09-30 2019-10-22 Hewlett Packard Enterprise Development Lp Modular cooling
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JP2018512649A (ja) * 2015-02-17 2018-05-17 ヴァートコム インク モジュール式高層データセンタおよびその方法
CN104837318A (zh) * 2015-05-04 2015-08-12 亚翔系统集成科技（苏州）股份有限公司 一种模块式数据处理中心及其空调方法
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PL3550244T3 (pl) 2018-04-06 2023-05-02 Ovh Zespół chłodzący i sposób jego instalacji
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CN108834363B (zh) * 2018-06-01 2020-07-10 中国移动通信集团设计院有限公司 微模块
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Also Published As

Publication number Publication date
EP2354378A1 (en) 2011-08-10
CN102812192A (zh) 2012-12-05
EP2531673A1 (en) 2012-12-12
TW201209557A (en) 2012-03-01
US20130061624A1 (en) 2013-03-14
WO2011092333A1 (en) 2011-08-04
IN2012DN06568A (enExample) 2015-10-23

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