WO2024018536A1

WO2024018536A1 - Heat exchanger, electronic component handling device, and electronic component testing device

Info

Publication number: WO2024018536A1
Application number: PCT/JP2022/028100
Authority: WO
Inventors: 祐也山田; 有朋菊池; ギュンタージェセラー; マーリンウォルナー
Original assignee: 株式会社アドバンテスト
Priority date: 2022-07-19
Filing date: 2022-07-19
Publication date: 2024-01-25

Abstract

A thermal head 25 is a heat exchanger that exchanges heat with a DUT 100, and comprises a main body part 30 having a flow path 34 through which a fluid for temperature adjustment of the DUT 100 can flow, and a heater 40 placed in the flow path 34 so as to be located at the bottom of the flow path 34.

Description

Heat exchangers, electronic component handling equipment, and electronic component testing equipment

The present invention provides a heat exchanger that contacts the DUT and exchanges heat with the DUT when testing an electronic component under test (hereinafter also simply referred to as a "DUT" (Device Under Test)) such as a semiconductor integrated circuit element. The present invention relates to an exchanger, and an electronic component handling device and an electronic component testing device equipped with the heat exchanger.

An electronic component testing device is known in which a heater and a cooling device are embedded in a contact arm that sucks and holds a DUT (see, for example, Patent Document 1 (paragraph [0037]). The DUT is tested by pressing the DUT into the socket while adjusting the temperature of the DUT.

International Publication No. 2007/094034

When both the heater and the cooling device are buried in the contact arm, as in the electronic component testing equipment mentioned above, either the heater or the cooling device must be placed away from the DUT, which makes it difficult to control the temperature of the DUT. The problem is that it is difficult to increase the speed.

The problem to be solved by the present invention is to provide a heat exchanger, an electronic component handling device, and an electronic component testing device that can speed up the temperature control of a DUT.

[1] Aspect 1 of the present invention is a heat exchanger that exchanges heat with a DUT or a carrier containing the DUT, the heat exchanger having a first flow path through which a fluid for adjusting the temperature of the DUT can flow. and a heater disposed in the first flow path so as to be located at the bottom of the first flow path.

[2] Aspect 2 of the present invention is the heat exchanger of aspect 1, wherein the first flow path has a meandering planar shape with a folded portion, and the heater is arranged in the heat exchanger of aspect 1. The heat exchanger may have a planar shape corresponding to the above.

[3] Aspect 3 of the present invention is the heat exchanger according to

aspect

1 or 2, wherein the heater is arranged in the first flow path so as to be in contact with the bottom surface of the first flow path. It may also be an exchanger.

[4] Aspect 4 of the present invention is the heat exchanger of Aspects 1 to 3, wherein the heat exchanger has thermal insulation, and the heater has a surface facing the bottom surface of the first flow path. The heat exchanger may include a heat insulating member that covers the surface opposite to the heat exchanger.

[5] Aspect 5 of the present invention is the heat exchanger of Aspects 1 to 4, wherein the heat exchanger has electrical insulation, and has a surface facing the bottom surface of the first flow path in the heater. The heat exchanger may include an electrically insulating member covering the opposite side.

[6] Aspect 6 of the present invention is the heat exchanger according to aspect 5, wherein the heat exchanger includes a heat insulating member that covers a surface of the heater opposite to a surface facing the bottom surface of the first flow path. A heat exchanger may be provided in which the heat insulating member and the electrically insulating member are the same member.

[7] Aspect 7 of the present invention is a heat exchanger according to aspects 1 to 6, wherein the heat exchanger is provided with a pressing mechanism that presses the heater toward the bottom surface of the first flow path. It may be.

[8] Aspect 8 of the present invention is the heat exchanger according to aspect 7, wherein the pressing mechanism is provided in the first flow path so as to extend along the depth direction of the first flow path. The heat exchanger may include a coil spring arranged, and the coil spring biases the heater along the depth direction of the first flow path.

[9] Aspect 9 of the present invention is the heat exchanger according to aspect 8, wherein the pressing mechanism includes a plate member attached to the tip of the coil spring, and the plate member is substantially connected to the heater. The heat exchanger may be disposed within the first flow path so as to be parallel to the flow path.

[10] Aspect 10 of the present invention is the heat exchanger according to aspects 7 to 9, wherein the heat exchanger has thermal insulation and includes a heat insulating member interposed between the pressing mechanism and the heater. It may also be a heat exchanger equipped with a heat exchanger.

[11] Aspect 11 of the present invention is the heat exchanger according to aspects 7 to 10, wherein the heat exchanger has electrical insulation, and an electrically insulating member interposed between the pressing mechanism and the heater. It may be a heat exchanger equipped with.

[12] A twelfth aspect of the present invention is the heat exchanger according to aspect 11, wherein the heat exchanger includes a heat insulating member having thermal insulation and interposed between the pressing mechanism and the heater. Alternatively, the heat insulating member and the electrically insulating member may be a heat exchanger made of the same member.

[13] Aspect 13 of the present invention is a heat exchanger that exchanges heat with a DUT or a carrier containing the DUT, the heat exchanger having a first flow path through which a fluid for temperature adjustment of the DUT can flow. and a heater embedded in the main body so as to correspond to the bottom of the first flow path, and the first flow path has a meandering planar shape with a folded portion. The heater is a heat exchanger having a planar shape corresponding to the first flow path.

[14] Aspect 14 of the present invention is the heat exchanger according to aspect 13, wherein the main body portion includes a heat sink in which the first flow path is formed and the heater is embedded, and the heat sink includes: The heat exchanger may be made of aluminum nitride.

[15] Aspect 15 of the present invention is the heat exchanger of Aspects 1 to 14, in which the heater may be a heat exchanger equipped with a planar or linear heating element that generates heat when energized.

[16] Aspect 16 of the present invention is the heat exchanger according to aspect 15, in which the heating element may include a metal foil.

[17] Aspect 17 of the present invention may be the heat exchanger of aspect 15, in which the heater has electrical insulation and includes an insulating layer covering the heating element.

[18] Aspect 18 of the present invention may be the heat exchanger according to aspect 17, in which the insulating layer is made of aluminum nitride.

[19] Aspect 19 of the present invention is a heat exchanger according to aspects 1 to 18, wherein the interval between the first channels is narrower than the width of the first channel. Good too.

[20] Aspect 20 of the present invention may be the heat exchanger of Aspects 1 to 19, in which the bottom surface of the main body portion is a contact surface that contacts the DUT or the carrier.

[21] In the aspect 21 of the present invention, in the heat exchanger of aspects 1 to 20, the heat exchanger may be a heat exchanger equipped with a second flow path for adsorption and holding of the DUT.

[22] Aspect 22 of the present invention is the heat exchanger of Aspects 1 to 21, wherein the main body portion has an inlet communicating with the first flow path and an outlet communicating with the first flow path. It may also be a heat exchanger equipped with a heat exchanger.

[23] Aspect 23 of the present invention is the heat exchanger of Aspects 1 to 22, in which, in plan view, the heater is folded back so as not to overlap with a portion between the mutually adjacent first flow paths. It may also be a heat exchanger that is located.

[24] Aspect 24 of the present invention is the heat exchanger according to aspects 1 to 23, wherein the main body includes a heat sink having fins forming the first flow path, and in plan view, the heater The heat exchanger may be arranged so as not to overlap the fins.

[25] Aspect 25 of the present invention may be the heat exchanger of aspects 1 to 24, in which the fluid is a gas.

[26] Aspect 26 of the present invention is an electronic component handling device for handling a DUT or a carrier containing the DUT, in which the heat exchanger of Aspects 1 to 25 and the heat exchanger are attached. and a moving device that moves the heat exchanger, and the moving device holds the DUT or the carrier so that the heat exchanger comes into contact with the DUT or the carrier, and the moving device is an electronic component handling device that presses the DUT or the carrier into a socket by moving the DUT or the carrier together with the heat exchanger.

[27] Aspect 27 of the present invention is the electronic component handling device according to aspect 26, comprising a connection portion to which a fluid supply source for supplying the fluid to the first flow path is connected. Good too.

[28] Aspect 28 of the present invention is an electronic component testing device for testing a DUT, comprising the electronic component handling device of aspect 26 or 27 and a test device main body having a socket. .

In the present invention, the heater is disposed within the first flow path so as to be located at the bottom of the first flow path, or the heater having a planar shape corresponding to the first flow path is located at the bottom of the first flow path. It is buried in the main body so as to correspond to the bottom. Therefore, in the present invention, since both the heater and the first flow path can be placed near the DUT, it is possible to speed up the temperature control of the DUT.

FIG. 1 is a block diagram showing the configuration of an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a plan view showing a thermal head in an embodiment of the present invention. FIG. 3 is a cross-sectional view of the thermal head according to the embodiment of the present invention, taken along line III-III in FIG. 2. FIG. 4 is a sectional view of the thermal head in the embodiment of the present invention, taken along the line IV-IV in FIG. 2. FIG. 5 is a plan view showing a heat sink of a thermal head in an embodiment of the present invention. FIG. 6 is a plan view showing the heater of the thermal head in the embodiment of the present invention. FIG. 7 is a plan view showing an insulating member of a thermal head in an embodiment of the present invention. FIG. 8 is a plan view showing the pressing mechanism of the thermal head in the embodiment of the present invention. FIG. 9 is a plan view showing a modification of the heater in the embodiment of the present invention. FIG. 10 is a sectional view showing a modified example of the heater in the embodiment of the present invention, and is a view taken along the line XX in FIG. 9. FIG. 11 is a plan view showing a heater-integrated heat sink in another embodiment of the present invention. FIG. 12 is a cross-sectional view showing a heater-integrated heat sink according to another embodiment of the present invention, taken along line XII-XII in FIG. 11.

Hereinafter, embodiments of the present invention will be described based on the drawings.

FIG. 1 is a block diagram showing the configuration of an electronic component testing apparatus 1 in an embodiment of the present invention.

The electronic component testing device 1 in this embodiment is a device that tests the electrical characteristics of a DUT 100, which is an electronic component under test. As shown in FIG. 1, this electronic component testing apparatus 1 includes a tester 2 and a handler 10. This tester 2 corresponds to an example of a "testing device main body" in an aspect of the present invention, and the handler 10 corresponds to an example of an "electronic component handling device" in an aspect of the present invention.

The tester 2 tests the DUT 100 whose temperature is controlled by a thermal head (heat exchanger) 25, which will be described later. Specifically, with the DUT 100 electrically connected to the socket 6, the tester 2 inputs a test signal based on a test pattern for testing the DUT 100 to the DUT 100 via the socket 6, and performs the test. The quality of the DUT 100 is determined based on the output signal that the DUT 100 outputs in response to the signal. As shown in FIG. 1, the tester 2 includes a main frame 3 and a test head 5 connected to the main frame 3 via a cable 4. The socket 6 is attached to the upper surface of the test head 5.

The socket 6 includes a contactor 7 that comes into contact with the terminal 110 of the DUT 100 (see FIGS. 3 and 4). This contactor 7 is electrically connected to a load board (not shown) or the like disposed above the test head 5. Note that in this embodiment, a pogo pin is used as the contact 7, but something other than the pogo pin may be used as the contact 7. For example, a cantilever type probe needle, an anisotropically conductive rubber sheet, or a membrane type contactor having bumps formed on an insulating film may be used. By bringing this contact 7 into contact with the terminal 110 of the DUT 100, the socket 6 and the DUT 100 are electrically connected.

An example of the DUT 100 to be tested is an SoC (System on chip), but the DUT 100 may also be a memory device, a logic device, a digital circuit, an analog circuit, or the like. Furthermore, the DUT 100 may be a resin molded device in which a semiconductor chip is packaged with a molding material such as a resin material, or may be a bare die that is not packaged.

Furthermore, the DUT 100 in this embodiment includes a temperature detection circuit 120 that detects the temperature of the DUT 100. The temperature detection circuit 120 is, for example, a circuit including a thermal diode, and is formed on the semiconductor substrate of the DUT 100. Note that the temperature detection circuit 120 is not limited to a thermal diode. For example, the temperature detection circuit 120 may be configured using an element having temperature-dependent resistance characteristics or bandgap characteristics. Alternatively, a thermocouple may be embedded in the DUT 100 as the temperature detection circuit 120.

The handler 10 is configured to handle the DUT 100 before testing up to the socket 6, press the DUT 100 against the socket 6, and classify the DUT 100 according to the test results. As shown in FIG. 1, the handler 10 includes a contact arm 20 having a thermal head 25, a chamber 70, a coolant supply system 80, and a control device 90.

The contact arm 20 is a transport arm that holds and moves the DUT 100 and presses the DUT 100 against the socket 6. By pressing the DUT 100 against the socket 6 using the contact arm 20, the DUT 100 and the socket 6 are electrically connected. This contact arm 20 corresponds to an example of a "moving device" in an aspect of the present invention.

This contact arm 20 includes an arm body 21 and a thermal head 25. The arm body 21 can be moved and rotated on the XY plane by an actuator (not shown), and can also be moved up and down in the Z direction. A thermal head 25 is attached to the tip of this arm body 21.

The contact arm 20 is capable of suctioning and holding the DUT 100 that is in contact with the thermal head 25. Further, this contact arm 20 is capable of controlling the temperature of the DUT 100 using a thermal head 25.

The chamber 70 is a constant temperature bath made of a heat insulating material or the like. Since this chamber 70 is not easily affected by temperature changes from the surrounding environment, the temperature of the atmosphere inside the constant temperature bath can be kept constant. Although not particularly shown, the chamber 70 is provided with, for example, a refrigerant supply port, a heater, and a fan, making it possible to adjust the atmospheric temperature within the chamber 70 to a desired temperature. There is. Although not particularly limited, the temperature of this chamber 70 can be adjusted within the range of -55°C to +155°C, for example. The upper part of the test head 5 enters this chamber 70 through an opening 71, and the socket 6 is arranged in the chamber 70.

In this handler 10, the DUT 100 is transported above the socket 6 disposed in the chamber 70 by horizontally moving the arm body 21 while the DUT 100 is held by the thermal head 25. Next, the DUT 100 is pressed against the socket 6 by lowering the arm body 21 . At this time, the thermal head 25 attached to the tip of the arm body 21 is located within the chamber 70.

The configuration of the thermal head 25 of the contact arm 20 will be described below with reference to FIGS. 2 to 8 in addition to FIG. 1.

FIG. 2 is a plan view showing the thermal head 25 in the embodiment of the present invention. 3 and 4 are cross-sectional views of the thermal head 25 in the embodiment of the present invention, FIG. 3 is a view taken along line III-III in FIG. 2, and FIG. 4 is a view taken along line IV-IV in FIG. This is a diagram. FIG. 5 is a plan view showing the heat sink 31 of the thermal head 25 in the embodiment of the invention, FIG. 6 is a plan view showing the heater 40 of the thermal head 25 in the embodiment of the invention, and FIG. 7 is a plan view showing the heater 40 of the thermal head 25 in the embodiment of the invention. 8 is a plan view showing the insulating member 50 of the thermal head 25 in the embodiment, and FIG. 8 is a plan view showing the pressing mechanism 60 of the thermal head 25 in the embodiment of the present invention.

Note that in order to facilitate understanding of the relationship between the thermal head 25, DUT 100, and socket 6, FIG. Showing. In contrast, FIG. 4 illustrates a state in which the thermal head 25 is in contact with the DUT 100 and the DUT 100 and the socket 6 are in contact.

The thermal head 25 of the contact arm 20 is a heat exchanger that adjusts the temperature of the DUT 100 by exchanging heat with the DUT 100 while in contact with the DUT 100. As shown in FIGS. 2 to 4, the thermal head 25 includes a main body 30, a heater 40, an insulating member 50, and a pressing mechanism 60. This thermal head 25 corresponds to an example of a "heat exchanger" in the aspect of the present invention.

The main body portion 30 includes a heat sink 31 and a cover 35.

The heat sink 31 is made of a material with excellent thermal conductivity, such as a metal material, in order to contact the DUT 100 and exchange heat with the DUT 100. Although not particularly limited, examples of the material constituting the heat sink 31 include aluminum. Further, this heat sink 31 has an electrically insulating layer on its surface in order to ensure electrical insulation with a heater 40, which will be described later. Although not particularly limited, an aluminum oxide layer can be exemplified as a specific example of such an electrically insulating layer.

On the other hand, the cover 35 is made of a material with low thermal conductivity, such as a resin material, and is intended to suppress heat transfer from the thermal head 25 to members other than the DUT 100.

As shown in FIGS. 3 to 5, the heat sink 31 includes a base portion 32 and a plurality of (seven in this example) fins 33. The base portion 32 is a member having a rectangular annular shape with a bottom portion. Specifically, the base portion 32 includes a bottom plate 321 and side walls 322a to 322d erected on the bottom plate 321, and has a recess 323 defined by the bottom plate 321 and the side walls 322a to 322d. ing. A bottom surface (lower surface) 324 of the bottom plate 321 of the base portion 32 is a contact surface that comes into contact with the DUT 100 when the contact arm 20 holds the DUT 100 by suction.

Note that the heat sink 31 may include a TIM (Thermal Interface Material) that thermally adheres to the DUT 100 on its bottom surface. In this case, this TIM functions as the above-mentioned contact surface.

Here, the contact arm 20 presses the DUT 100 against the socket 6 with the contact surface 324 in contact with the DUT 100. That is, in addition to the function of controlling the temperature of the DUT 100, the thermal head 25 provided at the tip of the contact arm 20 also has the function of a pusher that presses the DUT 100 against the socket 6.

The plurality of fins 33 are arranged inside the recess 323 of the base portion 32. The plurality of fins 33 are arranged at regular intervals in the X direction in the figure, and are arranged parallel to each other. Further, the plurality of fins 33 are arranged alternately so that adjacent fins 33 are shifted from each other in the Y direction in the figure.

More specifically, as shown in FIG. 5, the four fins 33A are connected to the side wall 322a of the base portion 32 at one end (the upper end in FIG. 2) in plan view. A space is formed between the other end of the fin 33A (the lower end in FIG. 2) and the side wall 322c of the base portion 32. On the other hand, the three fins 33B arranged between the fins 33A are connected to the side wall 322c of the base part 32 at the other end (lower end in FIG. 2). A space is formed between one end of the fin 33B (the upper end in FIG. 2) and the side wall 322a of the base portion 32.

By adopting this arrangement of the fins 33, a flow path 34 is formed inside the heat sink 31. This flow path 34 repeatedly turns back from the -Y direction to the +Y direction in the figure at the folding part 341 and from the +Y direction to the -Y direction in the figure at the folding part 342, resulting in a meandering shape. It has a planar shape. This flow path 34 corresponds to an example of a "first flow path" in the aspect of the present invention.

A refrigerant is supplied to this flow path 34 by a refrigerant supply system 80 (see FIG. 1), which will be described later. When this refrigerant passes through the flow path 34, the refrigerant absorbs heat from the fins 33. Due to this heat absorption, the DUT 100 in contact with the bottom surface 324 of the heat sink 31 is cooled via the fins 33 of the heat sink 31 and the bottom plate 321.

In the present embodiment, the interval D (i.e., the thickness of the fins 33) between the flow channels 34 adjacent to each other by folding back is narrower than the width W of the flow channels 34 (D<W). This makes it possible to reduce the heat capacity between the flow path 34 via the fins 33 and the DUT 100 while ensuring a large area for the heater 40, so that the DUT 100 can be efficiently cooled by the refrigerant, and the heater 40 can be 40 allows the DUT 100 to be efficiently heated.

Note that the planar shape of the flow path 34 in the heat sink 31 is not particularly limited to the above as long as it has a folded portion. For example, in the present embodiment, the flow path 34 has seven folded

parts

341 and 342, but the number of folded parts that the flow passage 34 has is not particularly limited to this, and is less than seven. There may be more than 7 pieces. Further, in the present embodiment, the portion between the folded

portions

341 and 342 in the flow path 34 extends in a straight line; however, the present invention is not particularly limited to this, and the portion may extend in a curved manner. good.

Additionally, a temperature sensor 36 is embedded in this heat sink 31. This temperature sensor 36 is connected to a later-described temperature calculation section 91 of the control device 90 via a wiring 37.

The cover 35 is a plate-like member having a rectangular annular portion, as shown in FIGS. 2 to 4. The heat sink 31 described above is fitted into this cover 35, and the heat sink 31 and the cover 35 are fixed by bolts or the like (not shown). The flow path 34 of the heat sink 31 is sealed by this cover 35.

Further, this cover 35 has an opening 351 formed at a position opposite to one end (starting point, left end in FIG. 5) of the flow path 34 of the heat sink 31, and an opening 351 at a position opposite to the other end (end point) of the flow path 34 of the heat sink 31. An opening 352 is formed at a position corresponding to the right end in FIG. 5 (see FIGS. 4 and 5). The refrigerant supply system 80 is connected to one opening 351 , and the opening 351 functions as an inlet for the refrigerant supplied to the flow path 34 of the heat sink 31 . On the other hand, the other opening 352 communicates with the outside via the arm body 21, and functions as an outlet for the refrigerant discharged from the flow path 34.

Note that the arrangement of the inlet 351 and the outlet 352 is not particularly limited to the above. For example, the inlets 351 may be formed at both ends of the flow path 34, and the outlet 352 may be formed at the center of the flow path 34.

Furthermore, through

holes

325 and 353 passing through the main body 30 are formed at the four corners of the heat sink 31 and the cover 35 (that is, the main body 30). The through

holes

325 and 353 are connected to the vacuum source 95 via the arm body 21. By suctioning the through

holes

325 and 353 by the vacuum source 95, the contact arm 20 can attract and hold the DUT 100 in contact with the contact surface 324. That is, the thermal head 25 provided at the tip of the contact arm 20 has a function of adjusting the temperature of the DUT 100 and a function of a pusher, as well as a function of holding the DUT 100. A specific example of the vacuum source 95 is a vacuum pump. These through

holes

325 and 353 correspond to an example of a "second flow path" in the aspect of the present invention.

Note that the number and arrangement of the through

holes

325 and 353 provided in the main body portion 30 of the thermal head 25 are not particularly limited to the above. For example, two through holes may be provided in the main body 30 so as to be located at two corners on the same diagonal line of the main body 30. Alternatively, one through hole may be provided in the main body 30 so as to be located in the center of the main body 30.

The heater 40 is a planar heating element that generates heat when energized, and is, for example, a sheet-shaped resistance heating type heater. Although not particularly limited, the heater 40 of this embodiment is composed of only one sheet of metal foil. An example of the metal material constituting the heater 40 is stainless steel.

This heater 40 has a planar shape corresponding to the flow path 34 of the heat sink 31 described above. Specifically, as shown in FIG. 6, this heater 40 is folded back from the -Y direction in the figure to the +Y direction at the folding part 41, and from the +Y direction to the -Y direction in the figure at the folding part 42. It has a planar shape that repeats the following. That is, this heater 40 extends in a planar shape (band shape) and has a meandering planar shape. Note that the planar shape of the heater 40 is not particularly limited to the above as long as it corresponds to the flow path 34. Further, the heater 40 may extend linearly.

This heater 40 has a width narrower than the width of the flow path 34, and is arranged within the flow path 34, as shown in FIGS. 3 and 4. Specifically, this heater 40 is arranged in the flow path 34 such that the lower surface 44 of the heater 40 contacts the bottom surface 343 of the flow path 34 of the heat sink 31 (that is, the upper surface of the bottom plate 321 of the heat sink 31). ing.

This heater 40 is connected to a heater control section 92 (see FIG. 1) of a control device 90 via a terminal 45, and generates heat using electric power supplied from the heater control section 92. When the heater 40 generates heat, the heat is transmitted to the DUT 100 in contact with the bottom surface 324 of the heat sink 31 via the bottom plate 321 of the heat sink 31, thereby heating the DUT 100.

On the other hand, the heater 40 is located only within the flow path 34, and the heater 40 is not interposed between the fins 33 and the contact surface 324 of the bottom plate 321. That is, in the plan view shown in FIG. 2, the heater 40 is folded so that it does not overlap with the portion between the adjacent channels 34, and is arranged so as not to overlap with the fins 33. Therefore, the coolant passing through the flow path 34 can efficiently cool the DUT 100 via the fins 33 of the heat sink 31 and the bottom plate 321.

The insulating member 50 is a plate-shaped member made of a material that is thermally insulating and electrically insulating. As a specific material constituting this insulating member 50, for example, glass cloth can be exemplified. This insulating member 50 corresponds to an example of the "insulating member" in the aspect of the present invention, and also corresponds to an example of the "electrical insulating member" in the aspect of the present invention.

This insulating member 50 has a planar shape corresponding to the flow path 34 of the heat sink 31 described above. Specifically, as shown in FIG. 7, the insulating member 50 is folded back from the -Y direction in the figure to the +Y direction at the folding part 51, and is folded back from the +Y direction to the -Y direction in the figure at the folding part 52. It has a planar shape that repeats this. That is, the insulating member 50 extends in a planar shape (band shape) and has a meandering planar shape. Note that the planar shape of the insulating member 50 is not particularly limited to the above as long as it corresponds to the flow path 34.

This insulating member 50 has a width narrower than the width of the flow path 34 and has the same width as the width of the heater 40 described above. As shown in FIGS. 3 and 4, the insulating member 50 is placed in the flow path 34 so as to be stacked on the heater 40. Specifically, the insulating member 50 is arranged within the flow path 34 such that the lower surface of the insulating member 50 contacts the upper surface 43 of the heater 40 .

In this embodiment, the insulating member 50 has thermal insulation properties (thermal insulation function), so that thermal insulation can be established between the refrigerant flowing in the flow path 34 of the heat sink 31 and the heater 40. It is insulated (insulated). This insulating member 50 can suppress the energy input to the heater 40 from diffusing into the refrigerant flowing through the flow path 34, so that the bottom surface of the bottom plate 321 can be selectively and efficiently heated by the heater 40. , it is possible to realize an improvement in the heating rate and an improvement in energy efficiency. Furthermore, as a secondary effect, since the insulating member 50 has electrical insulation properties (electrical insulation function), dew condensation generated in the flow path 34 cooled by the refrigerant and the heater 40 can be prevented. The occurrence of short circuits can be suppressed.

Note that in this embodiment, the insulating member 50 has both a thermal insulating function and an electrical insulating function, but is not particularly limited to this. The thermal insulation function and the electrical insulation function may be realized by independent and separate members.

The pressing mechanism 60 is a mechanism that presses the heater 40 toward the bottom surface 343 of the flow path 34 of the heat sink 31. As shown in FIGS. 3, 4, and 8, this pressing mechanism 60 includes a plate member 61 and a plurality of (23 in this example) coil springs 65.

The plate member 61 is a plate member made of an electrically insulating material such as a resin material. Note that if this plate member 61 has thermal insulation in addition to electrical insulation, the above-mentioned insulating member 50 may be omitted.

This plate-like member 61 has a planar shape corresponding to the flow path 34 of the heat sink 31 described above. Specifically, as shown in FIG. 8, this plate member 61 is folded back from the -Y direction in the figure to the +Y direction at the folding part 62, and is folded back from the +Y direction to the -Y direction in the figure at the folding part 63. It has a planar shape that is repeatedly folded back. That is, this plate-like member 61 extends in a planar shape (band-like shape) and has a meandering planar shape.

Note that the planar shape of the plate member 61 is not particularly limited to the above. For example, the pressing mechanism 60 may include a plurality of plate-like members 61, and the plurality of plate-like members 61 may be arranged intermittently along the flow path 34 of the heat sink 31.

This plate-like member 61 has a width narrower than the width of the flow path 34 and has the same width as the width of the heater 40 and the insulating member 50 described above. As shown in FIGS. 3 and 4, the plate member 61 is stacked on the insulating member 50 so as to be substantially parallel to the heater 40, and is placed in the flow path 34.

Each coil spring 65 is arranged within the flow path 34 along the depth direction of the flow path 34 (Z direction in the figure). The coil spring 65 is interposed between the plate member 61 and the cover 35 in a compressed state, and urges the heater 40 along the depth direction of the flow path 34 via the plate member 61. ing. Further, the plurality of coil springs 65 are arranged at intervals in the meandering extension direction of the plate-like member 61 so as to press the plate-like member 61 evenly. Note that the number of coil springs 65 included in the pressing mechanism 60 is not particularly limited to the above number.

By pressing the heater 40 against the bottom surface 343 of the flow path 34 via the plate member 61 by the coil spring 65, the heater 40 can be brought into close contact with the bottom surface 343 of the flow path 34, and the DUT 100 can be efficiently heated by the heater 40. Can be heated.

Furthermore, by using the coil spring 65 as a biasing member that presses the heater 40 against the bottom surface 343 of the flow path 34, when the refrigerant flows in the flow path 34, the coil spring 65 can also form a turbulent flow of the refrigerant. Therefore, the DUT 100 can be efficiently cooled by the refrigerant. Note that an elastic body other than a coil spring may be used as the biasing member that presses the heater 40 against the bottom surface 343 of the flow path 34.

Returning to FIG. 1, the refrigerant supply system 80 is a system that supplies refrigerant to the flow path 34 of the thermal head 25. This refrigerant supply system 80 includes a connecting portion 81, piping 82, and a valve 83. The refrigerant supplied by this refrigerant supply system 80 is not particularly limited, but examples include gaseous, mist, or liquid nitrogen, compressed dry air, and the like. This refrigerant corresponds to an example of the "fluid" in the aspect of the present invention.

A refrigerant supply source 96 provided outside the electronic component testing apparatus 1 is connected to the connection portion 81 . Note that the electronic component testing apparatus 1 may include a refrigerant supply source 96. An example of such a refrigerant supply source 96 is an LN ₂ (liquid nitrogen) supply source that stores liquid nitrogen and supplies low-temperature nitrogen. This LN ₂ supply source is equipped with a connection port that is connected to a pressure vessel storing liquid nitrogen at high pressure or a liquid nitrogen supply pipeline in the factory. Nitrogen and/or liquid nitrogen can be supplied. This refrigerant supply source 96 corresponds to an example of a "fluid supply source" in the aspect of the present invention.

Note that the refrigerant supplied to the thermal head 25 via the refrigerant supply system 80 is not particularly limited to the above-mentioned nitrogen, as long as it is a fluid having a temperature lower than the target temperature T _sp of the DUT 100.

For example, when a low-temperature test is not performed, an air supply source that supplies compressed air at room temperature may be used as the fluid supply source instead of the refrigerant supply source 96. This air supply source may include, for example, a compressor that takes in and compresses outside air, and a dryer that dries the compressed air. This air supply source may be provided outside the electronic component testing apparatus 1, or the electronic component testing apparatus 1 may be provided with this air supply source. Alternatively, the air supply source may be existing factory piping or the like that can supply compressed dry air.

Further, although the above-mentioned refrigerant may be either gas or liquid, by using gas as the refrigerant, it is not necessary to recover the refrigerant discharged from the outlet 352 of the thermal head 25. Note that, although not particularly limited, as an example of the liquid refrigerant, in addition to the above-mentioned liquid nitrogen, a fluorine-based inert liquid can be exemplified. Alternatively, instead of the coolant, a hot medium may be supplied to the flow path 34 of the thermal head 25.

A pipe 82 is connected to the connecting portion 81, and this pipe 82 passes through the arm body 21 and is connected to the inlet 351 of the thermal head 25. Further, this pipe 82 is provided with a valve 83. This valve 83 regulates the flow rate of refrigerant supplied into the refrigerant supply system 80 from the refrigerant supply source 96 .

As shown in FIG. 1, the control device 90 includes a temperature calculation section 91, a heater control section 92, and a valve control section 93. This control device 90 includes, for example, a computer having a microprocessor, and by executing a program on this computer, the above-mentioned temperature calculation section 91, heater control section 92, and valve control section 93 are functionally controlled. It has been realized. Note that instead of a computer, the control device 90 may be configured with an electric circuit board, and the above-mentioned temperature calculation section 91, heater control section 92, and valve control section 93 may be functionally realized by this electric circuit board. .

The temperature calculation unit 91 calculates the current temperature T _j ' of the DUT 100 based on the detection voltage signal input from the temperature detection circuit 120 of the DUT 100. Furthermore, this temperature calculation section 91 calculates the flow rate of the refrigerant and the output of the heater 40 such that the deviation between the current temperature T _j ' of the DUT 100 and the target temperature T _sp is reduced. Then, based on the calculation result of the temperature calculation section 91, the heater control section 92 controls the driving of the heater 40, and the valve control section 93 controls the opening degree of the valve 83. Note that the detected voltage signal of the temperature detection circuit 120 is input to the temperature calculation unit 91 via the socket 6 (see FIGS. 1, 3, and 4).

A specific example of a method of calculating the current temperature T _j ' of the DUT 100 using the detected voltage signal of the temperature detection circuit 120 is described in U.S. Patent Application No. 15/719,849 (U.S. Patent Application Publication No. 2019/0101587). ); An example may be the one described in US Patent Application No. 16/575,470 (US Patent Application Publication No. 2020/0241040).

Note that, for example, if the DUT 100 is a type of device in which the temperature change due to self-heating is not rapid, the detection voltage signal of the temperature detection circuit 120 is used instead of the calculation result T _j ' of the temperature calculation section 91. The junction temperature _Tj calculated by the tester 2 may be used. Alternatively, instead of the detection voltage signal of the temperature detection circuit 120, a detection voltage signal of the temperature sensor 36 installed in the thermal head 25 may be used.

As described above, in this embodiment, the heater 40 is arranged in the flow path 34 of the heat sink 31 so that the heater 40 is located at the bottom of the flow path 34 . In other words, in the thermal head 25, the flow path 34 and the heater 40 are arranged substantially on the same plane. Therefore, in this embodiment, both the heater 40 and the flow path 34 can be placed near the DUT 100, the heat capacity between the flow path 34 and the DUT 100 can be reduced, and the heat capacity between the heater 40 and the DUT 100 can be reduced. Since the heat capacity can also be reduced, it is possible to speed up the temperature control of the DUT 100.

Note that the embodiments described above are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design changes and equivalents that fall within the technical scope of the present invention.

In the embodiment described above, the heater 40 is made of only one piece of metal foil, but the heater 40 is not particularly limited to this. For example, instead of the heater 40, as shown in FIGS. 9 and 10, a so-called aluminum nitride heater may be used as the heater 40B. 9 and 10 are a plan view and a sectional view showing a modified example of the heater in the embodiment of the present invention, and FIG. 10 is a view taken along the line XX in FIG. 9.

As shown in FIGS. 9 and 10, this heater 40B includes a heating element 46 and an insulating layer 47 covering the heating element 46. The heating element 46 has a planar shape corresponding to the flow path 34 of the heat sink 31 described above. Specifically, as shown in FIG. 9, the heating element 46 is folded back from the -Y direction in the figure to the +Y direction at the folding part 461, and is folded back from the +Y direction to the -Y direction in the figure at the folding part 462. It has a planar shape that repeats this. That is, this heating element 46 extends in a planar shape (band shape) and has a meandering planar shape.

Note that the planar shape of the heating element 46 is not particularly limited to the above as long as it corresponds to the flow path 34. Further, the heating element 46 may extend linearly.

In this modification, as shown in FIG. 10, the entire circumference of the heating element 46 is covered with an insulating layer 47 made of aluminum nitride. The width of the insulating layer 47 (that is, the width of the heater 40B) is narrower than the flow path 34, and the heater 40B is arranged in the flow path 34 of the heat sink 31, similarly to the heater 40 described above. This insulating layer 47 has excellent thermal conductivity as well as excellent electrical insulation. When using this heater 40B, an electrically insulating layer on the surface of the heat sink 31 is not required, and a heat insulating member without electrical insulation can be used as the insulating member 50.

Alternatively, as shown in FIGS. 11 and 12, the heater 40C may be embedded in the heat sink 31C. 11 and 12 are a plan view and a sectional view showing a heater-integrated heat sink according to another embodiment of the present invention, and FIG. 12 is a view taken along line XII-XII in FIG. 11.

In the example shown in FIGS. 11 and 12, the heat sink 31C is made of aluminum nitride, and the heater 40C is embedded in the bottom plate 321 of the heat sink 31C.

The heat sink 31C has a shape similar to that of the heat sink 31 of the first embodiment having a plurality of (seven in this example) fins 33, and a flow path 34 having a meandering planar shape is formed in the heat sink 31C. has been done.

The heater 40C also has a planar shape corresponding to the flow path 34, and is embedded in the heat sink 31C so as to correspond to the bottom of the flow path 34. Namely. This heater 40C is embedded in the heat sink 31C so as to be interposed between the bottom surface 343 of the flow path 34 and the lower surface 324 of the bottom plate 321 of the heat sink 31C.

Note that the planar shape of the heater 40C is not particularly limited to the above as long as it corresponds to the flow path 34. Further, the heater 40C may extend linearly.

The heat sink 31C with the heater 40C is formed by carving a channel 34 into an aluminum nitride block in which the heater 40C is embedded in the bottom. When using the heat sink 31C with this heater 40C, the insulating member 50 and the pressing mechanism 60 are not necessary.

In the example shown in FIGS. 11 and 12, a heater 40C having a planar shape corresponding to the flow path 34 is embedded in the heat sink 31C so as to correspond to the bottom of the flow path 34. Therefore, both the heater 40C and the flow path 34 can be placed near the DUT 100, and the heat capacity between the flow path 34 and the DUT 100 can be reduced, as well as the heat capacity between the heater 40C and the DUT 100. , it is possible to speed up the temperature control of the DUT 100.

Furthermore, in a plan view, the heater 40 is folded so that it does not overlap with the portion between the mutually adjacent channels 34, and is arranged so as not to overlap with the fins 33. Therefore, the coolant passing through the flow path 34 can efficiently cool the DUT 100 via the fins 33 of the heat sink 31 and the bottom plate 321.

Further, in the embodiment described above, fluid was supplied to the flow path 34 of the thermal head 25 via the contact arm 20, but the present invention is not particularly limited to this. For example, fluid may be supplied to the thermal head from a socket guide provided around the socket. Alternatively, fluid may be supplied to the thermal head from outside the contact arm.

Furthermore, in the above-described embodiment, the thermal head 25 of the contact arm 20 holds the DUT 100 by suction, but the present invention is not limited to this. The thermal head 25 may hold the carrier 200 (see FIG. 1) containing the DUT by suction. Such a carrier is not particularly limited, but for example, carriers described in JP-A No. 2019-197012, JP-A No. 2013-79860, etc. can be used.

Furthermore, in the embodiment described above, the handler 10 includes the contact arm 20 and the chamber 70, but the configuration of the handler is not particularly limited to this. For example, the above-described thermal head may be applied to a handler that does not have a chamber. Alternatively, the above-described thermal head may be applied to a type of handler that does not have a contact arm and presses a DUT housed in a test tray using a pusher included in a Z-axis drive device.

Alternatively, the above-mentioned thermal head may be applied to a robot arm that holds and transports an SSD in an SSD (Solid State Drive) testing device. That is, the DUT also includes the SSD.

1...Electronic component testing device 2...Tester 6...Socket 10...Handler 20...Contact arm 25...Thermal head 30...

Body part

31, 31C...Heat sink 32...Base part 321...Bottom plate 322a-322d...Side wall 323...Concave part 324...Contact Surface 325... Through

hole

33, 33A, 33B... Fin 34...

Channel

341, 342... Turned part 343... Bottom surface 35... Cover 351... Opening (inlet)
352...Opening (exit)
353... Through

hole

40, 40B, 40C... Heater 43... Upper surface 44... Lower surface 46...

Heating element

461, 462... Folded part 47... Insulating layer 50... Insulating member 60... Pressing mechanism 61... Plate member 65... Coil spring 70... Chamber 80... Refrigerant supply system 81 Connection section 83... Valve 90... Control device 91... Temperature calculation section 92... Heater control section 93... Valve control section 95... Vacuum source 96... Refrigerant supply source 100... DUT

Claims

A heat exchanger that exchanges heat with a DUT or a carrier containing the DUT,
a main body portion having a first flow path through which a fluid for temperature adjustment of the DUT can flow;
a heater disposed within the first flow path so as to be located at the bottom of the first flow path.
The heat exchanger according to claim 1,
The first flow path has a meandering planar shape with a folded portion,
The heater is a heat exchanger having a planar shape corresponding to the first flow path.
The heat exchanger according to claim 1 or 2,
The heater is a heat exchanger arranged in the first flow path so as to be in contact with a bottom surface of the first flow path.
The heat exchanger according to any one of claims 1 to 3,
The heat exchanger includes a heat insulating member that has thermal insulation and covers a surface of the heater opposite to a surface facing the bottom surface of the first flow path.
The heat exchanger according to any one of claims 1 to 4,
The heat exchanger has an electrically insulating property and includes an electrically insulating member that covers a surface of the heater opposite to a surface facing the bottom surface of the first flow path.
The heat exchanger according to any one of claims 1 to 5,
The heat exchanger includes a pressing mechanism that presses the heater toward the bottom of the first flow path.
The heat exchanger according to claim 6,
The pressing mechanism includes a coil spring disposed within the first flow path so as to extend along the depth direction of the first flow path,
The coil spring is a heat exchanger that biases the heater along the depth direction of the first flow path.
The heat exchanger according to claim 7,
The pressing mechanism includes a plate member attached to the tip of the coil spring,
A heat exchanger, wherein the plate member is disposed within the first flow path so as to be substantially parallel to the heater.
A heat exchanger that exchanges heat with a DUT or a carrier containing the DUT,
a main body portion having a first flow path through which a fluid for temperature adjustment of the DUT can flow;
a heater embedded in the main body so as to correspond to the bottom of the first flow path,
The first flow path has a meandering planar shape with a folded portion,
The heater is a heat exchanger having a planar shape corresponding to the first flow path.
The heat exchanger according to any one of claims 1 to 9,
The heater is a heat exchanger that includes a planar or linear heating element that generates heat when energized.
The heat exchanger according to any one of claims 1 to 10,
A heat exchanger in which the interval between the first flow paths is narrower than the width of the first flow path.
The heat exchanger according to any one of claims 1 to 11,
A heat exchanger in which the bottom surface of the main body is a contact surface that contacts the DUT or the carrier.
The heat exchanger according to any one of claims 1 to 12,
The heat exchanger includes a second flow path for adsorption and holding of the DUT.
The heat exchanger according to any one of claims 1 to 13,
The main body portion is
an inlet communicating with the first flow path;
and an outlet communicating with the first flow path.
An electronic component handling device that handles a DUT or a carrier containing the DUT,
A heat exchanger according to any one of claims 1 to 14,
A moving device to which the heat exchanger is attached and which moves the heat exchanger,
The moving device holds the DUT or the carrier, so that the heat exchanger comes into contact with the DUT or the carrier,
The moving device is an electronic component handling device that presses the DUT or the carrier against the socket by moving the DUT or the carrier together with the heat exchanger.
An electronic component testing device for testing a DUT,
The electronic component handling device according to claim 15;
An electronic component testing device comprising: a testing device main body having a socket;