WO2023227099A1

WO2023227099A1 - Semiconductor process apparatus and calibration device

Info

Publication number: WO2023227099A1
Application number: PCT/CN2023/096490
Authority: WO
Inventors: 袁志涛; 唐希文
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2022-05-27
Filing date: 2023-05-26
Publication date: 2023-11-30
Also published as: CN114953231A; TW202347585A

Abstract

A semiconductor process apparatus and a calibration device. In the calibration device, a mounting platform (1) is used for mounting a driving mechanism (2) and a calibration mechanism (3), wherein the driving mechanism (2) comprises a cam (21) and a driver (22); the cam (21) is located at the top of the mounting platform (1); the cam (21) is provided with a plurality of bulges (211) and a plurality of recesses (212) which are alternately arranged in a circumferential direction of the cam; the driver (22) is used for driving the cam (21) to rotate; the calibration mechanism (3) comprises a plurality of movable bearing assemblies (31), which are distributed at intervals in the circumferential direction of the cam (21) and are used for jointly bearing a wafer cutting workpiece (100); and the plurality of movable bearing assemblies (31) can move in the radial direction of the cam (21), correspondingly match the plurality of bulges (211) or the plurality of recesses (212) on the cam (21) on a one-to-one basis, and are used for selectively synchronously moving away from or approaching the cam (21) when the cam (21) rotates, so as to calibrate the position of the wafer cutting workpiece (100). The semiconductor process apparatus comprises a transfer chamber, a process chamber, a manipulator and the calibration device. The semiconductor process apparatus and the calibration device calibrate the position of the wafer cutting workpiece (100), and avoid the deviation of the wafer cutting workpiece (100) from an electrostatic chuck position during a transfer process, thereby greatly increasing the product yield.

Description

Semiconductor process equipment and calibration equipment

Technical field

The present application relates to the field of semiconductor processing technology. Specifically, the present application relates to a semiconductor process equipment and a calibration device.

Background technique

Currently, with the rapid development of 12-inch three-dimensional integration and advanced packaging, the requirements for wafer utilization, yield and particle control are getting higher and higher, and the plasma cutting process has become the development trend of wafer cutting. The plasma cutting process is to stick the wafer and frame on the UV film (a special plastic film with adhesive on one side), and the frame is placed around the periphery of the wafer. This combination is called Cut the workpiece for the wafer; the plasma etches the wafer on the wafer cutting workpiece, and after the etching is completed, the wafer is cut into multiple chips (chips).

In the existing technology, a robot transfers the wafer cutting workpiece from the cassette to the electrostatic chuck in the process chamber. In order to ensure the stability of the process results, the position of the wafer cutting workpiece cannot be adjusted every time it is transferred to the electrostatic chuck. Error occurs, that is, the center deviation of the wafer cutting workpiece relative to the center of the electrostatic chuck cannot exceed 0.5 mm. However, in the existing technology, the wafer can only be calibrated and positioned independently, and the position of the wafer cutting workpiece cannot be calibrated, which seriously affects the yield of the process results.

Contents of the invention

In view of the shortcomings of the existing methods, this application proposes a semiconductor process equipment and calibration device to solve the technical problem in the existing technology that the yield of the process results is affected due to the inability to calibrate and position the position of the wafer cutting workpiece.

In a first aspect, embodiments of the present application provide a calibration device for a wafer cutting workpiece. A wafer is fixed on one side of the wafer cutting workpiece. The calibration device includes: a mounting platform and a driving machine. Structural and calibration institutions;

The installation platform is used to install the driving mechanism and calibration mechanism;

The driving mechanism includes a cam and a driver. The cam is located on the top of the installation platform. The cam has a plurality of convex portions and concave portions alternately arranged along its circumferential direction; the driver is used to drive the cam to rotate;

The calibration mechanism includes a plurality of movable bearing assemblies. The plurality of movable bearing assemblies are spaced apart along the circumference of the cam for jointly bearing the wafer cutting workpiece. The plurality of movable bearing assemblies can move along the cam. The cam moves radially and cooperates with the plurality of convex portions or the plurality of concave portions on the cam in a one-to-one correspondence for selectively synchronously moving away from or synchronously approaching the cam when the cam rotates. , to calibrate the position of the wafer cutting workpiece.

In one embodiment of the present application, the calibration mechanism further includes an installation structure, the installation structure includes a central block and a plurality of branches, and the plurality of branches are distributed at intervals along the circumference of the central block, and the The central block is located between the cam and the mounting platform, and is disposed concentrically with the cam. A plurality of the mobile bearing assemblies are slidably disposed on a plurality of branches in one-to-one correspondence. A through hole is opened in the direction of the radial section of the cam, and one end of the driver passes through the through hole and is connected to the cam.

In an embodiment of the present application, each of the mobile carrying components includes a slide rail, a pull rod structure and an elastic component. The pull rod structure is used to carry the wafer cutting workpiece and is slidably disposed on the corresponding position through the slide rail. On the branch; one end of the elastic component is fixedly provided on the branch, and the other end is connected to the pull rod structure, and is used to provide an elastic force to drive the pull rod structure close to the cam to calibrate the The location of the wafer cutting workpiece.

In one embodiment of the present application, the pull rod structure includes a load-bearing part, a roller part and a pull rod body. The pull rod body is slidably disposed on the branch through the slide rail. The load-bearing part and the roller part are respectively Disposed at both ends of the pull rod body, the roller component is used to make contact with the outer peripheral surface of the cam; the load-bearing component is used to carry the wafer cutting workpiece, and is positioned at the When the pull rod body is close to the cam, it engages the edge of the wafer cutting workpiece, so that the wafer cutting workpiece is pushed toward the center of the cam.

In one embodiment of the present application, the elastic component includes a fixed block and an elastic member. The fixed block is provided on the branch and is located between the roller component and the load-bearing component; the elastic component It is arranged along the sliding direction of the pull rod body, and has one end connected to the bearing member and the other end connected to the fixed block.

In one embodiment of the present application, the bearing component includes a support part and an engaging part. The support part has a support surface for carrying the wafer cutting workpiece, and the engaging part is protruding from the support surface. The side away from the cam is used to engage the edge of the wafer cutting workpiece when the pull rod structure is close to the cam.

In an embodiment of the present application, the calibration mechanism includes four movable bearing components, and the engaging portions of the four movable bearing components are used to correspond to the four straight edges on the outer periphery of the wafer cutting workpiece. The edges are engaged to calibrate the position of the wafer cutting workpiece.

In one embodiment of the present application, the calibration device further includes an ejection pin assembly, a plurality of the ejection pin assemblies can be lifted and lowered through the installation platform, and are evenly distributed along the circumference of the cam; a plurality of the ejection pin assemblies are elevatingly installed on the installation platform. The ejector assembly is used to rise when the cam rotates to a first preset angular position to support the wafer cutting workpiece at the same time, and drive the wafer cutting workpiece down and place it on multiple moving positions. On the bearing assembly, when the cam rotates to the first preset angular position, a plurality of the moving bearing assemblies cooperate with the plurality of protrusions on the cam one by one, so that the plurality of The mobile bearing component moves away from the cam synchronously;

The plurality of ejector pin assemblies are also used to drive the calibrated wafer cutting workpiece to rise when the cam rotates to the second preset angular position, so that the wafer cutting workpiece can be transported by the robot, wherein the When the cam rotates to the second preset angular position, a plurality of the mobile bearing components cooperate with a plurality of the recesses on the cam one by one, so that the plurality of the mobile bearing components move away from the The edge of the wafer cutting workpiece is a preset distance.

In an embodiment of the present application, the bearing surface of the mobile bearing component for bearing the wafer cutting workpiece has self-lubricating properties, and the preset distance is less than or equal to 0.5 mm.

In one embodiment of the present application, the ejector pin assembly includes a telescopic cylinder, a bellows and an ejector pin. The telescopic cylinder is provided at the bottom of the installation platform, and the top of the telescopic cylinder is connected to the bottom of the bellows. ; The bellows passes through the mounting hole of the mounting platform, and the top of the bellows is used to install the ejector pin.

In one embodiment of the present application, the driving mechanism further includes a mounting frame, a coupling and a transmission shaft. The mounting frame is disposed at the center of the bottom of the mounting platform, and the driver is disposed on the bottom of the mounting frame. Bottom; the coupling is arranged in the installation frame and connected to the output shaft of the driver; the bottom end of the transmission shaft is connected to the coupling, and the top end passes through the installation platform and is connected to the Cam connection.

In a second aspect, embodiments of the present application provide a semiconductor process equipment, including a transfer chamber, a process chamber, a manipulator, and a calibration device as provided in the first aspect, where the manipulator and the calibration device are disposed on the A transfer chamber, the manipulator is used to transfer the wafer cutting workpiece before calibration to the calibration device, and transfer the wafer cutting workpiece after calibration to the process chamber.

The beneficial technical effects brought by the technical solutions provided by the embodiments of this application are:

In the embodiment of the present application, multiple movable bearing assemblies are provided on the outer periphery of the cam, and the multiple movable bearing assemblies are spaced apart along the circumference of the cam. The multiple movable bearing assemblies can move in the radial direction of the cam and correspond to the cam in a one-to-one correspondence. Multiple convex parts or multiple concave parts on the cam cooperate with each other. By rotating the cam at an angle, the convex part of the cam presses against the movable bearing component, causing the multiple movable bearing components to move away from the cam simultaneously. At this time, the multiple movable bearing components can jointly carry the wafer. Cut the workpiece; as the cam continues to rotate, the multiple movable bearing components lose the resistance of the convex portion, so that the multiple movable bearing components can approach the cam synchronously, and drive the wafer cutting workpiece to move to the center of the cam to a concentric state, achieving alignment. The position of the wafer cutting workpiece is calibrated so that when the robot transfers the wafer cutting workpiece into the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck will not deviate, thereby improving the yield of the wafer cutting workpiece.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and will be obvious from the description, or may be learned by practice of the invention.

Description of the drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

Figure 1 is a schematic structural diagram of a calibration device provided by an embodiment of the present application;

Figure 2 is a partially enlarged structural schematic diagram of a calibration device provided by an embodiment of the present application;

Figure 3A is a schematic top structural view of a calibration device provided by an embodiment of the present application;

Figure 3B is a schematic cross-sectional structural diagram of a calibration device provided by an embodiment of the present application;

Figure 3C is a partial cross-sectional structural schematic diagram of a calibration device provided by an embodiment of the present application;

Figure 4A is a schematic top structural view of a calibration device in an idle state provided by an embodiment of the present application;

Figure 4B is a schematic cross-sectional structural view of the ejector assembly of a calibration device carrying a wafer cutting workpiece according to an embodiment of the present application;

4C is a schematic cross-sectional structural diagram of a calibration mechanism of a calibration device carrying a wafer cutting workpiece according to an embodiment of the present application;

4D is a schematic partial cross-sectional structural diagram of a calibration mechanism of a calibration device carrying a wafer cutting workpiece according to an embodiment of the present application;

Figure 5 is a schematic structural diagram of a top view of a calibration device in a calibration state provided by an embodiment of the present application;

Figure 6A is a schematic top structural view of a calibration device in a transmission state provided by an embodiment of the present application;

Figure 6B is a schematic cross-sectional structural diagram of a calibration device in a transmission state provided by an embodiment of the present application;

Figure 6C is a partial cross-sectional structure of a calibration device in a transmission state provided by an embodiment of the present application. schematic diagram;

Figure 7A is a schematic structural diagram of a calibration device provided by an embodiment of the present application from another perspective;

FIG. 7B is a schematic cross-sectional structural diagram of a calibration device provided by an embodiment of the present application.

Detailed ways

The present application is described in detail below, and examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components with the same or similar functions. Furthermore, detailed descriptions of known technologies are omitted if they are unnecessary to illustrate the features of the present application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and cannot be construed as limiting the present application.

It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in general dictionaries, are to be understood to have meanings consistent with their meaning in the context of the prior art, and are not to be used in an idealistic or overly descriptive manner unless specifically defined as here. to explain the formal meaning.

The technical solution of the present application and how the technical solution of the present application solves the above technical problems will be described in detail below with specific embodiments.

An embodiment of the present application provides a calibration device for a wafer cutting workpiece. A wafer is fixed on one side of the wafer cutting workpiece. The structural schematic diagram of the calibration device is shown in Figures 1, 2, 7A and 7B. Calibration The device includes: an installation platform 1, a driving mechanism 2 and a calibration mechanism 3; the installation platform 1 is used to install the driving mechanism 2 and the calibration mechanism 3; the driving mechanism 2 includes a cam 21 and a driver 22. The cam 21 is located on the top of the installation platform 1, and the cam 21 It has a plurality of convex portions 211 and concave portions 212 alternately arranged along its circumferential direction; the driver 22 is used to drive the cam 21 to rotate; the calibration mechanism 3 includes a plurality of moving bearing components 31, and the plurality of moving bearing components 31 are spaced along the circumferential direction of the cam 21 Distributed, used to jointly carry the wafer cutting workpiece, the multiple mobile carrying components 31 can move along the radial direction of the cam 21, and cooperate with the multiple convex portions 211 or the multiple concave portions 212 on the cam 21 one by one, for When cam 21 rotates The cam 21 is selectively synchronously moved away from or synchronously approached to calibrate the position of the wafer cutting workpiece.

As shown in Figures 1, 2, 7A and 7B, semiconductor process equipment is used to perform a plasma cutting process, for example. However, the embodiments of the present application do not limit its specific type. Those skilled in the art can adjust the settings according to the actual situation. . The mounting platform 1 may be a rectangular plate-shaped structure, which is specifically disposed in a transmission chamber of semiconductor process equipment for installing the driving mechanism 2 and the calibration mechanism 3. However, the embodiment of the present application does not limit the specific shape of the mounting platform 1. The driving mechanism 2 is entirely installed in the center of the mounting platform 1 , the driver 22 is located at the bottom of the mounting platform 1 , and the cam 21 is located at the top of the mounting platform 1 . The driver 22 can use a servo motor or a stepper motor to drive the cam 21 to rotate accurately. The cam 21 has four convex parts 211 and four concave parts 212 in the circumferential direction. There are concave parts 212 between any two adjacent convex parts 211. That is, the cam 21 has a plurality of alternately arranged convex parts 211 and concave parts 212. However, this The application embodiment does not limit the specific number of convex portions 211 and concave portions 212 , as long as the number of convex portions 211 and concave portions 212 is the same and they are arranged alternately. The calibration mechanism 3 is disposed on the top of the installation platform 1 . The calibration mechanism 3 includes four movable bearing components 31 , which are evenly distributed along the circumferential direction of the cam 21 . One end of the movable bearing component 31 is used for cooperating with the convex portion 211 and the concave portion 212 for transmission; the other end of the movable bearing component 31 is used for bearing the wafer cutting workpiece. In actual application, the cam 21 is driven by the driver 22 to rotate at a first preset angle, and the four protrusions 211 resist the four movable bearing assemblies 31 one by one, so that the multiple movable bearing assemblies 31 are all synchronously moved away from the cam 21 . At this time, the calibration mechanism 3 is in an idle state, allowing a robot (not shown in the figure) to transfer the wafer cutting workpiece 100 to the calibration mechanism 3, as shown in FIG. 3A and FIG. 4A. When the cam 21 continues to rotate driven by the driver 22 , the moving bearing components 31 lose the resistance of the protrusions 211 , causing multiple moving bearing components 31 to approach the cam 21 synchronously. At this time, the calibration mechanism 3 is in the calibration state, and multiple mobile bearing components 31 simultaneously drive the wafer cutting workpiece 100 to move toward the center of the cam 21 to adjust the positions of the wafer cutting workpiece 100 and the cam 21 to a concentric state. See Figure 5 for details. shown. Since the four mobile bearing assemblies 31 move simultaneously, the position of the wafer cutting workpiece can be quickly adjusted to facilitate the robot to transfer the wafer cutting workpiece to the process chamber, thereby preventing the wafer cutting workpiece from being The position of the electrostatic chuck is offset.

In the embodiment of the present application, multiple movable bearing assemblies are provided on the outer periphery of the cam, and the multiple movable bearing assemblies are spaced apart along the circumference of the cam. The multiple movable bearing assemblies can move along the radial direction of the cam and correspond to each other one by one. Multiple convex parts or multiple concave parts on the cam cooperate. By rotating the cam at an angle, the convex part of the cam presses against the movable bearing component, causing the multiple movable bearing components to move away from the cam simultaneously. At this time, the multiple movable bearing components can jointly carry the crystal. The workpiece is circularly cut; as the cam continues to rotate, the multiple movable bearing components lose the resistance of the convex portion, so that the multiple movable bearing components can approach the cam synchronously, and drive the wafer cutting workpiece to move to the center of the cam to a concentric state, achieving Calibrate the position of the wafer cutting workpiece so that when the robot transfers the wafer cutting workpiece into the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck will not deviate, thereby improving the yield of the wafer cutting workpiece. .

It should be noted that the embodiment of the present application does not limit the specific number of mobile bearing components 31. For example, the number of mobile bearing components 31 is three or five or more. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the settings by themselves according to the actual situation.

In an embodiment of the present application, as shown in Figures 1, 2, 7A and 7B, the calibration mechanism 3 also includes a mounting structure 34. The mounting structure 34 includes a central block 341 and a plurality of branches 342. A plurality of The branches 342 are distributed at intervals along the circumferential direction of the central block 341 . The central block 341 is located between the cam 21 and the mounting platform 1 and is concentrically arranged with the cam 21 . Multiple mobile bearing assemblies 31 are slidably arranged on the multiple branches 342 in one-to-one correspondence. , the central block 341 is provided with a through hole in a direction perpendicular to the radial cross section of the cam 21 (ie, its thickness direction), and one end of the driver 22 passes through the through hole to be connected to the cam 21 .

As shown in Figures 1, 2, 7A and 7B, the installation structure 34 includes an integrally formed central block 341 and four branches 342. The central block 341 is a cylindrical structure, and the four branches 342 are formed along the circumference of the central block 341. The installation structure 34 is distributed at intervals, that is, the entire installation structure 34 has a "cross"-shaped structure. The mounting structure 34 is integrally disposed on the mounting platform 1. The central block 341 is located between the mounting platform 1 and the cam 21, and is concentrically disposed with the cam 21; the four mobile bearing components 31 are respectively disposed on the four branches 342, and And can be slidably disposed relative to the branch 342 so that the bearing member 315 can move away from or approach the cam 21 . The central block 341 is also provided with a through hole in the center, which can be arranged coaxially with the cam 21 and is used for the output shaft of the driver 22 to pass through and then be connected to the cam 21 , that is, the central block 341 can be arranged in an annular structure. Using the above design, due to the installation structure 34, there is a certain distance between the mobile carrying component 31 and the installation platform 1, which facilitates high-level cooperation with the robot and is suitable for existing semiconductor process equipment, thus greatly improving the applicability and scope of application. .

It should be noted that the embodiment of the present application does not limit the calibration mechanism 3 to include a mounting structure 34. For example, multiple mobile bearing components 31 can be directly slidably disposed on the mounting platform 1. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the settings by themselves according to the actual situation.

In one embodiment of the present application, as shown in Figures 1 and 2, each mobile carrying component 31 includes a slide rail 311, a tie rod structure 312 and an elastic component 313. The tie rod structure 312 is used to carry the wafer cutting workpiece and pass through it. The slide rail 311 is slidably disposed on the corresponding branch 342; one end of the elastic component 313 is fixedly disposed on the branch 342, and the other end is connected to the pull rod structure 312 to provide an elastic force to drive the pull rod structure 312 close to the cam 21 for calibration. The location of the wafer cutting workpiece.

As shown in Figures 1 and 2, the mobile bearing assembly 31 includes a slide rail 311, a tie rod structure 312 and an elastic component 313. The slide rail 311 extends along the extension direction of the branch 342, and the cross section of the slide rail 311 is an inverted trapezoidal structure. . The tie rod structure 312 extends along the extension direction of the branch 342, and an inverted trapezoidal groove is provided on the bottom surface of the tie rod structure 312 for sliding in cooperation with the slide rail 311. One end of the tie rod structure 312 is used to cooperate with the convex portion 211 of the cam 21 for transmission, and the other end is used to carry the wafer cutting workpiece. When the convex portion 211 of the cam 21 presses against the tie rod structure 312, the entire tie rod structure 312 faces away from the cam 21. direction movement. The elastic member 313 extends as a whole along the extension direction of the branch 342, and one end of the elastic member 313 is fixedly connected to the branch 342, and the other end is connected to the tie rod structure 312. When the tie rod structure 312 loses the resisting force of the protrusion 211, the elastic member 313 can An elastic force is provided to drive the entire pull rod structure 312 to move in a direction close to the cam 21 , so that the wafer cutting workpiece moves toward the center of the cam 21 , so that the wafer cutting workpiece is concentric with the cam 21 . Using the above settings The design allows the embodiment of the present application to adopt a relatively simple structure, that is, the mobile bearing assembly 31 can be realized to reciprocate on the branches 342, thereby not only reducing application and maintenance costs, but also significantly reducing the failure rate and extending the service life.

It should be noted that the embodiment of the present application does not limit the specific structures of the slide rail 311 and the tie rod structure 312. For example, the slide rail 311 is provided with a sliding groove, and the tie rod structure 312 is slidably fitted in the sliding groove. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the settings by themselves according to the actual situation.

In an embodiment of the present application, as shown in Figures 1 and 2, the tie rod structure 312 includes a roller component 314, a load bearing component 315 and a tie rod body 316. The tie rod body 316 is slidably disposed on the branch 342 through the slide rail 311 to carry the load. The component 315 and the roller component 314 are respectively provided at both ends of the tie rod body 316. The roller component 314 is used to make contact with the outer peripheral surface of the cam 21 (including the outer peripheral surface of the convex part 211 and the outer peripheral surface of the concave part 212); the bearing part 315 is used for To carry the wafer cutting workpiece, and engage the edge of the wafer cutting workpiece when the tie rod structure 312 is close to the cam 21 , so that the wafer cutting workpiece is pushed toward the center of the cam 21 . Specifically, the pull rod body 316 is slidably fitted on the branch 342 through the slide rail 311, and the two ends of the pull rod body 316 are respectively provided with roller components 314 and load-bearing components 315. The tie rod body 316 is provided with a bending structure at one end close to the cam 21. The bending structure includes a vertical plate and a horizontal plate. The vertical plate is integrally formed at the end of the tie rod structure 312, and the horizontal plate is integrally formed at the top of the vertical plate. The roller component 314 is arranged at the bottom of the horizontal plate through a mounting shaft. The outer peripheral surface of the roller component 314 can roll with the outer peripheral surface of the cam 21 to reduce transmission resistance, thereby improving work efficiency while avoiding the contact between the cam 21 and the cam 21 . Friction between the tie rod bodies 316 causes particle contamination. The bearing component 315 is disposed on the other end of the pull rod body 316. The bearing component 315 can be used to carry the wafer cutting workpiece, and can engage the edge of the wafer cutting workpiece to engage the wafer when the tie rod structure 312 is close to the cam 21. The edge of the workpiece is circularly cut, so that the wafer cutting workpiece is subject to a preload force toward the cam 21 and simultaneously moves toward the center of the cam 21 to achieve position calibration. Adopting the above design makes the implementation structure of this application simple, and can reduce the transmission resistance while improving the wafer cutting workpiece. Calibration efficiency.

In one embodiment of the present application, as shown in Figures 1 and 2, the elastic component 313 includes a fixed block 3131 and an elastic component 3132. The fixed block 3131 is provided on the branch 342 and is located between the roller component 314 and the bearing component 315. between; the elastic member 3132 is provided along the sliding direction of the tie rod body 316, and one end is connected to the bearing member 315, and the other end is connected to the fixed block 3131. Specifically, the bottom end of the fixed block 3131 is connected to the branch 342, and an avoidance gap is provided in the middle of the bottom of the fixed block 3131 for avoiding the slide rail 311 and the tie rod body 316, so that the tie rod body 316 can reciprocate within the avoidance gap. . The fixed block 3131 is located between the roller component 314 and the bearing component 315 and is disposed close to the roller component 314 . The elastic member 3132 is located between the fixed block 3131 and the bearing member 315. One end of the elastic member 3132 is connected to the fixed block 3131, and the other end is connected to the bearing member 315. The elastic member 3132 is, for example, a coil spring, so that the pull rod body 316 has a thrust force always approaching the center of the cam 21 . Adopting the above design makes the structure of the embodiment of the present application simple and easy to implement, and can provide horizontal thrust for the tie rod body 316, thereby significantly reducing application and maintenance costs.

In one embodiment of the present application, as shown in FIG. 1 to FIG. 3A , the carrying component 315 includes a supporting part 3151 and an engaging part 3152. The supporting part 3151 has a supporting surface for carrying the wafer cutting workpiece, and the engaging part 3152 is protruding on the side of the supporting surface away from the cam 21 and is used to engage the edge of the wafer cutting workpiece when the tie rod structure 312 approaches the cam 21 . Specifically, the support part 3151 may adopt a rectangular parallelepiped structure. The support part 3151 is disposed on the tie rod body 316, and the top surface of the support part 3151 is a support surface for carrying the wafer cutting workpiece. The engaging portion 3152 can adopt a rod-shaped structure, which can be formed in an integral manner on the supporting surface of the supporting portion 3151 , and the engaging portion 3152 is provided on the side of the supporting surface away from the cam 21 to support the supporting portion 3151 On the basis of carrying the wafer cutting workpiece on the surface, it plays a limiting role on the wafer cutting workpiece. In practical applications, the four supporting parts 3151 are used to simultaneously carry the bottom surface of the wafer cutting workpiece, and the four engaging parts 3152 are used to simultaneously engage the four edge positions of the wafer cutting workpiece, and the four tie rod structures 312 are synchronized When approaching the cam 21, the four engaging portions 3152 engage the edge positions of the wafer cutting workpiece at the same time, thereby realizing the calibration of the wafer cutting workpiece. Enter In one step, as shown in FIG. 3A , there is a first distance L1 between the two opposite engaging parts 3152. The value of the first distance L1 depends on the maximum allowable offset calibration amount, and the maximum offset calibration amount is crystal. The maximum amount of deviation of a circular cutting workpiece in one direction. As shown in FIG. 4A , when the outer circumference of the wafer cutting workpiece 100 has four evenly distributed straight edges, the first spacing L1 should be the wafer cutting workpiece 100 during calculation. The width between straight edges plus twice the maximum offset calibration amount (may also be offset in the opposite direction), for example, the maximum offset calibration amount is 5 mm, then the first spacing L1 can be 380 mm + 5 mm × 2 = 390 mm , where 380 mm is the width between two symmetrical straight edges of the wafer cutting workpiece 100 . When the wafer cutting workpiece 100 exceeds the maximum offset, an alarm may be issued through an alarm mechanism, but the embodiment of the present application does not limit the specific implementation of the alarm mechanism. Using the above design, the embodiment of the present application is not only simple in structure, but also can be configured according to different wafer cutting workpieces 100 , thereby greatly improving the applicability and scope of the embodiment of the present application.

It should be noted that the embodiments of the present application do not limit the specific shapes of the supporting part 3151 and the engaging part 3152. For example, the shapes of the supporting part 3151 and the engaging part 3152 can adopt an arc structure to be suitable for round wafers. Cut workpiece 100. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the settings by themselves according to the actual situation.

In an embodiment of the present application, as shown in Figure 1, Figure 3A and Figure 4A, the calibration mechanism 3 includes four movable bearing components 31, and the engaging portions 3152 of the four movable bearing components 31 are used to correspond one to one. It is engaged with the four straight edges on the outer periphery of the wafer cutting workpiece 100 to calibrate the position of the wafer cutting workpiece 100 . Specifically, the four movable bearing components 31 are evenly distributed along the circumferential direction of the cam 21 , that is, they are evenly distributed radially around the cam 21 , so that the engaging portions 3152 of the four movable bearing components 31 can engage with the wafer cutting workpiece 100 The four straight edges on the outer periphery snap together. When the four mobile bearing assemblies 31 approach the cam 21 synchronously, the four engaging portions 3152 can push the four straight edges of the wafer cutting workpiece 100 to move toward the center of the cam 21 at the same time, thereby realizing the calibration of the wafer cutting workpiece 100 . However, the embodiment of the present application does not limit the specific number of movable bearing components 31 , as long as the number of movable bearing components 31 corresponds to the number of straight edges on the outer circumference of the wafer cutting workpiece 100 . Therefore, the embodiment of this application does not With this limitation, those skilled in the art can adjust the settings by themselves according to the actual situation.

In one embodiment of the present application, as shown in FIGS. 1 to 4D , the calibration device also includes an ejector pin assembly 4 . A plurality of ejector pin assemblies 4 are elevatingly installed on the installation platform 1 , and are evenly spaced along the circumferential direction of the cam 21 Distribution; the plurality of ejector pin assemblies 4 are used to rise when the cam 21 rotates to the first preset angular position to support the wafer cutting workpiece 100 at the same time, and drive the wafer cutting workpiece 100 to drop and place it in multiple moving positions at the same time. On the bearing component 315 in the bearing assembly 31, when the cam 21 rotates to the first preset angular position, the roller components 314 in the plurality of moving bearing assemblies 31 cooperate with the plurality of convex portions 211 on the cam 21 in one-to-one correspondence ( That is, butting contact), so that the plurality of pull rod structures 312 in the mobile bearing assembly 31 are synchronously moved away from the cam 21; the plurality of ejector pin assemblies 4 are also used to drive the calibrated cam 21 when it rotates to the second preset angular position. The wafer cutting workpiece 100 rises so that the wafer cutting workpiece 100 can be transported by the robot. When the cam 21 rotates to the second preset angular position, the roller components 314 in the plurality of mobile bearing assemblies 31 correspond to the cam one by one. The plurality of recesses 212 on the wafer cutting workpiece 21 cooperate to keep the bearing parts 315 of the plurality of moving bearing assemblies 31 away from the edge of the wafer cutting workpiece by a preset distance L.

As shown in FIGS. 1 to 4D , three ejector pin assemblies 4 are disposed on the mounting platform 1 and are evenly and spaced apart along the circumferential direction of the cam 21 for jointly supporting the wafer cutting workpiece 100 . A part of the ejector pin assembly 4 is located at the bottom of the mounting platform 1 , and the ejector pins 43 of the ejector pin assembly 4 can be located above the mounting platform 1 , and the ejector pins 43 can be raised and lowered relative to the mounting platform 1 for contacting the bottom surface of the wafer cutting workpiece 100 . When the cam 21 rotates to the first preset angular position, the roller component 314 is in contact with the convex portion 211 of the cam 21, so that the plurality of tie rod structures 312 are away from the cam 21, that is, the calibration mechanism 3 is in an idle state, and the manipulator can move towards the calibration mechanism. 3, the wafer cutting workpiece 100 is transported on the ejector pin assembly 4. At this time, the ejector pin 43 of the ejector pin assembly 4 rises, so that there is a second distance L2 between the top of the ejector pin 43 and the support surface of the support part 3151. The second distance L2 can be set to be greater than 0 millimeters and less than 3 millimeters to cooperate with each other to carry the wafer cutting workpiece 100, as shown in Figure 3C. Further, the three ejector pin assemblies 4 can drive the wafer cutting workpiece 100 to lower, so as to drive the wafer cutting workpiece 100 to lower. Falling onto the calibration mechanism 3, the wafer cutting workpiece 100 is placed on multiple bearing components 315 at the same time. At this time, there is a third distance L3 between the ejector pin 43 of the ejector pin assembly 4 and the support surface of the support part 3151. This third distance L3 can be set to be greater than 0 mm and less than 3 mm. The specific process can be referred to as shown in Figure 4A to Figure 4D. It should be noted that the embodiment of the present application does not limit the specific value of the third distance L3, as long as the ejector pin 43 of the ejector pin assembly 4 is lower than the support surface of the support portion 3151, so the embodiment of the present application is not limited thereto.

Referring to FIGS. 5 to 6C , taking four mobile bearing assemblies 31 as an example, there are four first preset angular positions and four second preset angular positions, and they are arranged alternately in the circumferential direction of the cam 21 . When the cam 21 rotates to the first preset angular position and then continues to rotate, since the roller component 314 gradually loses the resistance of the convex portion 211, the roller component 314 can approach the cam 21. When the cam 21 rotates to the second preset angular position, The roller component 314 is finally accommodated in the recess 212, that is, the multiple load-bearing components 315 are synchronously close to the cam 21. At this time, the calibration mechanism 3 is in a calibration state. Under the action of the multiple load-bearing components 315, the wafer cutting workpiece 100 and the cam 21 are finally It is in a concentric state, as shown in Figure 5. When the cam 21 continues to rotate from the above-mentioned second preset angular position until it reaches the new first preset angular position, the convex portion 211 of the cam 21 can again resist the roller component 314, and the bearing component 315 can move away from the cam 21 by a preset amount. Distance L, at this time, the engaging portion 3152 of the carrying component 315 is separated from the straight edge of the wafer cutting workpiece 100, so that the calibration mechanism 3 is in the transmission state, and the ejector pins 43 of the three ejector pin assemblies 4 rise at the same time to drive the calibrated wafer. The cutting workpiece 100 rises and separates from the support part 3151, so that the robot can easily take away the calibrated wafer cutting workpiece 100, as shown in FIGS. 6A to 6C. Adopting the above design, the embodiment of the present application can cooperate with the robot to transmit the wafer cutting workpiece 100, thereby realizing the calibration of the wafer cutting workpiece 100 and also realizing the transmission of the calibrated wafer cutting workpiece 100, and There will be no mechanical interference with the manipulator, thereby improving the ease of use and reducing the failure rate of the embodiment of the present application.

In one embodiment of the present application, as shown in FIGS. 1 to 6C , the bearing surface of the bearing component 315 for bearing the wafer cutting workpiece has self-lubricating properties, and the preset distance L is less than or equal to 0.5 mm. Tool Specifically, the above-mentioned bearing surface of the bearing component 315 can be surface treated to make it self-lubricating, or covered with a self-lubricating film layer; or the bearing component 315 can also be made of a self-lubricating material. , optionally, the load-bearing part 315 is made of resin material, so that the support surface of the support part 3151 has self-lubricating properties. When the load-bearing part 315 is away from the cam 21 by a preset distance L, the four load-bearing parts 315 are synchronously moved away from the cam 21 During the process, due to the weight of the wafer cutting workpiece 100 and the self-lubricating property of the bearing member 315 , the position of the wafer cutting workpiece 100 will not shift, that is, the center of the wafer cutting workpiece 100 still coincides with the center of the cam 21 . Furthermore, since the carrying member 315 is away from the cam 21 by a preset distance L, there is also a preset distance L between the engaging portion 3152 and the straight edge of the wafer cutting workpiece 100. In order to avoid excessive movement of the wafer cutting workpiece, 100 offset, so the preset distance L can be set to be greater than 0 mm and less than or equal to 0.5 mm. Using the above design, the embodiment of the present application still maintains a concentric arrangement with the cam 21 during the process of transmitting the calibrated wafer cutting workpiece 100 , thereby further improving the accuracy of the calibration of the wafer cutting workpiece 100 . It should be noted that the embodiment of the present application does not limit the specific material of the bearing member 315 , as long as it has self-lubricating characteristics relative to the wafer cutting workpiece 100 . Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the settings by themselves according to the actual situation.

In one embodiment of the present application, as shown in FIG. 1 , FIG. 7A and FIG. 7B , the ejector pin assembly 4 includes a telescopic cylinder 41 , a bellows 42 and an ejector pin 43 . The telescopic cylinder 41 is disposed at the bottom of the installation platform 1 , and telescopically The top of the cylinder 41 is connected to the bottom of the bellows 42; the bellows 42 is inserted into the mounting hole of the mounting platform 1, and the top of the bellows 42 is used to install the ejector pin 43. Specifically, the mounting platform 1 is provided with three mounting holes, and the three ejector pin assemblies 4 are respectively inserted into the three mounting holes. The telescopic cylinder 41 is located at the bottom of the mounting platform 1 and is aligned with the mounting holes. The bottom end of the bellows 42 is connected to the top of the telescopic cylinder 41. The bellows 42 is passed through the installation hole, and the top end is used to install the ejector pin 43. The top end of the ejector pin 43 can be used to contact the bottom surface of the wafer cutting workpiece 100. . The telescopic cylinder 41 is used to drive the ejector pin 43 to telescope relative to the mounting platform 1 to drive the wafer cutting workpiece 100 to lift. Adopting the above design makes the structure of the embodiment of the present application simple and easy to implement, thereby greatly reducing the cost of the present application. Application and maintenance costs of embodiments.

In one embodiment of the present application, as shown in Figure 1, Figure 7A and Figure 7B, the driving mechanism 2 also includes a mounting frame 23, a coupling 24 and a transmission shaft 25. The mounting frame 23 is centrally located at the bottom of the mounting platform 1. position, the driver 22 is arranged at the bottom of the mounting frame 23; the coupling 24 is arranged in the mounting frame 23 and connected to the output shaft of the driver 22; the bottom end of the transmission shaft 25 is connected to the coupling 24, and the top end passes through the mounting platform 1 is connected to cam 21. Specifically, the mounting frame 23 may adopt a hollow cubic structure. The mounting frame 23 is disposed at the center of the bottom of the mounting platform 1 , and the two are fixedly connected by welding or fasteners. The driver 22 can be a servo motor or a stepper motor. The driver 22 is arranged at the bottom of the mounting frame 23, and the output shaft of the driver 22 can extend into the mounting frame 23. The coupling 24 is arranged in the mounting frame 23, and its two ends are respectively connected to the mounting frame 23. The output shaft is connected to the transmission shaft 25, and the transmission shaft 25 passes through the installation platform 1 and is connected to the cam 21. With the above design, the coupling 24 can greatly absorb the vibration of the driver 22, thereby improving the accuracy of transmission and thereby improving the accuracy of calibration.

In order to further illustrate the implementation and beneficial effects of the embodiments of the present application, a specific implementation of the present application is described below with reference to the accompanying drawings 1 to 7B.

When the calibration mechanism 3 is in the idle state, the cam 21 rotates to the first preset angular position, specifically referring to the position shown in FIG. 3A , the convex portion 211 of the cam 21 abuts the roller component 314, and the elastic component 313 is at this time. In the stretched state, the amount of stretching can be determined according to the elastic force of the elastic member 3132, and the elastic force of the elastic member 3132 can be set to not less than 5N. The robot can transport the wafer cutting workpiece 100 to the calibration mechanism 3, and the wafer cutting workpiece 100 is pre-placed on a plurality of ejector pin assemblies 4, as shown in Figure 4A and Figure 4B. The ejector pin 43 of the ejector pin assembly 4 descends to drive the wafer cutting workpiece 100 to land on multiple load-bearing components 315 at the same time. At this time, there is a third distance L3 between the top of the ejector pin 43 and the support surface of the support part 3151 to prevent the ejector pin 43 from contacting the wafer. When impact friction occurs on the cutting workpiece 100, the third distance L3 can be set to 3 mm, as shown in Figure 4C and Figure 4D.

Further, after the driver 22 drives the cam 21 to rotate to the first preset angle position, the driver 22 continues to drive the cam 21 to rotate to the first preset angle position. When the moving cam 21 rotates counterclockwise, the elastic force of the elastic member 3132 can move the bearing member 315 toward the center of the cam 21. Since the four bearing members 315 move at the same distance, the center of the wafer cutting workpiece 100 gradually moves toward the center of the cam 21. Close together, and the roller component 314 is always close to the outer peripheral surface of the cam 21, so that the movement of the wafer cutting workpiece 100 is relatively stable, as shown in Figure 5 for details. When the cam 21 rotates to an angle (less than 45°), before reaching the second preset angle, the stretching amount of the elastic member 3132 gradually decreases, so that the elastic force of the elastic member 3132 gradually decreases until the four bearing parts 315 Clamp the wafer cutting workpiece 100 completely, and make the center of the wafer cutting workpiece 100 coincide with the center of the cam 21. At this time, the elastic force of the elastic member 3132 is minimized, but the elastic member 3132 should still be in a stretched state, and the elastic force The force is not less than 3N to ensure that the wafer cutting workpiece 100 and the cam 21 are concentric. Further, the driver 22 continues to drive the cam 21 to rotate to 45°. When it reaches the second preset angle position, the roller component 314 has completely separated from the convex portion 211 of the cam 21 and is located in the concave portion 212 of the cam 21. Since the elastic member 3132 is still is in a tensile state, so that each load-bearing component 315 has an elastic force of the same size and direction pointing to the center of the cam 21 on the wafer cutting workpiece 100, so as to ensure that the center of the wafer cutting workpiece 100 and the center of the cam 21 are completely coincident. At this point, the wafer cutting workpiece 100 is completed. Station calibration of circular cutting workpiece 100.

Finally, the driver 22 drives the cam 21 to continue to rotate from the above-mentioned second preset angular position until it reaches a new first preset angular position, and the four carrying parts 315 move away from the cam 21 at the same time, so that the engaging portion 3152 of the carrying part 315 There is a preset distance L from the straight edge of the wafer cutting workpiece 100. The preset distance L can be set to be greater than or equal to 0 and less than or equal to 0.5 mm. For details, refer to FIG. 6B and FIG. 6C. At this time, the three ejection pin assemblies 4 simultaneously drive the wafer cutting workpiece 100 to rise, so that the robot can transfer the calibrated wafer cutting workpiece 100 to the electrostatic chuck of the process chamber. It can be seen that the embodiment of the present application realizes the calibration and transmission of the wafer cutting workpiece 100 through a relatively simple structure, thereby avoiding the position deviation of the wafer cutting workpiece 100 and the electrostatic chuck, thereby improving the product yield.

Based on the same inventive concept, embodiments of the present application provide a semiconductor process equipment, including: A transfer chamber, a process chamber, a manipulator, and a calibration device as provided in the above embodiments. The manipulator and the calibration device are both installed in the transfer chamber. The manipulator is used to transfer the wafer cutting workpiece before calibration to the calibration device, and to perform the calibration. After the wafer is cut, the workpiece is transferred to the process chamber.

By applying the embodiments of this application, at least the following beneficial effects can be achieved:

It can be understood that the above embodiments are only exemplary embodiments adopted to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply. The devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limitations of the invention.

The terms “first” and “second” are used for descriptive purposes only and shall not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, it is limited to "first" and "th The characteristics of "two" may expressly or implicitly include one or more of the characteristics. In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more.

In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be directly connected, or indirectly connected through an intermediary, or it can be internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the description of this specification, specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above are only some of the embodiments of the present application. It should be pointed out that those of ordinary skill in the technical field can also make several improvements and modifications without departing from the principles of the present application. These improvements and modifications can also be made. should be regarded as the scope of protection of this application.

Claims

A calibration device for a wafer cutting workpiece, with a wafer fixed on one side of the wafer cutting workpiece, characterized in that the calibration device includes: a mounting platform, a driving mechanism and a calibration mechanism;

The installation platform is used to install the driving mechanism and calibration mechanism;

The driving mechanism includes a cam and a driver. The cam is located on the top of the installation platform. The cam has a plurality of convex portions and concave portions alternately arranged along its circumferential direction; the driver is used to drive the cam to rotate;

The calibration mechanism includes a plurality of movable bearing assemblies. The plurality of movable bearing assemblies are spaced apart along the circumference of the cam for jointly bearing the wafer cutting workpiece. The plurality of movable bearing assemblies can move along the cam. The cam moves radially and cooperates with the plurality of convex portions or the plurality of concave portions on the cam in a one-to-one correspondence for selectively synchronously moving away from or synchronously approaching the cam when the cam rotates. , to calibrate the position of the wafer cutting workpiece.
The calibration device according to claim 1, wherein the calibration mechanism further includes a mounting structure, the mounting structure includes a central block and a plurality of branches, and the plurality of branches are along the circumferential direction of the central block. Distributed at intervals, the central block is located between the cam and the mounting platform and is arranged concentrically with the cam. A plurality of the mobile bearing assemblies are slidably arranged on a plurality of branches in one-to-one correspondence. The central block A through hole is opened in a direction perpendicular to the radial cross section of the cam, and one end of the driver passes through the through hole to be connected to the cam.
The calibration device according to claim 2, characterized in that each of the mobile carrying components includes a slide rail, a pull rod structure and an elastic component, the pull rod structure is used to carry the wafer cutting workpiece and passes through the slide rail. The rail is slidably disposed on the corresponding branch; one end of the elastic component is fixedly disposed on the branch, and the other end is connected to the pull rod structure to provide an elastic force to drive the pull rod structure close to the cam. , to calibrate the position of the wafer cutting workpiece.
The calibration device according to claim 3, wherein the pull rod structure includes a load-bearing part, a roller part and a pull rod body, and the pull rod body is slidably disposed on the branch through the slide rail, and the load-bearing part and The roller components are respectively provided at both ends of the pull rod body, and the roller components are used to make contact with the outer peripheral surface of the cam; the load-bearing component is used to carry the wafer cutting workpiece, and is used to carry the wafer cutting workpiece. When the pull rod body is close to the cam, it engages the edge of the wafer cutting workpiece, so that the wafer cutting workpiece is pushed toward the center of the cam.
The calibration device according to claim 4, wherein the elastic component includes a fixed block and an elastic member, the fixed block is disposed on the branch and is located between the roller component and the bearing component. ; The elastic member is arranged along the sliding direction of the pull rod body, and one end is connected to the load-bearing component, and the other end is connected to the fixed block.
The calibration device according to claim 4, wherein the bearing member includes a support portion and an engaging portion, the support portion has a support surface for bearing the wafer cutting workpiece, and the engaging portion is protruding from The side of the supporting surface away from the cam is used to engage the edge of the wafer cutting workpiece when the pull rod structure is close to the cam.
The calibration device according to claim 6, wherein the calibration mechanism includes four movable bearing assemblies, and the engaging portions of the four movable bearing assemblies are used to engage the wafer cutting workpiece in one-to-one correspondence. The four straight edges on the outer periphery are engaged to calibrate the position of the wafer cutting workpiece.
The calibration device according to claim 1, characterized in that the calibration device further includes an ejector pin assembly, a plurality of the ejector pin assemblies can be lifted and lowered through the installation platform, and are evenly distributed along the circumferential direction of the cam. Distribution; a plurality of the ejector pin assemblies are used to rise when the cam rotates to the first preset angular position to support the wafer cutting workpiece at the same time, and drive the wafer cutting workpiece down and place it on On a plurality of the moving bearing assemblies, when the cam rotates to the first preset angular position, the plurality of moving bearing assemblies correspond to the plurality of moving bearing assemblies on the cam in a one-to-one correspondence. The convex portion cooperates to make a plurality of the mobile bearing components move away from the cam synchronously;

The plurality of ejector pin assemblies are also used to drive the calibrated wafer cutting workpiece to rise when the cam rotates to the second preset angular position, so that the wafer cutting workpiece can be transported by the robot, wherein the When the cam rotates to the second preset angular position, a plurality of the mobile bearing components cooperate with a plurality of the recesses on the cam one by one, so that the plurality of the mobile bearing components move away from the The edge of the wafer cutting workpiece is a preset distance.
The calibration device according to claim 8, wherein the bearing surface of the mobile bearing component for bearing the wafer cutting workpiece is self-lubricating, and the preset distance is less than or equal to 0.5 mm.
The calibration device according to claim 8, wherein the ejector pin assembly includes a telescopic cylinder, a bellows and an ejector pin, the telescopic cylinder is arranged at the bottom of the installation platform, and the top of the telescopic cylinder is in contact with the The bottom of the bellows is connected; the bellows is inserted into the mounting hole of the mounting platform, and the top of the bellows is used to install the ejector pin.
The calibration device according to any one of claims 1 to 10, wherein the driving mechanism further includes a mounting frame, a coupling and a transmission shaft, and the mounting frame is disposed at a central position at the bottom of the mounting platform, The driver is arranged at the bottom of the mounting frame; the coupling is arranged in the mounting frame and connected to the output shaft of the driver; the bottom end of the transmission shaft is connected to the coupling, The top end passes through the mounting platform and is connected to the cam.
A semiconductor process equipment, characterized in that it includes a transfer chamber, a process chamber, a manipulator and a calibration device as claimed in any one of claims 1 to 11, the manipulator and the calibration device being disposed in the transfer chamber chamber, the manipulator is used to transport the wafer cutting workpiece before calibration to the calibration device, and transport the wafer cutting workpiece after calibration to the process chamber.