WO2022193585A1 - Light sensing array module and light transceiver device - Google Patents

Light sensing array module and light transceiver device Download PDF

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Publication number
WO2022193585A1
WO2022193585A1 PCT/CN2021/118655 CN2021118655W WO2022193585A1 WO 2022193585 A1 WO2022193585 A1 WO 2022193585A1 CN 2021118655 W CN2021118655 W CN 2021118655W WO 2022193585 A1 WO2022193585 A1 WO 2022193585A1
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Prior art keywords
light
sensing array
pixels
shielding layer
optical transceiver
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PCT/CN2021/118655
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French (fr)
Chinese (zh)
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范辰玮
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神盾股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • H01L27/14621Colour filter arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • H01L27/14627Microlenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1463Pixel isolation structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14634Assemblies, i.e. Hybrid structures

Definitions

  • the present invention relates to an optical module and a device, and in particular, to a light sensing array module and an optical transceiver.
  • time-of-flight ranging device or LiDAR was developed, which can measure the time of flight of light to calculate the distance of objects.
  • a time-of-flight ranging device includes a laser transmitter and a light-sensing array.
  • Laser emitters emit laser light to illuminate objects in the outside world. External objects reflect the laser light back to the light sensing array.
  • the position and size of the opening of the casing determine the field of view angle of the light detected by the light sensing array.
  • the assembly position of the light sensing array in the casing is deviated, it is easy to cause part of the field of view to be blocked by the casing, resulting in increased edge noise.
  • the present invention is directed to a light sensing array module, which has both high quantum efficiency and low stray light interference.
  • the present invention is directed to an optical transceiver, which has both high quantum efficiency and low stray light interference.
  • An embodiment of the present invention provides a light sensing array module including a light sensing array substrate, a lens array and a light shielding layer.
  • the light sensing array substrate includes a plurality of pixels arranged in an array.
  • the lens array is disposed above the light sensing array substrate, and includes a plurality of microlenses disposed above the pixels respectively.
  • the light shielding layer is disposed between the light sensing array substrate and the lens array, and includes a plurality of light passing openings.
  • the light-passing openings are respectively disposed between the microlenses and the pixels, wherein light with an incident angle of the lens array within at least 14 degrees will be transmitted to the pixels through the light-passing openings without being blocked by the light shielding layer.
  • An embodiment of the present invention provides an optical transceiver, including a light-emitting element and the above-mentioned optical sensing array module.
  • the light-emitting element is used to emit light beams.
  • the light sensing array module is used for sensing the light generated by the object after reflecting the light beam.
  • the light-sensing array module and the light-transmitting device since a light-shielding layer is used to shield the stray light, and the light whose incident angle of the incident lens array is at least within 14 degrees is transmitted through these light-transmitting openings Therefore, the light-sensing array module and the light-transmitting device of the embodiments of the present invention have both high quantum efficiency and low stray light interference.
  • FIG. 1 is a schematic cross-sectional view of an optical transceiver according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the light sensing array module in FIG. 1 .
  • FIG. 3 is a schematic top view of the light shielding layer and the light spot in FIG. 2 .
  • FIG. 4 is a schematic top view of a light shielding layer and a light spot according to another embodiment of the present invention.
  • FIG. 5A is a schematic top view of a light spot formed by the light shielding layer in FIG. 3 and light incident obliquely in the x direction.
  • FIG. 5B is a schematic top view of a light spot formed by the light shielding layer in FIG. 3 and light incident obliquely in a diagonal direction.
  • the optical transceiver 100 of this embodiment includes a light emitting element 110 and a light sensing array module 200 .
  • the light emitting element 110 is used for emitting a light beam 112 .
  • the light sensing array module 200 is used for sensing the light 52 generated by the object 50 after reflecting the light beam 112 .
  • the light-emitting element 110 is a laser transmitter, such as a vertical cavity surface-emitting laser (VCSEL), and the light beam 112 is a laser beam.
  • the light emitting element 110 may also be other laser emitters or other kinds of light emitting elements.
  • the light sensing array module 200 includes a light sensing array substrate 210 , a lens array 220 and a light shielding layer 230 .
  • the light sensing array substrate 210 includes a plurality of pixels 211 arranged in an array (eg, a two-dimensional array).
  • the light sensing array substrate 210 is a single photon avalanche diode (SPAD) array substrate, and each pixel 211 may include a single photon avalanche diode 212 .
  • the optical transceiver 100 may be a time-of-flight ranging device, a light radar, or a proximity sensor.
  • the lens array 220 is disposed above the light sensing array substrate 210 and includes a plurality of microlenses 222 disposed above the pixels 211 respectively. That is to say, the microlenses 222 are also arranged in an array, for example, a two-dimensional array.
  • the light shielding layer 230 is disposed between the light sensing array substrate 210 and the lens array 220 and includes a plurality of light passing openings 232 .
  • the light-transmitting openings 232 are respectively disposed between the microlenses 222 and the pixels 211 . That is to say, the light-transmitting openings 232 are arranged in an array, for example, a two-dimensional array.
  • the light whose incident angle ⁇ of the incident lens array 220 is at least within 14 degrees will be transmitted to the pixels 211 through the light-transmitting openings 232 without being blocked by the light shielding layer 230 .
  • the incident angle ⁇ is defined as the angle between the traveling direction of the light 52 and the normal line N of the lens array 220 , and the normal line N is, for example, parallel to the optical axis of the microlens 222 .
  • the light-shielding layer 230 is used to shield the stray light, and the light 52 whose incident angle ⁇ of the incident lens array 220 is at least within 14 degrees will pass through the light-shielding layer 230 .
  • the light-transmitting openings 232 are transmitted to the pixels 211 without being blocked by the light-shielding layer 230 . Therefore, the light-sensing array module 200 and the light-transmitting device 100 of this embodiment have both high quantum efficiency and low stray light interference.
  • the light shielding layer 230 is a metal layer, which is, for example, a metal layer formed of the same material as the metal circuit layer used to electrically connect the pixels 211 in the semiconductor process of fabricating the photo-sensing array substrate 210 .
  • each light-passing opening 232 matches the shape of the light spot 53 formed at the light-passing opening 232 after the light 52 passes through the corresponding microlens 222 .
  • the microlens 222 is, for example, a convex lens, the cross-section of which is shown in FIG. 2 , however, the top view of the microlens 222 is, for example, a square, so the light spot 53 is in an X shape, and the light-passing opening is 232 also assumes a shape that matches the X-shape.
  • the light shielding layer 230 can allow the effective light 52 to pass through without blocking it, and on the other hand, can also block other stray light, so that the light sensing array module 200 of the present embodiment and the optical transceiver 100 can be combined With high quantum efficiency and low stray light interference.
  • the light spot 53 has at least one recess 55
  • the inner wall 234 of the light-passing opening 232 has at least one protrusion 235 protruding toward the at least one recess 55
  • the inner wall 234 of the light-transmitting opening 232 has four protrusions 235 protruding toward the four depressions 55 .
  • the light-transmitting opening may also exhibit a shape that matches it.
  • the shape of the light-transmitting opening 232a can be matched with it to be elliptical.
  • the light spot can also be circular, and the shape of the light-passing opening can be matched with it to be circular.
  • the light spot can have other shapes, and the shape of the light-pass opening can be matched with it.
  • the optical transceiver 100 further includes a controller 120 that is electrically connected to the light emitting element 110 and the light sensing array substrate 210 and used to calculate the object 50 according to the flight time or phase of the light beam 112 and the light 52 .
  • the distance, that is, the optical transceiver device 100 is a time-of-flight ranging device or a light radar.
  • the controller 120 is, for example, a central processing unit (CPU), a microprocessor (microprocessor), a digital signal processor (DSP), a programmable controller, a programmable controller, or a programmable controller.
  • CPU central processing unit
  • microprocessor microprocessor
  • DSP digital signal processor
  • FIG. 5A is a schematic top view of a light spot formed by the light shielding layer in FIG. 3 and light incident obliquely in the x direction
  • FIG. 5B is a schematic diagram of the light shielding layer in FIG. 3 and light incident obliquely in the diagonal direction. Schematic top view of the formed light spot.
  • FIGS. 1 , 2 , 5A and 5B when the light 52 is incident on a position off-center of the light sensing array module 200 , the light 52 may be incident obliquely, so that the light 52 formed at the light-transmitting opening 232 is obliquely incident.
  • the light spot 53b (as shown in FIG. 5A ) or the light spot 53c (as shown in FIG.
  • the light spot 53b in FIG. 5A is formed by the light 52 with an incident angle ⁇ of 14 degrees in the x direction, while the light spot 53c in FIG. direction, where the x-direction is perpendicular to the y-direction) formed by light 52 with an incident angle ⁇ of 14 degrees.
  • the light 52 with the incident angle ⁇ exceeding 14 degrees will be blocked by the light shielding layer 230 , especially in the diagonal direction as shown in FIG. 5B .
  • the light 52 with the incident angle ⁇ of the incident lens array 220 within at least 20 degrees will be transmitted to the pixels 211 through the light-transmitting openings 232 without being blocked by the light shielding layer 230 .
  • the light 52 with the incident angle ⁇ of the incident lens array 220 within 20 degrees will be transmitted to the pixels 211 through the light-transmitting openings 232 without being blocked by the light shielding layer 230 , and the incident angle ⁇ exceeds 20 degrees.
  • the light 52 is blocked by the light shielding layer 230 .
  • the light 52 with the incident angle ⁇ of the incident lens array 220 within at least 40 degrees will be transmitted to the pixels 211 through the light passage openings 232 without being blocked by the light shielding layer 230 .
  • the light 52 with the incident angle ⁇ of the incident lens array 220 within 40 degrees will be transmitted to the pixels 211 through the light passage openings 232 without being blocked by the light shielding layer 230 , and the incident angle ⁇ exceeds 40 degrees. The light 52 is blocked by the light shielding layer 230 .
  • the light sensing array module 200 of this embodiment may include another light shielding layer 240 , and the light shielding layer 240 may have light-passing openings 242 respectively disposed between the microlenses 222 and the pixels 211 .
  • the design of the light-passing opening 242 can be the same as that of the light-passing opening 232 , that is, the shape of the light-passing opening 242 can match the shape of the light spot formed by the light 52 passing through the light-passing opening 242 . Since the light shielding layer 240 is disposed between the light shielding layer 230 and the light sensing array substrate 210 , the size of the light passing opening 242 can be smaller than that of the light passing opening 232 .
  • the light-shielding layer 240 may also be a metal layer, which is, for example, a metal layer formed of the same material as the metal circuit layer used to electrically connect the pixels 211 in the semiconductor process of fabricating the light sensing array substrate 210 .
  • the metal circuit layer may have multiple layers, several layers of the metal circuit layer (eg, N layers, N is greater than or equal to 1) can be selected as the light shielding layer with the above characteristics (ie, the same design concept as the light shielding layer 230 ).
  • the light-shielding layer with the above-mentioned properties may also have only one layer (ie, the light-shielding layer 230 ).
  • the light sensing array module 200 may only have the light shielding layer 230 without the light shielding layer 240 .
  • the light shielding layer is used to shield the stray light, and the light with the incident angle of the incident lens array within at least 14 degrees can pass through.
  • the light-passing openings are transmitted to the pixels without being blocked by the light-shielding layer, so the light-sensing array module and the light-transmitting device of the embodiments of the present invention have both high quantum efficiency and low stray light interference.

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  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

Provided are a light sensing array module and a light transceiver device, the light sensing array module comprising a light sensing array substrate, a lens array and a light shielding layer. The light sensing array substrate comprises a plurality of pixels arranged in an array. The lens array is configured above the light sensing array substrate, and comprises a plurality of microlenses respectively configured above the pixels. The light shielding layer is disposed between the light sensing array substrate and the lens array, and comprises a plurality of light-passing openings. The light-passing openings are respectively configured between the microlenses and the pixels, and light that is incident into the lens array at an incident angle of at least 14 degrees or less will be transmitted to the pixels through the light-passing openings without being shielded by the light shielding layer.

Description

光感测阵列模块与光收发装置Optical sensing array module and optical transceiver 技术领域technical field
本发明涉及一种光学模块与装置,且特别是涉及一种光感测阵列模块与光收发装置。The present invention relates to an optical module and a device, and in particular, to a light sensing array module and an optical transceiver.
背景技术Background technique
随着光电技术的进步,飞行时间测距装置(time-of-flight ranging device)或光雷达(LiDAR)被发展出来,其可测量光的飞行时间,以计算出物体的距离。With the advancement of optoelectronic technology, time-of-flight ranging device or LiDAR was developed, which can measure the time of flight of light to calculate the distance of objects.
飞行时间测距装置或光雷达包括激光发射器与光感测阵列。激光发射器发出激光,以照射外界的物体。外界的物体再将激光反射回光感测阵列。A time-of-flight ranging device, or lidar, includes a laser transmitter and a light-sensing array. Laser emitters emit laser light to illuminate objects in the outside world. External objects reflect the laser light back to the light sensing array.
在习知的飞行时间测距装置或光雷达中,是以壳体的开口位置与大小来决定光感测阵列所侦测到的光的视场角。但当光感测阵列在壳体中的组装位置有偏差时,容易使部分的视场角被壳体遮挡,而使得边缘噪声增加。In the conventional time-of-flight ranging device or lidar, the position and size of the opening of the casing determine the field of view angle of the light detected by the light sensing array. However, when the assembly position of the light sensing array in the casing is deviated, it is easy to cause part of the field of view to be blocked by the casing, resulting in increased edge noise.
若是使用角度滤光器(angular filter)来过滤掉信号以外的大角度光线,虽然提高了信噪比(signal-to-noise ratio),却牺牲了量子效率(quantum efficiency)。If an angular filter is used to filter out large-angle light outside the signal, although the signal-to-noise ratio is improved, quantum efficiency is sacrificed.
发明内容SUMMARY OF THE INVENTION
本发明是针对一种光感测阵列模块,其兼具高量子效率与低杂光干扰。The present invention is directed to a light sensing array module, which has both high quantum efficiency and low stray light interference.
本发明是针对一种光收发装置,其兼具高量子效率与低杂光干扰。The present invention is directed to an optical transceiver, which has both high quantum efficiency and low stray light interference.
本发明的一实施例提出一种光感测阵列模块,包括光感测阵列基板、透镜阵列及遮光层。光感测阵列基板包括排成阵列的多个像素。透镜阵列配置于光感测阵列基板的上方,且包括分别配置于这些像素上方的多个微透镜。遮光层配置于光感测阵列基板与透镜阵列之间,且包括多个通光开口。这些通光开口分别配置于这些微透镜与这些像素之间,其中入射透镜阵列的入射角至少在14度以内的光会通过这些通光开口传递至这些像素,而不会被遮光层遮挡。An embodiment of the present invention provides a light sensing array module including a light sensing array substrate, a lens array and a light shielding layer. The light sensing array substrate includes a plurality of pixels arranged in an array. The lens array is disposed above the light sensing array substrate, and includes a plurality of microlenses disposed above the pixels respectively. The light shielding layer is disposed between the light sensing array substrate and the lens array, and includes a plurality of light passing openings. The light-passing openings are respectively disposed between the microlenses and the pixels, wherein light with an incident angle of the lens array within at least 14 degrees will be transmitted to the pixels through the light-passing openings without being blocked by the light shielding layer.
本发明的一实施例提出一种光收发装置,包括发光元件及上述光感测阵列模块。发光元件用以发出光束。光感测阵列模块用以感测物体在反射光束后所产生的光。An embodiment of the present invention provides an optical transceiver, including a light-emitting element and the above-mentioned optical sensing array module. The light-emitting element is used to emit light beams. The light sensing array module is used for sensing the light generated by the object after reflecting the light beam.
在本发明的实施例的光感测阵列模块与光收发装置中,由于采用了遮光层来遮挡杂光,且使入射透镜阵列的入射角至少在14度以内的光会通过这些通光开口传递至这些像素,而不会被遮光层遮挡,因此本发明的实施例的光感测阵列模块与光收发装置兼具高量子效率与低杂光干扰。In the light-sensing array module and the light-transmitting device according to the embodiments of the present invention, since a light-shielding layer is used to shield the stray light, and the light whose incident angle of the incident lens array is at least within 14 degrees is transmitted through these light-transmitting openings Therefore, the light-sensing array module and the light-transmitting device of the embodiments of the present invention have both high quantum efficiency and low stray light interference.
附图说明Description of drawings
图1为本发明的一实施例的光收发装置的剖面示意图。FIG. 1 is a schematic cross-sectional view of an optical transceiver according to an embodiment of the present invention.
图2为图1中的光感测阵列模块的剖面示意图。FIG. 2 is a schematic cross-sectional view of the light sensing array module in FIG. 1 .
图3为图2中的遮光层与光斑的上视示意图。FIG. 3 is a schematic top view of the light shielding layer and the light spot in FIG. 2 .
图4为本发明的另一实施例的遮光层与光斑的上视示意图。4 is a schematic top view of a light shielding layer and a light spot according to another embodiment of the present invention.
图5A为图3中的遮光层与在x方向上斜向入射的光所形成的光斑的上视示意图。FIG. 5A is a schematic top view of a light spot formed by the light shielding layer in FIG. 3 and light incident obliquely in the x direction.
图5B为图3中的遮光层与在对角线方向上斜向入射的光所形成的光斑的上视示意图。FIG. 5B is a schematic top view of a light spot formed by the light shielding layer in FIG. 3 and light incident obliquely in a diagonal direction.
具体实施方式Detailed ways
现将详细地参考本发明的示范性实施例,示范性实施例的实例说明于附图中。只要有可能,相同元件符号在图式和描述中用来表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.
图1为本发明的一实施例的光收发装置的剖面示意图,图2为图1中的光感测阵列模块的剖面示意图,而图3为图2中的遮光层与光斑的上视示意图。请参照图1至图3,本实施例的光收发装置100包括发光元件110及光感测阵列模块200。发光元件110用以发出光束112。光感测阵列模块200用以感测物体50在反射光束112后所产生的光52。在本实施例中,发光元件110为激光发射器,例如为垂直共振腔面射型激光器(vertical cavity surface-emitting laser,VCSEL),而光束112为激光束。然而,在其他实施例 中,发光元件110也可以是其他激光发射器或其他种类的发光元件。光感测阵列模块200包括光感测阵列基板210、透镜阵列220及遮光层230。光感测阵列基板210包括排成阵列(例如是二维阵列)的多个像素211。在本实施例中,光感测阵列基板210为单光子雪崩二极管(single photon avalanche diode,SPAD)阵列基板,而每一像素211可包括单光子雪崩二极管212。也就是说,在本实施例中,光收发装置100可为飞行时间测距装置、光雷达或接近传感器(proximity sensor)。1 is a schematic cross-sectional view of an optical transceiver according to an embodiment of the present invention, FIG. 2 is a cross-sectional schematic view of the light sensing array module in FIG. 1 , and FIG. 3 is a schematic top view of the light shielding layer and the light spot in FIG. Referring to FIG. 1 to FIG. 3 , the optical transceiver 100 of this embodiment includes a light emitting element 110 and a light sensing array module 200 . The light emitting element 110 is used for emitting a light beam 112 . The light sensing array module 200 is used for sensing the light 52 generated by the object 50 after reflecting the light beam 112 . In this embodiment, the light-emitting element 110 is a laser transmitter, such as a vertical cavity surface-emitting laser (VCSEL), and the light beam 112 is a laser beam. However, in other embodiments, the light emitting element 110 may also be other laser emitters or other kinds of light emitting elements. The light sensing array module 200 includes a light sensing array substrate 210 , a lens array 220 and a light shielding layer 230 . The light sensing array substrate 210 includes a plurality of pixels 211 arranged in an array (eg, a two-dimensional array). In this embodiment, the light sensing array substrate 210 is a single photon avalanche diode (SPAD) array substrate, and each pixel 211 may include a single photon avalanche diode 212 . That is, in this embodiment, the optical transceiver 100 may be a time-of-flight ranging device, a light radar, or a proximity sensor.
透镜阵列220配置于光感测阵列基板210的上方,且包括分别配置于这些像素211上方的多个微透镜222。也就是说,微透镜222亦呈阵列配置,例如是呈二维阵列配置。遮光层230配置于光感测阵列基板210与透镜阵列220之间,且包括多个通光开口232。这些通光开口232分别配置于这些微透镜222与这些像素211之间。也就是说,这些通光开口232呈阵列配置,例如是呈二维阵列配置。其中,入射透镜阵列220的入射角θ至少在14度以内的光会通过这些通光开口232传递至这些像素211,而不会被遮光层230遮挡。其中,入射角θ定义为光52的行进方向与透镜阵列220的法线N的夹角,而法线N例如平行于微透镜222的光轴。The lens array 220 is disposed above the light sensing array substrate 210 and includes a plurality of microlenses 222 disposed above the pixels 211 respectively. That is to say, the microlenses 222 are also arranged in an array, for example, a two-dimensional array. The light shielding layer 230 is disposed between the light sensing array substrate 210 and the lens array 220 and includes a plurality of light passing openings 232 . The light-transmitting openings 232 are respectively disposed between the microlenses 222 and the pixels 211 . That is to say, the light-transmitting openings 232 are arranged in an array, for example, a two-dimensional array. The light whose incident angle θ of the incident lens array 220 is at least within 14 degrees will be transmitted to the pixels 211 through the light-transmitting openings 232 without being blocked by the light shielding layer 230 . The incident angle θ is defined as the angle between the traveling direction of the light 52 and the normal line N of the lens array 220 , and the normal line N is, for example, parallel to the optical axis of the microlens 222 .
在本实施例的光感测阵列模块200与光收发装置100中,由于采用了遮光层230来遮挡杂光,且使入射透镜阵列220的入射角θ至少在14度以内的光52会通过这些通光开口232传递至这些像素211,而不会被遮光层230遮挡,因此本实施例的光感测阵列模块200与光收发装置100兼具高量子效率与低杂光干扰。In the light-sensing array module 200 and the light-transmitting device 100 of the present embodiment, the light-shielding layer 230 is used to shield the stray light, and the light 52 whose incident angle θ of the incident lens array 220 is at least within 14 degrees will pass through the light-shielding layer 230 . The light-transmitting openings 232 are transmitted to the pixels 211 without being blocked by the light-shielding layer 230 . Therefore, the light-sensing array module 200 and the light-transmitting device 100 of this embodiment have both high quantum efficiency and low stray light interference.
在本实施例中,遮光层230为金属层,其例如为在制作光感测阵列基板210的半导体制程中,与用以电性连接像素211的金属线路层相同的材质所形成的金属层。In this embodiment, the light shielding layer 230 is a metal layer, which is, for example, a metal layer formed of the same material as the metal circuit layer used to electrically connect the pixels 211 in the semiconductor process of fabricating the photo-sensing array substrate 210 .
在本实施例中,每一通光开口232的形状与光52通过对应的微透镜222后在通光开口232处所形成的光斑53的形状相配合。举例而言,在本实施例中,微透镜222例如为凸透镜,其剖面如图2所绘示,然而,微透镜222的上视图例如呈方形,因此光斑53会呈现X形,而通光开口232也呈现与X形相配合的形状。如此一来,遮光层230可以让有效的光52通过而不会将其 遮挡,另一方面也可以遮挡其他杂光,因此可使本实施例的光感测阵列模块200与光收发装置100兼具高量子效率与低杂光干扰。In this embodiment, the shape of each light-passing opening 232 matches the shape of the light spot 53 formed at the light-passing opening 232 after the light 52 passes through the corresponding microlens 222 . For example, in this embodiment, the microlens 222 is, for example, a convex lens, the cross-section of which is shown in FIG. 2 , however, the top view of the microlens 222 is, for example, a square, so the light spot 53 is in an X shape, and the light-passing opening is 232 also assumes a shape that matches the X-shape. In this way, the light shielding layer 230 can allow the effective light 52 to pass through without blocking it, and on the other hand, can also block other stray light, so that the light sensing array module 200 of the present embodiment and the optical transceiver 100 can be combined With high quantum efficiency and low stray light interference.
在本实施例中,光斑53具有至少一凹陷处55,而通光开口232的内壁234具有往至少一凹陷处55凸出的至少一凸起部235。当光斑53呈X形,而具有四个凹陷处55时,通光开口232的内壁234具有往四个凹陷处55凸出的四个凸起部235。In this embodiment, the light spot 53 has at least one recess 55 , and the inner wall 234 of the light-passing opening 232 has at least one protrusion 235 protruding toward the at least one recess 55 . When the light spot 53 is X-shaped and has four depressions 55 , the inner wall 234 of the light-transmitting opening 232 has four protrusions 235 protruding toward the four depressions 55 .
在其他实施例中,当光斑呈现其他形状或不具有凹陷处时,通光开口也可以呈现与其相配合的形状。举例而言,请参照图4,在另一实施例中,当光斑53a呈椭圆形时,通光开口232a的形状可与其相配合而呈椭圆形。在其他实施例中,光斑也可以呈圆形,而通光开口的形状可与其相配合而呈圆形。或者,光斑也可以呈现其他形状,而通光开口的形状可与其相配合。In other embodiments, when the light spot exhibits other shapes or does not have a recess, the light-transmitting opening may also exhibit a shape that matches it. For example, referring to FIG. 4 , in another embodiment, when the light spot 53a is elliptical, the shape of the light-transmitting opening 232a can be matched with it to be elliptical. In other embodiments, the light spot can also be circular, and the shape of the light-passing opening can be matched with it to be circular. Alternatively, the light spot can have other shapes, and the shape of the light-pass opening can be matched with it.
在本实施例中,光收发装置100还包括控制器120,电性连接至发光元件110与光感测阵列基板210,且用以根据光束112与光52的飞行时间或相位来计算出物体50的距离,也就是光收发装置100为飞行时间测距装置或光雷达。In this embodiment, the optical transceiver 100 further includes a controller 120 that is electrically connected to the light emitting element 110 and the light sensing array substrate 210 and used to calculate the object 50 according to the flight time or phase of the light beam 112 and the light 52 . The distance, that is, the optical transceiver device 100 is a time-of-flight ranging device or a light radar.
在一实施例中,控制器120例如为中央处理单元(central processing unit,CPU)、微处理器(microprocessor)、数字信号处理器(digital signal processor,DSP)、可程序化控制器、可程序化逻辑设备(programmable logic device,PLD)或其他类似装置或这些装置的组合,本发明并不加以限制。此外,在一实施例中,控制器120的各功能可被实作为多个程序代码。这些程序代码会被储存在一个内存中,由控制器120来执行这些程序代码。或者,在一实施例中,控制器120的各功能可被实作为一或多个电路。本发明并不限制用软件或硬件的方式来实作控制器120的各功能。In one embodiment, the controller 120 is, for example, a central processing unit (CPU), a microprocessor (microprocessor), a digital signal processor (DSP), a programmable controller, a programmable controller, or a programmable controller. A logic device (programmable logic device, PLD) or other similar devices or a combination of these devices is not limited by the present invention. Furthermore, in one embodiment, each function of the controller 120 may be implemented as a plurality of program codes. These program codes will be stored in a memory and executed by the controller 120 . Alternatively, in one embodiment, the functions of controller 120 may be implemented as one or more circuits. The present invention does not limit the implementation of the functions of the controller 120 by means of software or hardware.
图5A为图3中的遮光层与在x方向上斜向入射的光所形成的光斑的上视示意图,图5B为图3中的遮光层与在对角线方向上斜向入射的光所形成的光斑的上视示意图。请参照图1、图2、图5A及图5B,当光52入射至光感测阵列模块200偏离中心的位置时,光52可以是斜向入射的,而使得在通光开口232处所形成的光斑53b(如图5A所绘示)或光斑53c(如图5B所绘示)可以是扭曲变形的,例如往一边或一角歪斜。其中,图5A的光斑53b 是由在x方向有14度的入射角θ的光52所形成,而图5B的光斑53c是由在对角线方向(即与x方向与y方向皆夹45度的方向,其中x方向垂直于y方向)有14度的入射角θ的光52所形成。5A is a schematic top view of a light spot formed by the light shielding layer in FIG. 3 and light incident obliquely in the x direction, and FIG. 5B is a schematic diagram of the light shielding layer in FIG. 3 and light incident obliquely in the diagonal direction. Schematic top view of the formed light spot. Referring to FIGS. 1 , 2 , 5A and 5B, when the light 52 is incident on a position off-center of the light sensing array module 200 , the light 52 may be incident obliquely, so that the light 52 formed at the light-transmitting opening 232 is obliquely incident. The light spot 53b (as shown in FIG. 5A ) or the light spot 53c (as shown in FIG. 5B ) may be distorted, for example, skewed to one side or a corner. The light spot 53b in FIG. 5A is formed by the light 52 with an incident angle θ of 14 degrees in the x direction, while the light spot 53c in FIG. direction, where the x-direction is perpendicular to the y-direction) formed by light 52 with an incident angle θ of 14 degrees.
在本实施例中,入射角θ超过14度的光52会被遮光层230遮挡,尤其是在如图5B的对角线方向。然而,在其他实施例中,入射透镜阵列220的入射角θ至少在20度以内的光52会通过这些通光开口232传递至这些像素211,而不会被遮光层230遮挡。在一实施例中,入射透镜阵列220的入射角θ在20度以内的光52会通过这些通光开口232传递至这些像素211,而不会被遮光层230遮挡,而入射角θ超过20度的光52则被遮光层230遮挡。或者,在另一实施例中,入射透镜阵列220的入射角θ至少在40度以内的光52会通过这些通光开口232传递至这些像素211,而不会被遮光层230遮挡。在一实施例中,入射透镜阵列220的入射角θ在40度以内的光52会通过这些通光开口232传递至这些像素211,而不会被遮光层230遮挡,而入射角θ超过40度的光52则被遮光层230遮挡。In this embodiment, the light 52 with the incident angle θ exceeding 14 degrees will be blocked by the light shielding layer 230 , especially in the diagonal direction as shown in FIG. 5B . However, in other embodiments, the light 52 with the incident angle θ of the incident lens array 220 within at least 20 degrees will be transmitted to the pixels 211 through the light-transmitting openings 232 without being blocked by the light shielding layer 230 . In one embodiment, the light 52 with the incident angle θ of the incident lens array 220 within 20 degrees will be transmitted to the pixels 211 through the light-transmitting openings 232 without being blocked by the light shielding layer 230 , and the incident angle θ exceeds 20 degrees. The light 52 is blocked by the light shielding layer 230 . Alternatively, in another embodiment, the light 52 with the incident angle θ of the incident lens array 220 within at least 40 degrees will be transmitted to the pixels 211 through the light passage openings 232 without being blocked by the light shielding layer 230 . In one embodiment, the light 52 with the incident angle θ of the incident lens array 220 within 40 degrees will be transmitted to the pixels 211 through the light passage openings 232 without being blocked by the light shielding layer 230 , and the incident angle θ exceeds 40 degrees. The light 52 is blocked by the light shielding layer 230 .
请在参照图2,本实施例的光感测阵列模块200可包括另一遮光层240,遮光层240可具有分别配置于这些微透镜222与这些像素211之间的通光开口242。通光开口242的设计方式可与通光开口232一样,也就是通光开口242的形状可与光52在通过通光开口242处所形成的光斑的形状相配合。由于遮光层240配至于遮光层230与光感测阵列基板210之间,因此通光开口242的尺寸可以比通光开口232小。Referring to FIG. 2 , the light sensing array module 200 of this embodiment may include another light shielding layer 240 , and the light shielding layer 240 may have light-passing openings 242 respectively disposed between the microlenses 222 and the pixels 211 . The design of the light-passing opening 242 can be the same as that of the light-passing opening 232 , that is, the shape of the light-passing opening 242 can match the shape of the light spot formed by the light 52 passing through the light-passing opening 242 . Since the light shielding layer 240 is disposed between the light shielding layer 230 and the light sensing array substrate 210 , the size of the light passing opening 242 can be smaller than that of the light passing opening 232 .
如同遮光层230,遮光层240也可以是金属层,其例如为在制作光感测阵列基板210的半导体制程中,与用以电性连接像素211的金属线路层相同的材质所形成的金属层。由于金属线路层可以有多层,因此可以选择金属线路层中的几层(例如N层,N大于等于1)来作为具有上述特性(即与遮光层230的设计概念相同)的遮光层。在其他实施例中,具有上述特性的遮光层也可以只有一层(即遮光层230)。或者,光感测阵列模块200也可以只具有遮光层230,而不具有遮光层240。Like the light-shielding layer 230 , the light-shielding layer 240 may also be a metal layer, which is, for example, a metal layer formed of the same material as the metal circuit layer used to electrically connect the pixels 211 in the semiconductor process of fabricating the light sensing array substrate 210 . . Since the metal circuit layer may have multiple layers, several layers of the metal circuit layer (eg, N layers, N is greater than or equal to 1) can be selected as the light shielding layer with the above characteristics (ie, the same design concept as the light shielding layer 230 ). In other embodiments, the light-shielding layer with the above-mentioned properties may also have only one layer (ie, the light-shielding layer 230 ). Alternatively, the light sensing array module 200 may only have the light shielding layer 230 without the light shielding layer 240 .
综上所述,在本发明的实施例的光感测阵列模块与光收发装置中,由于采用了遮光层来遮挡杂光,且使入射透镜阵列的入射角至少在14度以内的光 会通过这些通光开口传递至这些像素,而不会被遮光层遮挡,因此本发明的实施例的光感测阵列模块与光收发装置兼具高量子效率与低杂光干扰。To sum up, in the light sensing array module and the light transceiver device according to the embodiments of the present invention, the light shielding layer is used to shield the stray light, and the light with the incident angle of the incident lens array within at least 14 degrees can pass through. The light-passing openings are transmitted to the pixels without being blocked by the light-shielding layer, so the light-sensing array module and the light-transmitting device of the embodiments of the present invention have both high quantum efficiency and low stray light interference.
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (17)

  1. 一种光感测阵列模块,其特征在于,包括:A light sensing array module, characterized in that it includes:
    光感测阵列基板,包括排成阵列的多个像素;a light sensing array substrate, including a plurality of pixels arranged in an array;
    透镜阵列,配置于所述光感测阵列基板的上方,且包括分别配置于所述多个像素上方的多个微透镜;以及a lens array, disposed above the light sensing array substrate, and comprising a plurality of microlenses disposed above the plurality of pixels respectively; and
    遮光层,配置于所述光感测阵列基板与所述透镜阵列之间,且包括多个通光开口,所述多个通光开口分别配置于所述多个微透镜与所述多个像素之间,其中入射所述透镜阵列的入射角至少在14度以内的光会通过所述多个通光开口传递至所述多个像素,而不会被所述遮光层遮挡。The light shielding layer is disposed between the light sensing array substrate and the lens array, and includes a plurality of light-passing openings, and the plurality of light-passing openings are respectively disposed on the plurality of microlenses and the plurality of pixels In between, the light incident on the lens array with an incident angle within at least 14 degrees will be transmitted to the plurality of pixels through the plurality of light-passing openings, and will not be blocked by the light shielding layer.
  2. 根据权利要求1所述的光感测阵列模块,其特征在于,每一通光开口的形状与光通过对应的微透镜后在所述通光开口处所形成的光斑的形状相配合。The light-sensing array module according to claim 1, wherein the shape of each light-passing opening matches the shape of a light spot formed at the light-passing opening after light passes through the corresponding microlens.
  3. 根据权利要求2所述的光感测阵列模块,其特征在于,所述光斑具有至少一凹陷处,而所述通光开口的内壁具有往所述至少一凹陷处凸出的至少一凸起部。The light sensing array module according to claim 2, wherein the light spot has at least one recess, and the inner wall of the light-passing opening has at least one protrusion protruding toward the at least one recess. .
  4. 根据权利要求3所述的光感测阵列模块,其特征在于,所述光斑呈X形,且具有四个凹陷处,而所述通光开口的内壁具有往所述四个凹陷处凸出的四个凸起部。The light-sensing array module according to claim 3, wherein the light spot is X-shaped and has four recesses, and the inner wall of the light-passing opening has protrusions toward the four recesses. Four protrusions.
  5. 根据权利要求1所述的光感测阵列模块,其特征在于,入射所述透镜阵列的入射角至少在20度以内的光会通过所述多个通光开口传递至所述多个像素,而不会被所述遮光层遮挡。The light sensing array module according to claim 1, wherein light with an incident angle of at least 20 degrees incident on the lens array is transmitted to the plurality of pixels through the plurality of light-passing openings, and will not be blocked by the light shielding layer.
  6. 根据权利要求5所述的光感测阵列模块,其特征在于,入射所述透镜阵列的入射角至少在40度以内的光会通过所述多个通光开口传递至所述多个像素,而不会被所述遮光层遮挡。The light sensing array module according to claim 5, wherein light with an incident angle of at least 40 degrees incident on the lens array is transmitted to the plurality of pixels through the plurality of light-transmitting openings, and will not be blocked by the light shielding layer.
  7. 根据权利要求1所述的光感测阵列模块,其特征在于,所述遮光层为金属层。The light sensing array module according to claim 1, wherein the light shielding layer is a metal layer.
  8. 根据权利要求1所述的光感测阵列模块,其特征在于,所述光感测阵列基板为单光子雪崩二极管阵列基板。The light sensing array module according to claim 1, wherein the light sensing array substrate is a single photon avalanche diode array substrate.
  9. 一种光收发装置,其特征在于,包括:An optical transceiver, characterized in that it includes:
    发光元件,用以发出光束;以及a light-emitting element for emitting a light beam; and
    光感测阵列模块,用以感测物体在反射所述光束后所产生的光,所述光感测阵列模块包括:A light-sensing array module for sensing light generated by an object after reflecting the light beam, the light-sensing array module comprising:
    光感测阵列基板,包括排成阵列的多个像素;a light sensing array substrate, including a plurality of pixels arranged in an array;
    透镜阵列,配置于所述光感测阵列基板的上方,且包括分别配置于所述多个像素上方的多个微透镜;以及a lens array, disposed above the light sensing array substrate, and comprising a plurality of microlenses disposed above the plurality of pixels respectively; and
    遮光层,配置于所述光感测阵列基板与所述透镜阵列之间,且包括多个通光开口,所述多个通光开口分别配置于所述多个微透镜与所述多个像素之间,其中入射所述透镜阵列的入射角至少在14度以内的光会通过所述多个通光开口传递至所述多个像素,而不会被所述遮光层遮挡。The light shielding layer is disposed between the light sensing array substrate and the lens array, and includes a plurality of light-passing openings, and the plurality of light-passing openings are respectively disposed on the plurality of microlenses and the plurality of pixels In between, the light incident on the lens array with an incident angle within at least 14 degrees will be transmitted to the plurality of pixels through the plurality of light-passing openings, and will not be blocked by the light shielding layer.
  10. 根据权利要求9所述的光收发装置,其特征在于,每一通光开口的形状与光通过对应的微透镜后在所述通光开口处所形成的光斑的形状相配合。The optical transceiver device according to claim 9, wherein the shape of each light-passing opening matches the shape of the light spot formed at the light-passing opening after the light passes through the corresponding microlens.
  11. 根据权利要求10所述的光收发装置,其特征在于,所述光斑具有至少一凹陷处,而所述通光开口的内壁具有往所述至少一凹陷处凸出的至少一凸起部。The optical transceiver according to claim 10, wherein the light spot has at least one recess, and the inner wall of the light-passing opening has at least one protrusion protruding toward the at least one recess.
  12. 根据权利要求11所述的光收发装置,其特征在于,所述光斑呈X形,且具有四个凹陷处,而所述通光开口的内壁具有往所述四个凹陷处凸出的四个凸起部。The optical transceiver according to claim 11, wherein the light spot is X-shaped and has four recesses, and the inner wall of the light-passing opening has four protruding points toward the four recesses. bulge.
  13. 根据权利要求9所述的光收发装置,其特征在于,入射所述透镜阵列的入射角至少在20度以内的光会通过所述多个通光开口传递至所述多个像素,而不会被所述遮光层遮挡。The optical transceiver according to claim 9, wherein the light with an incident angle of at least 20 degrees incident on the lens array will be transmitted to the plurality of pixels through the plurality of light-transmitting openings, and will not be transmitted to the plurality of pixels. blocked by the light shielding layer.
  14. 根据权利要求13所述的光收发装置,其特征在于,入射所述透镜阵列的入射角至少在40度以内的光会通过所述多个通光开口传递至所述多个像素,而不会被所述遮光层遮挡。14. The optical transceiver according to claim 13, wherein light with an incident angle of at least 40 degrees incident on the lens array will be transmitted to the plurality of pixels through the plurality of light-passing openings, and will not be transmitted to the plurality of pixels. blocked by the light shielding layer.
  15. 根据权利要求9所述的光收发装置,其特征在于,所述遮光层为金属层。The optical transceiver according to claim 9, wherein the light shielding layer is a metal layer.
  16. 根据权利要求9所述的光收发装置,其特征在于,所述发光元件为激光发射器,且所述光感测阵列基板为单光子雪崩二极管阵列基板。The optical transceiver according to claim 9, wherein the light-emitting element is a laser transmitter, and the light-sensing array substrate is a single-photon avalanche diode array substrate.
  17. 根据权利要求9所述的光收发装置,其特征在于,所述光收发装置为飞行时间测距装置或光雷达,所述光收发装置还包括控制器,电性连接至 所述发光元件与所述光感测阵列基板,且用以根据所述光束与被反射的所述光的飞行时间或相位来计算出所述物体的距离。The optical transceiver device according to claim 9, wherein the optical transceiver device is a time-of-flight ranging device or a light radar, and the optical transceiver device further comprises a controller electrically connected to the light-emitting element and the light-emitting element. The light sensing array substrate is used to calculate the distance of the object according to the flight time or phase of the light beam and the reflected light.
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Publication number Priority date Publication date Assignee Title
CN215988762U (en) * 2021-03-18 2022-03-08 神盾股份有限公司 Light sensing array module and light receiving and transmitting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106022324A (en) * 2016-08-04 2016-10-12 京东方科技集团股份有限公司 Line recognition and display device
WO2019125271A1 (en) * 2017-12-21 2019-06-27 Fingerprint Cards Ab Biometric imaging device and method for manufacturing the biometric imaging device
CN210691343U (en) * 2019-10-18 2020-06-05 指纹卡有限公司 Biometric imaging device and electronic device
CN111523440A (en) * 2020-04-21 2020-08-11 上海思立微电子科技有限公司 Optical fingerprint identification device under screen
CN111539387A (en) * 2019-09-06 2020-08-14 神盾股份有限公司 Fingerprint sensing module and electronic device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004336228A (en) * 2003-05-02 2004-11-25 Alps Electric Co Ltd Lens array system
JP5463718B2 (en) * 2009-04-16 2014-04-09 ソニー株式会社 Imaging device
CN103811509A (en) * 2014-03-26 2014-05-21 上海集成电路研发中心有限公司 Pixel array and method for measuring incident angle of incident light in three-dimensional space
US10063849B2 (en) * 2015-09-24 2018-08-28 Ouster, Inc. Optical system for collecting distance information within a field
EP4194888A1 (en) * 2016-09-20 2023-06-14 Innoviz Technologies Ltd. Lidar systems and methods
JP7140784B2 (en) * 2017-03-01 2022-09-21 ポイントクラウド インコーポレイテッド Modular 3D optical detection system
JP7316764B2 (en) * 2017-05-29 2023-07-28 ソニーセミコンダクタソリューションズ株式会社 Solid-state imaging device and electronic equipment
TWI683454B (en) * 2017-08-27 2020-01-21 億光電子工業股份有限公司 Semiconductor package structure
JP2019114728A (en) * 2017-12-26 2019-07-11 ソニーセミコンダクタソリューションズ株式会社 Solid state imaging apparatus, distance measurement device, and manufacturing method
CN211045441U (en) * 2018-08-21 2020-07-17 神盾股份有限公司 Optical sensing system
JP7170063B2 (en) * 2018-12-14 2022-11-11 富士フイルム株式会社 STRUCTURE, OPTICAL MEASURING DEVICE, METHOD FOR MANUFACTURING STRUCTURE, AND COMPOSITION
JP2020126961A (en) * 2019-02-06 2020-08-20 ソニーセミコンダクタソリューションズ株式会社 Imaging apparatus and imaging system
CN209560569U (en) * 2019-02-14 2019-10-29 金佶科技股份有限公司 Photosensitive module and image capturing device
CN111830485A (en) * 2020-07-01 2020-10-27 东莞市美光达光学科技有限公司 Infrared emission module for wide-angle flight time optical ranging and module thereof
CN215988762U (en) * 2021-03-18 2022-03-08 神盾股份有限公司 Light sensing array module and light receiving and transmitting device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106022324A (en) * 2016-08-04 2016-10-12 京东方科技集团股份有限公司 Line recognition and display device
WO2019125271A1 (en) * 2017-12-21 2019-06-27 Fingerprint Cards Ab Biometric imaging device and method for manufacturing the biometric imaging device
CN111539387A (en) * 2019-09-06 2020-08-14 神盾股份有限公司 Fingerprint sensing module and electronic device
CN210691343U (en) * 2019-10-18 2020-06-05 指纹卡有限公司 Biometric imaging device and electronic device
CN111523440A (en) * 2020-04-21 2020-08-11 上海思立微电子科技有限公司 Optical fingerprint identification device under screen

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