WO2022193669A1

WO2022193669A1 - Head-mounted display device and heat dissipation mechanism thereof

Info

Publication number: WO2022193669A1
Application number: PCT/CN2021/127231
Authority: WO
Inventors: 李小飞; 黄继硕; 刘焕洲; 姜滨; 迟小羽
Original assignee: 歌尔股份有限公司
Priority date: 2021-03-16
Filing date: 2021-10-29
Publication date: 2022-09-22
Also published as: CN113031273A; CN113031273B

Abstract

Disclosed is a heat dissipation mechanism, comprising an air inlet provided at the bottom of a housing, an air outlet provided at the top of the housing, a mounting plate arranged in the housing and used for mounting a PCBA, a heat sink arranged at the top of the mounting plate and used for dissipating heat from the PCBA, and a fan arranged at the top of the heat sink and used for carrying out forced convection heat dissipation on the heat sink via an airflow, wherein an air suction port of the fan is in communication with the air inlet by means of the heat sink, and an exhaust port of the fan is in communication with the air outlet. As such, by means of the air inlet provided at the bottom of the housing and the air outlet provided at the top of the housing, a substantially vertical airflow channel distributed in a vertical direction is formed in the housing, such that cool air flows fast in the housing, and exchange of heat inside and outside the housing is completed quickly, thereby simplifying the airflow channel, and improving an airflow rate; in addition, heat can be dissipated to the outside in a timely manner, thereby preventing heat from accumulating in the housing and avoiding an increased housing volume. Further disclosed is a head-mounted display device which has the above beneficial effects.

Description

A head-mounted display device and its cooling mechanism

This application claims the priority of the Chinese patent application filed on March 16, 2021 with the application number 202110281369.4 and the invention titled "A head-mounted display device and its heat dissipation mechanism", the entire contents of which are incorporated by reference in in this application.

technical field

The invention relates to the technical field of wearable devices, in particular to a heat dissipation mechanism. The present invention also relates to a head-mounted display device.

Background technique

With the development of virtual reality and augmented reality technologies, more and more head-mounted display devices have been widely used.

At present, most of the head-mounted display devices use passive heat dissipation. The idea of solving heat dissipation is basically to transfer the heat of heating elements such as PCBA and battery modules to the casing, and then exchange heat with the outside air through the casing. It then dissipates heat into the air.

However, on the one hand, because the user often touches the casing when using the head-mounted display device, when the temperature of the casing is too high, the skin will feel uncomfortable, such as hot burns, resulting in a poor product wearing experience; on the other hand, due to Conventional housings have tightness requirements. The heat generated by the heating elements in the housing is easy to accumulate and cannot be quickly dissipated to the outside world, resulting in poor heat dissipation efficiency and low natural heat exchange efficiency between the housing and the air. To improve the heat exchange efficiency , the heat dissipation area of the housing must be increased additionally, resulting in a larger volume. In addition, although some head-mounted display devices use an air-cooled heat dissipation method in the casing, their air flow channels are complex, and they will be bent and turned many times in the casing, resulting in slow air flow and weakened heat dissipation efficiency.

Therefore, how to dissipate the heat to the outside in time, prevent the heat from accumulating in the housing, avoid the increase of the volume of the housing, and at the same time simplify the air flow channel and improve the air flow rate, is a technical problem faced by those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a heat dissipation mechanism, which can dissipate heat to the outside in time, prevent heat from accumulating in the housing, and prevent the volume of the housing from increasing, while simplifying the air flow path and increasing the air flow rate. Another object of the present invention is to provide a head-mounted display device.

In order to solve the above technical problems, the present invention provides a heat dissipation mechanism, which includes an air inlet opening at the bottom of the casing, an air outlet opening at the top of the casing, a mounting plate arranged in the casing and used for installing heating elements, A radiator arranged on the top of the mounting plate and used for dissipating the heat of the heating element, and a fan arranged on the top of the radiator to dissipate heat from the radiator through airflow, and the air outlet of the fan passes through the The radiator communicates with the air inlet, and the air outlet of the fan communicates with the air outlet.

Preferably, the casing includes a front casing and a rear casing, the air inlet is a bottom connecting gap between the front casing and the rear casing, and the air outlet is the front casing and the rear casing the top connection gap between.

Preferably, the heating element includes a PCBA and a battery module, the PCBA is mounted on the front surface of the mounting plate; the back of the mounting plate is provided with a mounting slot for mounting the battery module, and the fan draws air The port faces the back of the mounting plate.

Preferably, it also includes a heat absorbing plate attached to the surface of the heating element and used for absorbing its heat, and the heat absorbing plate is connected with the heat sink.

Preferably, it also includes a heat transfer pipe connected between the heat absorbing plate and the radiator for transferring the heat absorbed by the heat absorbing plate to the radiator.

Preferably, the top end face of the mounting plate is provided with ventilation holes for extending the heat conduction pipe from the front surface to the back surface thereof, and allowing the air flow to flow from the front surface thereof to the back surface thereof.

Preferably, the air outlet is opened on the back of the fan, and the air outlet is formed on the front surface of the fan; the radiator is attached to the back of the fan and covers the air outlet.

Preferably, a plurality of the fans are arranged in the casing, and each of the fans is installed above the top of the mounting plate and distributed symmetrically along the central axis of the mounting plate. The surface slopes downward.

Preferably, each of the fans is installed obliquely on the top of the mounting plate, so that the front surface of each of the fans is in contact with the top wall of the housing.

The present invention further provides a head-mounted display device, comprising a housing and a heat dissipation mechanism disposed in the housing, wherein the heat dissipation mechanism is specifically any of the heat dissipation mechanisms described above.

The heat dissipation mechanism provided by the present invention mainly includes an air inlet, an air outlet, a mounting plate, a radiator and a fan. Among them, the air inlet is opened at the bottom position of the casing, and the air outlet is opened at the top position of the casing, and the two are almost facing each other on the casing. The internal hot air is discharged to the outside through the air outlet, and an almost vertical air flow channel is formed in the casing along the vertical direction. The mounting plate is arranged in the housing and is mainly used to install heating elements such as PCBA. The radiator is set at the top of the mounting board, and is mainly used to absorb heat from heating elements such as PCBA, and dissipate it to prevent heat accumulation. The fan is arranged on the top of the radiator, and is provided with an air outlet and an air outlet. The air outlet communicates with the air inlet at the bottom of the casing after passing through the radiator, and the air outlet directly communicates with the air outlet at the top of the casing. It is mainly used to draw outside cold air from the air inlet, flow along the vertically distributed air flow channels in the casing, and pass through the radiator first before entering the air outlet, and force the heat dissipation surface of the radiator through the cold air flow. Convective heat dissipation, and then the hot air that has absorbed the heat dissipated by the radiator is directly discharged from the air outlet to the outside world through the air outlet, so as to achieve air cooling and heat dissipation of heating elements such as PCBA. Therefore, the heat dissipation mechanism provided by the present invention dissipates the heat of the heating elements such as PCBA through the radiator, and then draws the external cold air into the casing through the fan from the air inlet to quickly dissipate the heat from the radiator, and finally dissipates the heat through the fan. The hot air after absorbing heat is discharged from the air outlet to the outside, which can dissipate the heat to the outside in time to prevent the heat from accumulating in the shell, and because there is no need to use the surface area of the shell for heat dissipation, there is no need to increase the surface area of the shell. Thus, an increase in the volume of the housing is avoided.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

FIG. 1 is a schematic diagram of an exploded structure of a specific embodiment provided by the present invention.

FIG. 2 is a schematic diagram of the overall structure of FIG. 1 .

FIG. 3 is a cross-sectional view of FIG. 2 .

FIG. 4 is a schematic diagram of the opening position of the air inlet on the housing.

FIG. 5 is an enlarged schematic view of the A circle shown in FIG. 3 .

FIG. 6 is a schematic diagram of a partial structure of FIG. 2 .

FIG. 7 is a schematic view of FIG. 6 from another perspective.

FIG. 8 is a side view of FIG. 6 .

Among them, in Figure 1-Figure 8:

PCBA—a, battery module—b;

Shell-1, air inlet-2, air outlet-3, mounting plate-4, radiator-5, fan-6, heat-absorbing plate-7, heat-conducting pipe-8;

Front shell-11, rear shell-12, installation slot-41, ventilation hole-42, air outlet-61, exhaust port-62.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Please refer to FIG. 1 , FIG. 2 , and FIG. 3 , FIG. 1 is a schematic diagram of an exploded structure of a specific embodiment provided by the present invention, FIG. 2 is a schematic diagram of the overall structure of FIG. 1 , and FIG. 3 is a cross-sectional view of FIG. 2 . ,

In a specific embodiment provided by the present invention, the heat dissipation mechanism mainly includes an air inlet 2 , an air outlet 3 , a mounting plate 4 , a radiator 5 and a fan 6 .

Among them, the air inlet 2 is opened at the bottom position of the casing 1, and the air outlet 3 is opened at the top position of the casing 1, and the two are almost facing each other on the casing 1, and are mainly used for the outside cold air to enter through the air inlet 2. Inside the casing 1 , and the internal hot air is discharged to the outside through the air outlet 3 , and almost vertical air flow channels distributed in the vertical direction are formed in the casing 1 .

The mounting plate 4 is arranged in the housing 1, and is mainly used to install heating elements such as PCBA a and battery module b. The radiator 5 is arranged at the top of the mounting board 4, and is mainly used to absorb the heat of the heating elements such as PCBA a, and dissipate it to prevent heat accumulation.

The fan 6 is arranged on the top of the radiator 5, and is provided with an air outlet 61 and an air outlet 62. The air outlet 61 communicates with the air inlet 2 at the bottom of the casing 1 after passing through the radiator 5, and the air outlet 62 directly It communicates with the air outlet 3 at the top of the housing 1, and is mainly used to draw the outside cold air from the air inlet 2, flows along the vertically distributed air flow channels in the housing 1, and first passes through the air outlet 61 before entering the air outlet 61. The radiator 5 performs forced convection heat dissipation on the heat dissipation surface of the radiator 5 through the cold air flow, and then the hot air that has absorbed the heat dissipated by the radiator 5 is directly discharged from the air outlet 62 to the outside through the air outlet 3, so To achieve air cooling and heat dissipation of heating elements such as PCBA a.

Therefore, the heat dissipation mechanism provided in this embodiment dissipates the heat of the heating elements such as PCBA a through the radiator 5, and then draws the external cold air into the casing 1 through the fan 6 from the air inlet 2 to the radiator 5. Rapid heat dissipation is carried out, and finally the hot air after heat absorption is discharged from the air outlet 3 to the outside through the fan 6, which can dissipate the heat to the outside in time, prevent the heat from accumulating in the casing 1, and because there is no need to use the surface area of the casing 1. For heat dissipation, there is no need to increase the surface area of the casing 1 additionally, thereby avoiding an increase in the volume of the casing 1 .

At the same time, in this embodiment, the air inlet 2 opened at the bottom of the casing 1 and the air outlet 3 opened at the top of the casing 1 are used to form almost vertical air flow channels distributed along the vertical direction in the casing 1, so that the The cold air flows rapidly in the casing 1 and quickly completes the exchange of heat inside and outside the casing 1, so the air flow channel can be simplified and the air flow rate can be increased.

As shown in FIG. 4 and FIG. 5 , FIG. 4 is a schematic view of the opening position of the air inlet 2 on the housing 1 , and FIG. 5 is an enlarged schematic view of the A circle shown in FIG. 3 . In a preferred embodiment of the air inlet 2 and the air outlet 3, the air inlet 2 is specifically opened at the bottom wall of the housing 1, and the air outlet 3 is specifically opened at the top wall of the housing 1, and the two are almost in the same shape. The positional relationship is opposite to each other, so that when the outside cold air enters from the air inlet 2 at the bottom of the casing 1, it can rise vertically to the air outlet 3 at the top of the casing 1, and pass through the radiator during the flow process. 5 and fan 6.

Further, considering that the casing 1 is generally of a split structure, it mainly includes a front casing 11 and a rear casing 12, which can be buckled with each other to facilitate disassembly and assembly. Therefore, in this embodiment, the air inlet 2 is specifically The bottom connecting gap between the front shell 11 and the rear shell 12 , and the air outlet 3 is specifically the top connecting gap between the front shell 11 and the rear shell 12 . Among them, the specific size parameters of the connection gap of each part can be adjusted according to the actual situation.

As shown in FIG. 6 , FIG. 7 , and FIG. 8 , FIG. 6 is a schematic view of a partial structure of FIG. 2 , FIG. 7 is a schematic view of another perspective view of FIG. 6 , and FIG. 8 is a side view of FIG. 6 .

In a preferred embodiment of the mounting plate 4 , the mounting plate 4 mainly includes a plate body and a mounting groove 41 . The plate body is the main structure of the mounting plate 4 , generally in the shape of a rectangle, and can be detachably installed in the housing 1 through a snap connection structure or a fastener. The PCBA a is specifically arranged on the front surface of the mounting plate 4, for example, the paste and installation of the PCBA a on the mounting plate 4 can be realized by an adhesive such as silicone grease.

The installation slot 41 is opened on the back of the board, and is mainly used for installing the battery module b. Since the PCBA a and the battery module b are both heat-generating elements that generate a large amount of heat when the head-mounted display device is running, in this embodiment, not only the fan 6 is installed on the top of the mounting plate 4, but also the fan 6 The air outlet 61 faces the back of the mounting plate 4 . In this way, when the outside cold air enters the interior of the casing 1 from the air inlet 2 at the bottom of the casing 1, one of the airflows can naturally flow vertically along the surface of the mounting board 4, and can affect the electronic components such as chips on the PCBA a. The components dissipate heat, and another airflow flows vertically along the back of the mounting plate 4 under the action of the suction force of the air outlet 61 to dissipate heat to the battery module b. Of course, since the air outlet 61 of the fan 6 faces the back of the mounting plate 4, and is not directly facing the installation groove 41, but at a certain inclination angle to the surface of the installation groove 41, the suction force of the air outlet 61 can also be used to make the The outside cold air is drawn out again to dissipate heat from the heating elements such as the opto-mechanical components deep inside the casing 1 .

Further, the mounting plate 4 is specifically a metal plate such as a copper plate, an aluminum alloy plate, etc., all of which are good conductors of heat, so that the heat of the two can be absorbed by its close contact with the PCBA a and the battery module b, and used as a temperature equalizer. The heat is radiated to the outside by means of thermal radiation, so as to dissipate heat for the mounting plate 4 at the same time when the outside cold air enters the casing 1 . At the same time, the two sides of the mounting plate 4 can also be extended to connect with the side walls of the casing 1, so that the heat of the PCBA a and the battery module b absorbed by the mounting plate 4 is transferred to the casing 1, using the casing 1. The temperature difference with the outside cold air is used to dissipate heat, thereby realizing passive heat dissipation.

In addition, in order to improve the heat absorption efficiency of the mounting board 4 to the PCBA a and the battery module b, the front surface and the back of the mounting board 4 are also coated with endothermic viscous materials such as silicone grease. The stable installation of the PCBA a and the battery module b on the mounting board 4, on the other hand, accelerates the heat absorption efficiency of the mounting board 4.

In order to improve the heat dissipation efficiency of the heat sink 5 to the PCBA a, in this embodiment, a heat absorbing plate 7 is attached to the surface of the electronic components such as chips on the PCBA a. Specifically, the heat absorbing plate 7 can be a good conductor of heat such as a copper plate, an aluminum alloy plate, etc., and has a large surface area, which is closely attached to the surface of the PCBA a, and can efficiently absorb the heat of the PCBA a.

Further, in order to enable the heat absorption plate 7 to quickly transfer the absorbed heat to the radiator 5 , in this embodiment, a heat conduction pipe 8 is also connected to the heat absorption plate 7 . Specifically, one end of the heat conducting pipe 8 can be closely connected to the surface of the heat absorbing plate 7 , and the other end extends to the radiator 5 . Generally, the heat transfer pipe 8 can be a good conductor of heat such as a copper pipe, an aluminum alloy pipe, or the like. In addition, in order to facilitate the transfer of heat from the end of the heat pipe 8 to the entire radiator 5 , in this embodiment, a heat absorbing plate 7 is also provided at the end of the heat pipe 8 , and the heat absorbing plate 7 is closely attached to the radiator 5 . On the bottom surface, the heat absorbing plate 7 is used to increase the heat transfer area.

Not only that, considering that the fan 6 is arranged on the top of the mounting plate 4, and its air outlet 61 faces the back of the installation plate 4, and the radiator 5 is arranged at the air outlet 61 of the fan 6, in order to facilitate the The end is connected to the radiator 5 . In this embodiment, a ventilation hole 42 is opened on the top end face of the mounting plate 4 , so that the front surface space of the mounting plate 4 is communicated with the back space of the mounting plate 4 through the ventilation hole 42 . In this way, on the one hand, the heat pipe 8 can be extended from the ventilation through hole 42 to the back of the mounting plate 4, so as to be conveniently connected with the bottom surface of the radiator 5; After absorbing the heat of the PCBA a, the cold air flows to the back of the mounting board 4 through the ventilation holes 42, and smoothly enters the air outlet 61 of the radiator 5 and the fan 6, thereby preventing the heat of the PCBA a from being absorbed The air after that is accumulated in the casing 1 .

In a preferred embodiment of the fan 6, one fan 6 can be set alone, or more than one, such as 2 to 4, of course, considering the production cost and volume optimization, it is preferable to set two fans at the same time 6. Correspondingly, two radiators 5 are also provided at the same time, and they are respectively installed at the air suction ports 61 of the corresponding fans 6 . Similarly, two heat pipes 8 and ventilation holes 42 are also provided at the same time, wherein one end of the two heat pipes 8 is connected to the surface of the heat absorbing plate 7, and the other ends of the two heat pipes 8 pass through one of the two heat pipes 8 respectively. After the ventilation holes 42 are passed, they are connected to the bottom surfaces of the respective corresponding heat sinks 5 .

At the same time, considering that the PCBA a, the battery module b and the mounting board 4 all have a certain length, in order to improve the heat dissipation balance for the PCBA a and the battery module b, in this embodiment, two ventilation vias 42 are located on the mounting board 4 The top end face of the fan is distributed on both sides along its length direction (transverse direction). Correspondingly, two fans 6 are also installed on the top of the mounting plate 4 and distributed along the lateral direction (ie, the front surface of the fan faces downward). In this way, under the simultaneous operation of the two fans 6, the external cold air will be divided into multiple strands in the casing 1 and enter into the two radiators 5 for heat exchange at the same time, and the flow path substrate of the cold air covers the PCBA a and the PCBA. The entire surface of the battery module b to avoid uneven heat dissipation.

In addition, in order to make the flow channel in the fan 6 conform to the almost vertical flow channel in the casing 1, in the embodiment, the fan 6 is flat as a whole, so as to avoid occupying too much height space, and the air exhaust port 61 is specifically opened in the The back surface (bottom surface) of the fan 6 , and the air outlet 62 is specifically opened on the front surface (top surface) of the fan 6 . Correspondingly, the radiator 5 is mounted on the back of the fan 6 and covers the air outlet 61 . Specifically, the heat sink 5 can also be pasted on the back of the fan 6 by a heat-absorbing adhesive material such as silicone grease.

Further, considering that the air outlet 3 is opened in the top connecting gap of the front casing 11 and the rear casing 12, and the air outlet 62 of the fan 6 is aligned with the air outlet 3, the air outlet 62 can be specifically opened in the front of the fan 6. The front end position of the surface (rather than the center position of the back surface of the air outlet 61 ), and a rectangular mouth shape is formed to correspond to the air outlet 3 in the shape of a long and narrow slit. In addition, considering that the exhaust port 61 and the exhaust port 62 of the fan 6 are not coaxially arranged, and the exhaust port 62 is deviated from the center of the front surface of the fan 6, in order to reduce the wind resistance and avoid affecting the airflow velocity, in this embodiment, the fan 6 and the The front end side wall connected to the air outlet 62 is set as an arc-shaped plate, so that when the hot air circulates in the fan 6 , it can naturally flow to the air outlet 62 along the arc-shaped plate.

In addition, considering that the fan 6 is arranged at the top position of the mounting plate 4 and is located in the top area of the rear casing 12 as a whole, in order to prevent the existence of the fan 6 from occupying too much space at the top of the rear casing 12 and prevent the volume of the rear casing 12 from becoming larger, the In the present embodiment, each fan 6 is inclined on the top of the mounting plate 4, for example, inclined at 10° to 30°, etc., and is supported by the end of the heat-conducting pipe 8 that is bent and extended. In this way, each fan 6 can be ensured on the one hand. The air outlet 61 can be smoothly facing the back of the mounting plate 4 , and on the other hand, the front surface of each fan 6 can be in contact with the top wall of the rear casing 12 .

Further, the specific shape of the front surface of each fan 6 can match the shape of the top wall of the rear casing 12. Generally, the top wall shape of the rear casing 12 is an arc surface, and the front surface of the fan 6 is also of the same shape. The arc-shaped surface enables the front surface of the fan 6 to be in close contact with the top wall of the rear casing 12, thereby improving the pressing force and the installation stability.

In a preferred embodiment of the radiator 5, it is considered that the radiator 5 is pasted on the back of the fan 6 and covered at the air outlet 61, and the outside cold air is sucked by the air outlet 61 at the casing 1. When flowing inside, it will simultaneously pour into the circular (or rectangular) exhaust port 61 in multiple directions along the circumferential direction, in order to ensure that the cold air can smoothly enter the exhaust air through the various gaps in the radiator 5 during the flow process. Inside the port 61, in this embodiment, the heat sink 5 includes a plurality of sets of heat dissipation fins. Specifically, each group of heat dissipation fins can be arranged along different radial directions in the circumferential direction, for example, can be arranged in a circle or a rectangle, and each group of heat dissipation fins includes a plurality of parallel fins, so The direction of the gap between two adjacent fins is the same, and when the cold air passes through, the cold air flowing in from different directions can flow along the gaps in each group of heat dissipation fins distributed in the corresponding arrangement direction, so it can be reduced as much as possible. The wind resistance of the cold air when it is flowing to avoid affecting the wind speed.

This embodiment also provides a head-mounted display device, which mainly includes a casing 1 and a heat dissipation mechanism disposed in the casing 1 , wherein the specific content of the heat dissipation mechanism is the same as the above-mentioned related content, and will not be repeated here.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

A heat dissipation mechanism, characterized in that it comprises an air inlet (2) opened at the bottom of a casing (1), an air outlet (3) opened at the top of the casing (1), and an air outlet (3) opened at the top of the casing (1). ) and used to install a mounting plate (4) for heating elements, a radiator (5) arranged on the top of the mounting plate (4) and used to dissipate the heat of the heating element, and a radiator (5) arranged on the radiator (5) The top, a fan (6) for cooling the radiator (5) through airflow, and the air outlet (61) of the fan (6) communicates with the air inlet (2) through the radiator (5) , the air outlet (62) of the fan (6) communicates with the air outlet (3).
The heat dissipation mechanism according to claim 1, wherein the casing (1) comprises a front casing (11) and a rear casing (12), and the air inlet (2) is the front casing (11) The bottom connecting gap with the rear shell (12), and the air outlet (3) is the top connecting gap between the front shell (11) and the rear shell (12).
The heat dissipation mechanism according to claim 1, wherein the heating element comprises a PCBA (a) and a battery module (b), and the PCBA (a) is mounted on the front surface of the mounting plate (4); The back of the mounting plate (4) is provided with a mounting groove (41) for installing the battery module (b), and the air outlet (61) of the fan (6) faces the back of the mounting plate (4).
The heat dissipation mechanism according to any one of claims 1-3, characterized in that it further comprises a heat absorbing plate (7) attached to the surface of the heating element and used for absorbing its heat, and the heat absorbing plate (7) ) is connected to the radiator (5).
The heat dissipation mechanism according to claim 4, characterized in that it further comprises a connection between the heat absorbing plate (7) and the radiator (5) for absorbing the heat absorbed by the heat absorbing plate (7). The heat is transferred to the heat pipe (8) of the radiator (5).
The heat dissipation mechanism according to claim 5, characterized in that, the top end face of the mounting plate (4) is provided with a setting for extending the heat transfer pipe (8) from the front surface to the back surface thereof, so that the air flow can pass from the front surface thereof. Flow to the ventilation vias (42) on its back.
The heat dissipation mechanism according to claim 6, characterized in that, the air exhaust port (61) is opened at the back of the fan (6), and the air exhaust port (62) is opened at the back of the fan (6). Front surface; the radiator (5) is attached to the back of the fan (6) and covers the air outlet (61).
The heat dissipation mechanism according to claim 1, characterized in that, a plurality of the fans (6) are provided in the casing (1), and each of the fans (6) is mounted on the mounting plate (4). ) and symmetrically distributed along the central axis of the mounting plate, the front surface of the fan (6) is inclined downward.
The heat dissipation mechanism according to claim 8, characterized in that, each of the fans (6) is installed on the top of the mounting plate (4) obliquely, so that the front surface of each of the fans (6) is connected to the casing. The top wall of the body (1) abuts.
A head-mounted display device, comprising a casing (1) and a heat dissipation mechanism disposed in the casing (1), wherein the heat dissipation mechanism is specifically the heat dissipation mechanism according to any one of claims 1-9 mechanism.