WO2021223884A1 - Metal chip card and associated shell - Google Patents

Metal chip card and associated shell Download PDF

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Publication number
WO2021223884A1
WO2021223884A1 PCT/EP2020/062890 EP2020062890W WO2021223884A1 WO 2021223884 A1 WO2021223884 A1 WO 2021223884A1 EP 2020062890 W EP2020062890 W EP 2020062890W WO 2021223884 A1 WO2021223884 A1 WO 2021223884A1
Authority
WO
WIPO (PCT)
Prior art keywords
card
smart card
substrate
metal shell
coating layer
Prior art date
Application number
PCT/EP2020/062890
Other languages
French (fr)
Inventor
François Droz
Original Assignee
Nid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nid Sa filed Critical Nid Sa
Priority to PCT/EP2020/062890 priority Critical patent/WO2021223884A1/en
Priority to CH00492/21A priority patent/CH717421A2/en
Publication of WO2021223884A1 publication Critical patent/WO2021223884A1/en

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Definitions

  • the present invention relates to the field of smart cards. More precisely, it relates to a card of the dual interface type or of the RFID type, that is to say comprising at least one chip and one antenna.
  • cards which contain both a chip and an antenna are well known, particularly in the field of payment cards and electronic labels (RFID transponders). These cards are made essentially of plastic, on the basis of a substrate, for example PVC, and have a laminated structure comprising several laminated layers.
  • An RFID card has a coil connected to a chip and is typically totally embedded, for example in a polymer.
  • a contact module comprising a chip intended to be inserted into a reader, while an antenna is intended for its part to allow payment without contact, via communication with a remote reader.
  • the antenna is also used not only as a means of communication, but also as a means of supplying power to the chip; it is preferably carried out on a flexible support, for example via printing with conductive ink, or the introduction of a copper wire directly into the polymer to form the coil.
  • An object of the present invention is to provide a new smart card comprising an antenna, which is entirely metallic in appearance.
  • Another object of the present invention is to provide a new smart card the life of which is improved.
  • a smart card comprising a plastic substrate in which are arranged at least one antenna and a magnetic shield, characterized in that it comprises a metal shell formed by a layer of coating provided with an integrated peripheral rim defining a housing for the substrate.
  • a metal shell intended for such a smart card, taken in isolation, and which can be manufactured and sold independently of the complete smart card, in particular as a semi-finished product to card manufacturers.
  • a metal shell is characterized in that it is formed of a coating layer provided with an integrated peripheral rim.
  • One advantage of the proposed solution is that it is easy to produce new chip cards of the RFID type or of payment with a double metal interface.
  • Another advantage of the proposed solution is that it allows the production of an RFID or payment type chip card with a dual interface, the lifespan of which is significantly improved compared to cards made of plastic, thanks to the integrated rim of the shell. which protects the edge of the substrate and thus effectively prevents any delamination of the various layers of the plastic substrate at the edge of the latter.
  • Another advantage of the proposed solution is to be able to produce such metal smart cards while achieving significant economies of scale, both in terms of intrinsic manufacturing costs and in terms of depreciation of existing production tools for products.
  • plastic cards In fact, metal cards require specific equipment relating to machining techniques relating to another profession, which implies significant investments in a new production tool.
  • the use of a metal shell with an integrated peripheral rim also gives the impression of a card made entirely of metal while it is possible, to make such cards, to simply manufacture plastic cards in a conventional manner. in slightly smaller dimensions and then add the hull to it.
  • Yet another advantage of the proposed solution relates, in particular for the production of bank cards, to compatibility with existing certification standards.
  • the method of producing a hybrid card as proposed according to the invention makes it possible to dissociate the production of the metal parts, requiring no certified secure environment, from the production part of the plastic cards which must be carried out in an environment certified in accordance with applicable certification standards.
  • the integrated peripheral rim of the metal shell extends over the entire periphery of the smart card, and the coating layer is disposed on an upper surface of the plastic substrate. and assembled to this substrate such that the side edge of the substrate abuts an inner surface of the integrated peripheral rim of the metal shell.
  • An advantage of the proposed solution is to realize new cards emulating full metal cards thanks not only to the upper covering layer, but also to the integrated peripheral edge of the metal shell which in this case completely covers the edge of the substrate. Furthermore, the effectiveness against delamination is further increased in view of the exact correspondence of shape between the side edges of the substrate and the inner surface of the integrated peripheral rim of the metal shell.
  • the smart card produced is a payment card with a double interface of dimensions conforming to standard standards, or an RFID card of predefined dimensions, and the height dimensions of the substrate are reduced by a greater thickness. or equal to a first thickness corresponding to that of the coating layer of the metal shell, and a second thickness corresponding to that of the integrated peripheral rim. It is thus sufficient, in order to manufacture new metal cards according to the present invention, to use standard processes for the production of plastic cards by adjusting the dimensions of the latter by subtracting a first thickness in height relative to the layer of plastic. coating of the metal shell, and a second thickness in width relative to the integrated peripheral rim of the shell, and then to add the metal shell to the substrate amputated by these two thicknesses respectively in height and in width.
  • this contact module is affixed to a lower shoulder of a through hole made in the coating layer of the metal shell provided for its insertion so as to level the upper surface of the smart card at said through hole.
  • the contact module is mounted on the plastic substrate in such a way that it has a slight extra thickness relative to the latter, the extra thickness being substantially equal to the first thickness in height of the coating layer so as to level the upper face of the card at the level of the through hole made in the coating layer of the metal shell provided for the insertion of the contact module.
  • the technical effect of an automatic leveling of the upper face of the card during the mounting of the contact module on the substrate is obtained, but it requires to arrange a suitable housing on the substrate instead of acting on the metal shell.
  • the smart card is characterized in that the lower surface of the substrate is flush with the heel of the integrated peripheral edge of the shell.
  • an automatic leveling of the underside of the card is obtained.
  • the operation of fitting the substrate into its housing of exactly corresponding dimensions can be carried out extremely simply, and the fact that the height of the integrated peripheral rim of the metal shell corresponds to the total height of the metal card makes it possible to make the card an entirely metallic appearance in a particularly simple manner also via a single mounting operation, in particular when the substrate comprises a printing sheet spreading over the entire lower surface and thus no longer requires any subsequent machining for finalize the back of the card.
  • the thickness in height of the metal coating layer for the smart card is between 150 and 500 micrometers, while the thickness in width of the integrated peripheral rim is between 150 and 2000 micrometers.
  • the metal shell is perforated, which allows underlying decorative patterns made on a plastic layer to show through instead of being machined directly in or on the metal, which is much more complicated and requires specialized devices. In this way, it is thus possible to easily decorate such metal cards at a lower cost.
  • the metal shell has a series of cavities or openings provided for the insertion of various decorative materials. This allows for example to set the card with precious stones or other noble materials giving an even more upscale appearance to the card produced.
  • FIG. 1 is an exploded three-dimensional view of a metal shell for a smart card according to a preferred embodiment for the invention corresponding to a dual interface payment card, and of a substrate for such a card smart;
  • FIGS. 2A and 2B correspond to two sectional views of preferred embodiments of the coating layer of a metal shell for a dual interface payment card as illustrated in Figure 1, with respectively a through hole through fully vertical side walls, and a through hole with shoulder for housing a contact module;
  • FIGS. 4A and 4B respectively shows two sectional views illustrating the assembly of a smart card according to two preferred embodiments for the present invention, and more precisely the assembly of a substrate with shells having two edges of different widths.
  • FIG. 1 illustrates a three-dimensional exploded schematic view of a smart card 10 according to a preferred embodiment for the present invention, relating to a dual interface payment card.
  • the new smart card 10 proposed in the context of the present invention is composed of a plastic substrate 1 covered with a metal shell 4.
  • the plastic substrate 1 comprises an antenna. 3 which is covered with a magnetic shield 6 to isolate it from the upper coating layer 4 of metal; these elements integrated into the substrate 1 are not referenced in this figure for reasons of readability, but are shown schematically below in FIGS. 4A and 4B.
  • the coating layer 40 of the metal shell 4 constitutes the upper face 101 of the smart card 10, while the lower face 101 of the smart card consists of the lower surface 11 of the substrate 1, which is preferably formed by a printing layer 5 - also illustrated schematically in FIGS.
  • the personalization data of the card comprising the name and first name of the cardholder, as well as the “PAN” (acronym for "primary account number) allowing to identify an issuing bank, the credit institution and to assign a unique identification number to the card)
  • the integrated peripheral rim 44 of the metal shell extends over the entire periphery of the smart card 10, so that its edge has an appearance entirely metallic and such a smart card 10 placed on a support hiding its underside 101 and thus gives the impression of being made entirely of metal.
  • the integrated peripheral rim 44 of the metal shell 4 has a height H corresponding to the total thickness of the smart card 10 formed, while a second thickness R corresponding to the thickness of the peripheral rim, this time taken from the direction of the width (or respectively length).
  • this second thickness R appears to be substantially constant over the entire periphery of the smart card 10, but one could, according to a variant, imagine dissociating values of thickness in the direction of the length L and the width W from the menu.
  • the integrated peripheral rim 44 is preferably produced by stamping or directly by sintering / molding; however, according to manufacturing variants, it could also be produced by engraving, chemical machining, machining, hot or cold stamping, or by assembly of a laser-cut frame on a metal plate, or even by 3D printing.
  • the housing 8 formed inside the internal lateral surface 44A of the integrated peripheral rim 44 here constituted by a series of four vertical walls extending mutually at right angles to each other. , and ending at the level of the lower surface 41 of the coating layer 40 of metal, corresponds exactly to the volume of the substrate 1 including the outer lateral border 13, that is to say the part forming the edge of the latter, directly adjoins the internal lateral surface 44A of the integrated peripheral rim 44.
  • the plastic substrate 1 thus corresponding to that of a conventional smart card, but the dimensions of which have simply been slightly reduced in height (by a first thickness E , illustrated in particular in Figures 2A and 2B which follow) as well as in length and width (of a second thickness R, corresponding to that of the integrated peripheral rim) is thus can be assembled simplem ent to the metal shell 40 preferably by heat sealing.
  • other assembly methods cited by way of nonlimiting examples include simple cold gluing, lamination with a film, or even the use of a standard or thermosetting self-adhesive film, etc.
  • the dimensions of the substrate 1 in height of the substrate are preferably configured in such a way that they make it possible to automatically level the lower face of the card 101, the lower surface of the substrate 11 being flush with the bottom of the integrated peripheral rim 44 (the heel 45 illustrated in FIGS. 4A and 4B below).
  • the step of mounting the contact module 2, which comprises a chip to be electrically connected to the antenna, is here the last to be carried out during the assembly of the smart card 10.
  • the contact module 2 is introduced through a through hole 43, two variants of which are respectively illustrated in FIGS. 2A and 2B.
  • the through hole 43 made in the coating layer 40 of the metal shell 4 has side walls 43 which are completely vertical.
  • the housing of the module in the substrate has a slight extra thickness corresponding substantially to that of the through hole, that is to say corresponding substantially to the first thickness E.
  • FIG. 2B it is not necessary to provide any arrangements at the level of the substrate 1 to obtain an automatic leveling of the contact module 2 with respect to the upper surface 42 of the coating layer 40, since the latter is obtained via a particular arrangement of the through-hole of the coating layer 40.
  • a lower shoulder 43A is provided at the base of the through-hole, acting as a stop for the contact module 2, which cannot d 'on the one hand not to penetrate more deeply into the substrate 1, but which on the other hand makes it possible to define a support and defining a complete housing in addition to the side walls.
  • the contact module can also be mounted on the substrate 1 so that it is flush with the level of the upper surface 42 of the metal coating layer 40 of the shell.
  • FIG. 3 illustrates a method of assembling a smart card such as an RFID card comprising an electronic circuit 8 which is, unlike the present invention, not produced on a plastic substrate 1.
  • a smart card such as an RFID card
  • Its geometric shape, of any kind, does not include any lateral border defined by a wall, and it is thus plated on the back of a metal shell comprising an imprint of corresponding shape, without any rim strictly speaking having to be formed in this shell.
  • the shell then consists of a coating layer of greater thickness (partial height H1 of the card) in which the corresponding shaped imprint of the electronic circuit 8 is made; and the latter must then be covered with a laminating foil, such as the printing foil 5 glued to the lower surface 41 of this metal coating layer.
  • the leveling at the level of the lower face 101 of the card is carried out via this laminating layer itself, and the total thickness of the card is always greater than the partial height H1 corresponding to the thickness of the metal layer. .
  • the edge of the card will still have a plastic lamination layer and nothing is provided against delamination of this layer. .
  • FIGS. 4A and 4B illustrate two preferred embodiments relating to the present invention, in which the first thickness E in height corresponding to that of the coating layer 40 of metal is less than the partial height H1 illustrated in FIG. 3 above. , but whose total thickness of the card, corresponding to the total height H is greater than this partial height H1 thanks to the integrated peripheral rim 44 whose heel 45 extends to the underside of the card 101 flush with the bottom surface 11 of substrate 1.
  • FIGS. 4A and 4B show two integrated peripheral flanges 44 whose first thickness E corresponding to that of the coating layer 40 is identical and substantially identical - according to the invention, this is preferably between 150 and 500 micrometers - but of which the width (second thickness R shown in these figures) differs; according to the invention, this is preferably between 150 and 3000 micrometers.
  • the correspondence of the minimum values of 150 micrometers for the first thickness E of the coating layer 40 and the second thickness R of the integrated peripheral rim 44 corresponds to the case where a sheet of 150 micrometers is formed by stamping and this sheet rises on the edge of the card to form the integrated peripheral edge. In this case these two thicknesses, formed from the same sheet of metal, are identical; this equality can however be achieved for greater values of thickness of the coating layer 40.
  • the substrate 1 comprises not only the antenna 3 and the magnetic shielding 6, but also a printing layer 5 constituting the lower surface 11 of the substrate; according to a variant, this printing layer 5 could be further covered with a transparent protective layer (usually referred to as an "overlay").
  • the housing 8 provided for the substrate 1 has the exact dimensions of the substrate 1, such that the side edge of the substrate 13 adjoins the inner surface 44A of the integrated peripheral rim 44, and the upper surface 12 of the substrate 1 adjoins the lower surface 41 of the coating layer 40 of the metal shell 4, while ensuring a leveling of the lower surface 11 of the substrate 1 with respect to the heel 45 of the integrated peripheral rim 44 at the level of the lower face 101 of the smart card 10.
  • the coating layer 40 of metal may moreover be perforated to reveal decorative patterns, intended to be visible from the upper face of the card 102, which may thus be produced directly on the substrate. 1 and not directly on metal.
  • the metal coating layer may include a series of cavities or openings provided for the insertion of various decorative materials, such as inserts in precious metals or set stones (eg diamonds).
  • peripheral flanges extending only on two opposite faces of the card, in length or in width, or flanges on all sides of the card. the card but truncated at the corners, or on the contrary of the edges formed only at the level of the four corners of the card to wedge it in its housing under the coating layer of the metal shell.
  • a substrate whose shape would only partially correspond to that of the volume of the housing defined inside the rims, for example taking a square shape corresponding to a truncation of the rectangular shape available inside. an integrated peripheral rim extending over the entire periphery of the card.

Abstract

The present invention relates to a chip card (10) comprising a plastic substrate (1) in which at least one antenna (3) and a magnetic shield (6) are arranged. The chip card (10) comprises a metal shell (4) formed from a coating layer (40) provided with an integrated peripheral rim (44) defining a housing (8) for the substrate (1).

Description

Carte en métal et coque associée Metal card and associated shell
Domaine technique de l'invention Technical field of the invention
La présente invention se rapporte au domaine des cartes à puces. Plus précisément, elle concerne une carte du type à interface double ou de type RFID, c’est-à-dire comportant au moins une puce et une antenne. The present invention relates to the field of smart cards. More precisely, it relates to a card of the dual interface type or of the RFID type, that is to say comprising at least one chip and one antenna.
État de la technique State of the art
L’usage de cartes qui contiennent à la fois une puce et une antenne, est bien connu notamment dans le domaine des cartes de paiement et des étiquettes électroniques (transpondeurs RFID). Ces cartes sont réalisées essentiellement en plastique, sur la base d’un substrat par exemple en PVC, et possèdent une structure stratifiée comportant plusieurs couches laminées. Une carte RFID possède une bobine reliée à une puce et est typiquement totalement noyée par exemple dans un polymère. Dans le cas d’une carte de paiement dite à interface double (« dual interface »), un module à contact comprenant une puce destiné à être introduit dans un lecteur, tandis qu’une antenne est destinée quant à elle à permettre un paiement sans contact, via une communication avec un lecteur distant. L’antenne est par ailleurs utilisée non seulement comme moyen de communication, mais également comme un moyen d’alimentation en énergie pour la puce; elle est de préférence réalisée sur un support souple, par exemple via une impression d’encre conductrice, ou l’introduction d’un fil de cuivre directement dans le polymère pour former la bobine. The use of cards which contain both a chip and an antenna is well known, particularly in the field of payment cards and electronic labels (RFID transponders). These cards are made essentially of plastic, on the basis of a substrate, for example PVC, and have a laminated structure comprising several laminated layers. An RFID card has a coil connected to a chip and is typically totally embedded, for example in a polymer. In the case of a so-called dual interface payment card, a contact module comprising a chip intended to be inserted into a reader, while an antenna is intended for its part to allow payment without contact, via communication with a remote reader. The antenna is also used not only as a means of communication, but also as a means of supplying power to the chip; it is preferably carried out on a flexible support, for example via printing with conductive ink, or the introduction of a copper wire directly into the polymer to form the coil.
On connaît par ailleurs des cartes à puces purement métalliques; ces dernières ne permettent cependant pas d’y intégrer une antenne et ne constituent par conséquent plus des cartes de type « dual interface », mais seulement des cartes dites à contact. Ces cartes sont toutefois très demandées sur certains marchés où l’aspect métallique et la lourdeur de la carte confère un caractère haut de gamme au produit. Un inconvénient de ce type de carte concerne néanmoins leur coût de production, bien supérieur aux cartes en plastiques standard, ainsi que la difficulté de personnaliser ces cartes, notamment en matière de motifs décoratifs, ce qui s’avère beaucoup plus fastidieux sur du métal que sur du plastique. Purely metallic chip cards are also known; however, the latter do not make it possible to integrate an antenna therein and consequently no longer constitute “dual interface” type cards, but only so-called contact cards. However, these cards are in great demand in certain markets where the metallic appearance and the heaviness of the card give the product a high-end character. A drawback of this type of card nevertheless concerns their production cost, which is much higher than standard plastic cards, as well as the difficulty of personalizing these cards, especially in terms of decorative patterns, which is much more tedious on metal than on plastic.
Il existe par conséquent un besoin pour une solution exempte de ces limitations connues. There is therefore a need for a solution free from these known limitations.
Résumé de l'invention Summary of the invention
Un but de la présente invention est de proposer une nouvelle carte à puce comportant une antenne, d’aspect intégralement métallique. An object of the present invention is to provide a new smart card comprising an antenna, which is entirely metallic in appearance.
Un autre but de la présente invention est de proposer une nouvelle carte à puce dont la durée de vie est améliorée. Another object of the present invention is to provide a new smart card the life of which is improved.
Selon l’invention, ces buts sont atteints grâce à une carte à puce comprenant un substrat en plastique dans lequel sont disposés au moins une antenne et un blindage magnétique, caractérisée en ce qu’elle comprend une coque en métal formée d’une couche de revêtement pourvue d’un rebord périphérique intégré définissant un logement pour le substrat. According to the invention, these aims are achieved by means of a smart card comprising a plastic substrate in which are arranged at least one antenna and a magnetic shield, characterized in that it comprises a metal shell formed by a layer of coating provided with an integrated peripheral rim defining a housing for the substrate.
Ces buts sont également atteints grâce à une coque en métal destinée à une telle carte à puce, prise isolément, et qui peut être fabriquée et vendue indépendamment de la carte à puce complète, notamment comme produit semi-fini à des fabricants de cartes. Une telle coque en métal est caractérisée en ce qu’elle est formée d’une couche de revêtement pourvue d’un rebord périphérique intégré. These goals are also achieved by means of a metal shell intended for such a smart card, taken in isolation, and which can be manufactured and sold independently of the complete smart card, in particular as a semi-finished product to card manufacturers. Such a metal shell is characterized in that it is formed of a coating layer provided with an integrated peripheral rim.
Un avantage de la solution proposée est de réaliser aisément de nouvelles cartes à puces de type RFID ou de paiement à interface double en métal. One advantage of the proposed solution is that it is easy to produce new chip cards of the RFID type or of payment with a double metal interface.
Un autre avantage de la solution proposée est de permettre la réalisation d’une carte à puce de type RFID ou de paiement à interface double dont la durée de vie est significativement améliorée par rapport aux cartes réalisées en plastique, grâce au rebord intégré de la coque qui protège la tranche du substrat et évite ainsi efficacement tout délaminage des différentes couches du substrat en plastique en bordure de ce dernier. Another advantage of the proposed solution is that it allows the production of an RFID or payment type chip card with a dual interface, the lifespan of which is significantly improved compared to cards made of plastic, thanks to the integrated rim of the shell. which protects the edge of the substrate and thus effectively prevents any delamination of the various layers of the plastic substrate at the edge of the latter.
Un autre avantage de la solution proposée est de pouvoir réaliser de telles cartes à puce en métal en réalisant des économies d’échelles significatives, tant en termes de coûts de fabrication intrinsèques qu’en termes d’amortissement d’outils de production existants pour des cartes en plastiques usuelles. En effet, les cartes en métal nécessitent des équipements spécifiques relatifs à des techniques d’usinage relevant d’un autre métier, ce qui implique des investissements importants dans un nouvel outil de production. L’usage d’une coque en métal avec rebord périphérique intégré donne par ailleurs l’impression d’une carte réalisée intégralement en métal alors qu’il est possible, pour réaliser de telles cartes, de fabriquer simplement des cartes en plastique de façon conventionnelle dans des dimensions légèrement inférieures et d’y adjoindre ensuite la coque. Encore un autre avantage de la solution proposée concerne, notamment pour la production de cartes bancaires, la compatibilité avec des normes de certification existantes. Ainsi, la méthode de production d’une carte hybride telle que proposée selon l’invention permet de dissocier la production des parties en métal, ne nécessitant aucun environnement sécurisé certifié, de la partie de production des cartes plastiques qui doivent être réalisées dans un environnement certifié conformément aux normes de certification applicables. Another advantage of the proposed solution is to be able to produce such metal smart cards while achieving significant economies of scale, both in terms of intrinsic manufacturing costs and in terms of depreciation of existing production tools for products. usual plastic cards. In fact, metal cards require specific equipment relating to machining techniques relating to another profession, which implies significant investments in a new production tool. The use of a metal shell with an integrated peripheral rim also gives the impression of a card made entirely of metal while it is possible, to make such cards, to simply manufacture plastic cards in a conventional manner. in slightly smaller dimensions and then add the hull to it. Yet another advantage of the proposed solution relates, in particular for the production of bank cards, to compatibility with existing certification standards. Thus, the method of producing a hybrid card as proposed according to the invention makes it possible to dissociate the production of the metal parts, requiring no certified secure environment, from the production part of the plastic cards which must be carried out in an environment certified in accordance with applicable certification standards.
Selon un mode de réalisation préférentiel pour la présente invention, le rebord périphérique intégré de la coque en métal s’étend sur l’intégralité du pourtour de la carte à puce, et la couche de revêtement est disposée sur une surface supérieure du substrat en plastique et assemblée à ce substrat de telle sorte que la bordure latérale du substrat jouxte une surface interne du rebord périphérique intégré de la coque en métal. According to a preferred embodiment for the present invention, the integrated peripheral rim of the metal shell extends over the entire periphery of the smart card, and the coating layer is disposed on an upper surface of the plastic substrate. and assembled to this substrate such that the side edge of the substrate abuts an inner surface of the integrated peripheral rim of the metal shell.
Un avantage de la solution proposée est de réaliser de nouvelles cartes émulant des cartes en métal intégral grâce non seulement à la couche de recouvrement supérieure, mais également au rebord périphérique intégré de la coque en métal qui recouvre dans ce cas intégralement la tranche du substrat. Par ailleurs, l’efficacité contre le délaminage est encore augmentée vu la correspondance exacte de forme entre les bords latéraux du substrat et la surface interne du rebord périphérique intégré de la coque en métal. An advantage of the proposed solution is to realize new cards emulating full metal cards thanks not only to the upper covering layer, but also to the integrated peripheral edge of the metal shell which in this case completely covers the edge of the substrate. Furthermore, the effectiveness against delamination is further increased in view of the exact correspondence of shape between the side edges of the substrate and the inner surface of the integrated peripheral rim of the metal shell.
Selon un mode de réalisation encore plus préférentiel, la carte à puce réalisée est carte de paiement à interface double de dimensions conformes aux normes standard, ou une carte RFID de dimensions prédéfinies, et les dimensions en hauteur du substrat sont amputées d’une épaisseur supérieure ou égale à une première épaisseur correspondant à celle de couche de revêtement de la coque en métal, et d’une deuxième épaisseur correspondant à celle du rebord périphérique intégré. Il suffit ainsi, pour fabriquer de nouvelles cartes en métal selon la présente invention, d’utiliser des processus standard pour la production de cartes en plastique en ajustant les dimensions de celles-ci en soustrayant une première épaisseur en hauteur en relative à la couche de revêtement de la coque en métal, et une deuxième épaisseur en largeur relative au rebord périphérique intégré de la coque, et ensuite d’adjoindre la coque en métal au substrat amputé de ces deux épaisseurs respectivement en hauteur et en largeur. Ainsi, le processus de fabrication reste très simple et peu onéreux pour la fabrication ayant un aspect complètement métallique. Selon autre mode de réalisation préférentiel relatif à une carte de paiement à interface double comprenant un module à contact monté sur ledit substrat en plastique, ce module à contact est apposé sur un épaulement inférieur d’un trou traversant pratiqué dans la couche de revêtement de la coque en métal prévu pour son insertion de manière à niveler la surface supérieure de la carte à puce au niveau dudit trou traversant. According to an even more preferred embodiment, the smart card produced is a payment card with a double interface of dimensions conforming to standard standards, or an RFID card of predefined dimensions, and the height dimensions of the substrate are reduced by a greater thickness. or equal to a first thickness corresponding to that of the coating layer of the metal shell, and a second thickness corresponding to that of the integrated peripheral rim. It is thus sufficient, in order to manufacture new metal cards according to the present invention, to use standard processes for the production of plastic cards by adjusting the dimensions of the latter by subtracting a first thickness in height relative to the layer of plastic. coating of the metal shell, and a second thickness in width relative to the integrated peripheral rim of the shell, and then to add the metal shell to the substrate amputated by these two thicknesses respectively in height and in width. Thus, the manufacturing process remains very simple and inexpensive for manufacturing having a completely metallic appearance. According to another preferred embodiment relating to a dual interface payment card comprising a contact module mounted on said plastic substrate, this contact module is affixed to a lower shoulder of a through hole made in the coating layer of the metal shell provided for its insertion so as to level the upper surface of the smart card at said through hole.
Un avantage de cette solution est qu’elle permet de réaliser automatiquement le nivellement de la face supérieure de la carte à puce suite au montage du module à contact qui constitue usuellement la dernière étape de montage. Cet épaulement permet du reste d’éviter tout enfoncement trop important de ce module dans le substrat. Selon une variante pour une telle carte à puces constituant une carte de paiement à interface double, le module à contact est monté sur le substrat en plastique de telle sorte qu’il présente une légère surépaisseur par rapport à celui-ci, la surépaisseur étant substantiellement égale à la première épaisseur en hauteur de la couche de revêtement de manière à niveler la face supérieure de la carte au niveau du trou traversant pratiqué dans la couche de revêtement de la coque en métal prévu pour l’insertion du module à contact. Ici encore, l’effet technique d’un nivellement automatique de la face supérieure de la carte lors du montage du module à contact sur le substrat est obtenu, mais il nécessite d’aménager un logement adapté sur le substrat au lieu d’agir sur la coque en métal. One advantage of this solution is that it makes it possible to automatically level the upper face of the smart card following the assembly of the contact module which usually constitutes the last assembly step. This shoulder also makes it possible to avoid any excessive depression of this module in the substrate. According to a variant for such a smart card constituting a payment card with a dual interface, the contact module is mounted on the plastic substrate in such a way that it has a slight extra thickness relative to the latter, the extra thickness being substantially equal to the first thickness in height of the coating layer so as to level the upper face of the card at the level of the through hole made in the coating layer of the metal shell provided for the insertion of the contact module. Here again, the technical effect of an automatic leveling of the upper face of the card during the mounting of the contact module on the substrate is obtained, but it requires to arrange a suitable housing on the substrate instead of acting on the metal shell.
Selon encore un autre mode de réalisation préférentiel, la carte à puce est caractérisée en ce que la surface inférieure du substrat affleure au niveau du talon du bord périphérique intégré de la coque. De cette manière, on obtient, lors du montage du substrat dans la coque en métal, un nivellement automatique de la face inférieure de la carte. L’opération d’emboîtement du substrat dans son logement de dimensions exactement correspondantes peut être réalisée de manière extrêmement simple, et le fait que la hauteur du rebord périphérique intégré de la coque en métal correspond à la hauteur totale de la carte en métal permet de rendre un aspect entièrement métallique à la carte de manière particulièrement simple également via une seule opération de montage, notamment lorsque le substrat comprend une feuille d’impression s’étalant sur l’intégralité de sa surface inférieure et ne nécessite ainsi plus aucun usinage ultérieur pour finaliser le verso de la carte. According to yet another preferred embodiment, the smart card is characterized in that the lower surface of the substrate is flush with the heel of the integrated peripheral edge of the shell. In this way, when mounting the substrate in the metal shell, an automatic leveling of the underside of the card is obtained. The operation of fitting the substrate into its housing of exactly corresponding dimensions can be carried out extremely simply, and the fact that the height of the integrated peripheral rim of the metal shell corresponds to the total height of the metal card makes it possible to make the card an entirely metallic appearance in a particularly simple manner also via a single mounting operation, in particular when the substrate comprises a printing sheet spreading over the entire lower surface and thus no longer requires any subsequent machining for finalize the back of the card.
Selon un mode de réalisation préférentiel, l’épaisseur en hauteur de la couche de revêtement en métal pour la carte à puce est comprise entre 150 et 500 micromètres, tandis que l’épaisseur en largeur du rebord périphérique intégré est comprise quant à elle entre 150 et 2000 micromètres. Ces valeurs permettent un usinage relativement simple de la coque en métal tout en limitant les coûts de matière pour réaliser l’aspect métallique. Selon encore un autre mode de réalisation préférentiel, la coque en métal est ajourée, ce qui permet de laisser transparaître des motifs décoratifs sous-jacents réalisés sur une couche en plastique au lieu d’être usinés directement dans ou sur le métal, ce qui est beaucoup plus compliqué et nécessite des appareils spécialisés. De cette manière, il est ainsi possible de décorer aisément de telles cartes en métal à moindre coût. According to a preferred embodiment, the thickness in height of the metal coating layer for the smart card is between 150 and 500 micrometers, while the thickness in width of the integrated peripheral rim is between 150 and 2000 micrometers. These values allow relatively simple machining of the metal shell while limiting the material costs to achieve the metallic appearance. According to yet another preferred embodiment, the metal shell is perforated, which allows underlying decorative patterns made on a plastic layer to show through instead of being machined directly in or on the metal, which is much more complicated and requires specialized devices. In this way, it is thus possible to easily decorate such metal cards at a lower cost.
Selon encore un autre mode de réalisation préférentiel, la coque en métal comporte une série de cavités ou d’ouvertures prévues pour l’insertion de divers matériaux décoratifs. Ceci permet par exemple de sertir la carte de pierres précieuses ou d’autres matériaux nobles conférant un aspect encore plus haut de gamme à la carte réalisée. According to yet another preferred embodiment, the metal shell has a series of cavities or openings provided for the insertion of various decorative materials. This allows for example to set the card with precious stones or other noble materials giving an even more upscale appearance to the card produced.
Brève description des dessins Brief description of the drawings
D'autres caractéristiques avantageuses ressortiront plus clairement de la description qui suit de modes de réalisation particuliers pour l'invention donné à titre d'exemples non limitatifs et représentés par les dessins annexés, dans lesquels: Other advantageous characteristics will emerge more clearly from the following description of particular embodiments for the invention given by way of nonlimiting examples and represented by the appended drawings, in which:
- la figure 1 est une vue éclatée en trois dimensions d’une coque en métal pour carte à puce selon un mode de réalisation préférentiel pour l’invention correspondant à une carte de paiement à interface double, et d’un substrat pour une telle carte à puce; - Figure 1 is an exploded three-dimensional view of a metal shell for a smart card according to a preferred embodiment for the invention corresponding to a dual interface payment card, and of a substrate for such a card smart;
- les figures 2A et 2B correspondent à deux vues en coupe de modes de réalisation préférentiels de la couche de revêtement d’une coque en métal pour carte à paiement à interface double telle qu’illustrée sur la figure 1 , avec respectivement un trou traversant à parois latérales intégralement verticales, et un trou traversant avec épaulement pour le logement d’un module à contact; - Figures 2A and 2B correspond to two sectional views of preferred embodiments of the coating layer of a metal shell for a dual interface payment card as illustrated in Figure 1, with respectively a through hole through fully vertical side walls, and a through hole with shoulder for housing a contact module;
- la figure 3 illustre l’assemblage d’un circuit avant recouvrement ultérieur par une feuille selon l’art antérieur. - la série des figures 4A et4B montre respectivement deux vues en coupes illustrant l’assemblage d’une carte à puce selon deux modes de réalisation préférentiels pour la présente invention, et plus précisément l’assemblage d’un substrat à des coques présentant deux rebords de largeurs différentes. - Figure 3 illustrates the assembly of a circuit before subsequent covering with a sheet according to the prior art. - The series of FIGS. 4A and 4B respectively shows two sectional views illustrating the assembly of a smart card according to two preferred embodiments for the present invention, and more precisely the assembly of a substrate with shells having two edges of different widths.
Description détaillée detailed description
Dans ce qui suit, on se référera à une carte à puce 10 comme correspondant de préférence à une carte de paiement à interface double, ou une carte de type RFID. La figure 1 illustre une vue schématique éclatée en trois dimensions d’une carte à puce 10 selon un mode de réalisation préférentiel pour la présente invention, relatif à une carte de paiement à interface double. In what follows, reference will be made to a smart card 10 as preferably corresponding to a payment card with a dual interface, or an RFID type card. Figure 1 illustrates a three-dimensional exploded schematic view of a smart card 10 according to a preferred embodiment for the present invention, relating to a dual interface payment card.
Comme on peut le voir sur la figure 1 , la nouvelle carte à puce 10 proposée dans le cadre de la présente invention est composée d’un substrat 1 en plastique recouvert d’une coque en métal 4. Le substrat 1 en plastique comprend une antenne 3 qui est recouverte d’un blindage magnétique 6 pour l’isoler de la couche de revêtement 4 supérieure en métal; ces éléments intégrés au substrat 1 ne sont pas référencés sur cette figure pour des questions de lisibilité, mais sont représentés schématiquement plus loin sur les figures 4A et 4B. La couche de revêtement 40 de la coque en métal 4 constitue la face supérieure 101 de la carte à puce 10, tandis que la face inférieure 101 de la carte à puce est constituée de la surface inférieure 11 du substrat 1 , qui est de préférence formée par une couche d’impression 5 - illustrée également schématiquement sur les figures 4A et 4B - permettant de visualiser par exemple les données de personnalisation de la carte, comprenant le nom et prénom du porteur de la carte, ainsi que le « PAN » (acronyme pour « primary account number) permettant d’identifier une banque émettrice, l’organisme de crédit et d’assigner un numéro d’identification unique à la carte) As can be seen in FIG. 1, the new smart card 10 proposed in the context of the present invention is composed of a plastic substrate 1 covered with a metal shell 4. The plastic substrate 1 comprises an antenna. 3 which is covered with a magnetic shield 6 to isolate it from the upper coating layer 4 of metal; these elements integrated into the substrate 1 are not referenced in this figure for reasons of readability, but are shown schematically below in FIGS. 4A and 4B. The coating layer 40 of the metal shell 4 constitutes the upper face 101 of the smart card 10, while the lower face 101 of the smart card consists of the lower surface 11 of the substrate 1, which is preferably formed by a printing layer 5 - also illustrated schematically in FIGS. 4A and 4B - making it possible to display, for example, the personalization data of the card, comprising the name and first name of the cardholder, as well as the “PAN” (acronym for "primary account number) allowing to identify an issuing bank, the credit institution and to assign a unique identification number to the card)
Selon le mode de réalisation préférentiel illustré, le rebord périphérique intégré 44 de la coque en métal s’étend sur l’intégralité du pourtour de la carte à puce 10, de telle sorte que sa tranche possède un aspect intégralement métallique et une telle carte à puce 10 posée sur un support cachant sa face inférieure 101 et donne ainsi l’impression d’être constituée totalement en métal. Le rebord périphérique intégré 44 de la coque en métal 4 possède une hauteur H correspondant à l’épaisseur totale de la carte à puce 10 formée, tandis qu’une deuxième épaisseur R correspondant à l’épaisseur du rebord périphérique, pris cette fois dans le sens de la largeur (ou respectivement longueur). Sur la figure 1 , cette deuxième épaisseur R semble être substantiellement constante sur tout le pourtour de la carte à puce 10, mais on pourrait, selon une variante, imaginer dissocier des valeurs d’épaisseur dans le sens de la longueur L et la largeur W de la carte. Le rebord périphérique intégré 44 est réalisé de préférence par emboutissage ou directement par frittage/moulage; toutefois, selon des variantes de fabrication, il pourrait également être réalisé par gravage, usinage chimique, usinage, frappe à chaud ou à froid, ou encore par assemblage d’un cadre découpé au laser sur une plaque métallique, voire par impression 3D. According to the preferred embodiment illustrated, the integrated peripheral rim 44 of the metal shell extends over the entire periphery of the smart card 10, so that its edge has an appearance entirely metallic and such a smart card 10 placed on a support hiding its underside 101 and thus gives the impression of being made entirely of metal. The integrated peripheral rim 44 of the metal shell 4 has a height H corresponding to the total thickness of the smart card 10 formed, while a second thickness R corresponding to the thickness of the peripheral rim, this time taken from the direction of the width (or respectively length). In FIG. 1, this second thickness R appears to be substantially constant over the entire periphery of the smart card 10, but one could, according to a variant, imagine dissociating values of thickness in the direction of the length L and the width W from the menu. The integrated peripheral rim 44 is preferably produced by stamping or directly by sintering / molding; however, according to manufacturing variants, it could also be produced by engraving, chemical machining, machining, hot or cold stamping, or by assembly of a laser-cut frame on a metal plate, or even by 3D printing.
Sur la figure 1 , on peut constater que le logement 8 formé à l’intérieur de la surface latérale interne 44A du rebord périphérique intégré 44, constituée ici par une série de quatre parois verticales se prolongeant mutuellement à angle droit les unes par rapport aux autres, et se terminant au niveau de la surface inférieure 41 de la couche de revêtement 40 en métal, correspond exactement au volume du substrat 1 dont la bordure latérale externe 13, c’est-à-dire la partie formant la tranche de ce dernier, vient directement jouxter la surface latérale interne 44A du rebord périphérique intégré 44. Le substrat 1 en plastique, correspondant ainsi à celui d’une carte à puce usuelle, mais dont les dimensions ont simplement été légèrement réduites en hauteur (d’une première épaisseur E, illustrée notamment sur les figures 2A et 2B qui suivent) ainsi qu’en longueur et largeur (d’une deuxième épaisseur R, correspondant à celle du rebord périphérique intégré) est peut ainsi être assemblé simplement à la coque en métal 40 de préférence par thermocollage. Toutefois, d’autres méthodes d’assemblage citées à titre d’exemples non limitatifs comprennent un collage simple à froid, un laminage avec un film, ou encore l’utilisation d'un film autocollant standard ou thermodurcissable etc. Suite à cette étape d’assemblage, outre le fait que la bordure latérale du substrat 13 est recouverte par le rebord périphérique intégré 44 et protégé ainsi efficacement contre le délaminage, les dimensions du substrat 1 en hauteur du substrat sont configurées de préférence de telle sorte qu’elles permettent de niveler automatiquement la face inférieure de la carte 101 , la surface inférieure du substrat 11 affleurant au bas du rebord périphérique intégré 44 (le talon 45 illustré sur les figures 4A et 4B suivantes). In Figure 1, it can be seen that the housing 8 formed inside the internal lateral surface 44A of the integrated peripheral rim 44, here constituted by a series of four vertical walls extending mutually at right angles to each other. , and ending at the level of the lower surface 41 of the coating layer 40 of metal, corresponds exactly to the volume of the substrate 1 including the outer lateral border 13, that is to say the part forming the edge of the latter, directly adjoins the internal lateral surface 44A of the integrated peripheral rim 44. The plastic substrate 1, thus corresponding to that of a conventional smart card, but the dimensions of which have simply been slightly reduced in height (by a first thickness E , illustrated in particular in Figures 2A and 2B which follow) as well as in length and width (of a second thickness R, corresponding to that of the integrated peripheral rim) is thus can be assembled simplem ent to the metal shell 40 preferably by heat sealing. However, other assembly methods cited by way of nonlimiting examples include simple cold gluing, lamination with a film, or even the use of a standard or thermosetting self-adhesive film, etc. Following this assembly step, besides the fact that the lateral edge of the substrate 13 is covered by the integrated peripheral rim 44 and thus effectively protected against delamination, the dimensions of the substrate 1 in height of the substrate are preferably configured in such a way that they make it possible to automatically level the lower face of the card 101, the lower surface of the substrate 11 being flush with the bottom of the integrated peripheral rim 44 (the heel 45 illustrated in FIGS. 4A and 4B below).
Comme pour une carte à puce en plastique, l’étape de montage du module à contact 2, qui comprend une puce à connecter électriquement à l’antenne, est ici la dernière à être effectuée lors de l’assemblage de la carte à puce 10. Le module à contact 2 est introduit à travers un trou traversant 43, dont deux variantes sont illustrées respectivement sur les figures 2A et 2B. As for a plastic smart card, the step of mounting the contact module 2, which comprises a chip to be electrically connected to the antenna, is here the last to be carried out during the assembly of the smart card 10. The contact module 2 is introduced through a through hole 43, two variants of which are respectively illustrated in FIGS. 2A and 2B.
Sur la figure 2A, le trou traversant 43 pratiqué dans la couche de revêtement 40 de la coque en métal 4 possède des parois latérales 43 totalement verticales. Dans un tel cas, pour niveler la face supérieure de la carte à puce 10 au niveau de la surface supérieure 42 de la couche de revêtement 40, il est nécessaire de prévoir que le logement du module dans le substrat présente une légère surépaisseur correspondant substantiellement à celle du trou traversant, c’est-à-dire correspondant substantiellement à la première épaisseur E. In FIG. 2A, the through hole 43 made in the coating layer 40 of the metal shell 4 has side walls 43 which are completely vertical. In such a case, to level the upper face of the smart card 10 at the level of the upper surface 42 of the coating layer 40, it is necessary to provide that the housing of the module in the substrate has a slight extra thickness corresponding substantially to that of the through hole, that is to say corresponding substantially to the first thickness E.
Sur la figure 2B, il n’est pas nécessaire de prévoir de quelconques aménagements au niveau du substrat 1 pour obtenir un nivellement automatique du module à contact 2 par rapport à la surface supérieure 42 de la couche de revêtement 40, car celui-ci est obtenu via un aménagement particulier du trou traversant de la couche de revêtement 40. En effet, selon cette variante préférentielle, un épaulement inférieur 43A est prévu à la base du trou traversant, agissant comme butée pour le module à contact 2, qui ne peut d’une part pas pénétrer plus profondément dans le substrat 1 , mais qui permet d’autre part de définir un support et définissant un logement complet en complément des parois latérales. De cette manière, le module à contact peut également être monté sur le substrat 1 de manière à ce qu’il affleure au niveau de la surface supérieure 42 de la couche de revêtement 40 en métal de la coque. In FIG. 2B, it is not necessary to provide any arrangements at the level of the substrate 1 to obtain an automatic leveling of the contact module 2 with respect to the upper surface 42 of the coating layer 40, since the latter is obtained via a particular arrangement of the through-hole of the coating layer 40. In fact, according to this preferred variant, a lower shoulder 43A is provided at the base of the through-hole, acting as a stop for the contact module 2, which cannot d 'on the one hand not to penetrate more deeply into the substrate 1, but which on the other hand makes it possible to define a support and defining a complete housing in addition to the side walls. In this way, the contact module can also be mounted on the substrate 1 so that it is flush with the level of the upper surface 42 of the metal coating layer 40 of the shell.
La figure 3 illustre un mode d’assemblage d’une carte à puce telle qu’une carte RFID comprenant un circuit électronique 8 qui n’est, contrairement à la présente invention, pas réalisé sur un substrat 1 en plastique. Sa forme géométrique, quelconque, ne comprend aucune bordure latérale définie par une paroi, et il est ainsi plaqué au verso d’une coque en métal comprenant une empreinte de forme correspondante, sans qu’aucun rebord à proprement parler ne doive être formé dans cette coque. La coque consiste alors en une couche de revêtement d’épaisseur plus importante (hauteur partielle H1 de la carte) dans laquelle l’empreinte de forme correspondante du circuit électronique 8 est réalisée; et ce dernier doit ensuite être recouvert d’une feuille de laminage, telle que la feuille d’impression 5 collée sur la surface inférieure 41 de cette couche de revêtement en métal. Ainsi le nivellement au niveau de la face inférieure 101 de la carte est réalisé via cette couche de laminage elle-même, et l’épaisseur totale de la carte est toujours supérieure à la hauteur partielle H1 correspondant à l’épaisseur de la couche de métal. De cette façon, si la face supérieure 102 de la carte correspond à la surface supérieure 42 d’une couche de métal, la tranche de la carte présentera toujours une couche de laminage en plastique et rien n’est prévu contre le délaminage de cette couche. FIG. 3 illustrates a method of assembling a smart card such as an RFID card comprising an electronic circuit 8 which is, unlike the present invention, not produced on a plastic substrate 1. Its geometric shape, of any kind, does not include any lateral border defined by a wall, and it is thus plated on the back of a metal shell comprising an imprint of corresponding shape, without any rim strictly speaking having to be formed in this shell. The shell then consists of a coating layer of greater thickness (partial height H1 of the card) in which the corresponding shaped imprint of the electronic circuit 8 is made; and the latter must then be covered with a laminating foil, such as the printing foil 5 glued to the lower surface 41 of this metal coating layer. Thus the leveling at the level of the lower face 101 of the card is carried out via this laminating layer itself, and the total thickness of the card is always greater than the partial height H1 corresponding to the thickness of the metal layer. . In this way, if the top face 102 of the card matches the top surface 42 of a metal layer, the edge of the card will still have a plastic lamination layer and nothing is provided against delamination of this layer. .
Les figures 4A et 4B illustrent au contraire deux modes de réalisation préférentiels concernant la présente invention, dans lesquels la première épaisseur E en hauteur correspondant à celle de la couche de revêtement 40 en métal est inférieure à la hauteur partielle H1 illustrée sur la figure 3 précédente, mais dont l’épaisseur totale de la carte, correspondant à la hauteur totale H est supérieure à cette hauteur partielle H1 grâce au rebord périphérique intégré 44 dont le talon 45 s’étend jusqu’à la face inférieure de la carte 101 affleurant avec la surface inférieure 11 du substrat 1. FIGS. 4A and 4B on the contrary illustrate two preferred embodiments relating to the present invention, in which the first thickness E in height corresponding to that of the coating layer 40 of metal is less than the partial height H1 illustrated in FIG. 3 above. , but whose total thickness of the card, corresponding to the total height H is greater than this partial height H1 thanks to the integrated peripheral rim 44 whose heel 45 extends to the underside of the card 101 flush with the bottom surface 11 of substrate 1.
Les figures 4A et 4B montrent deux rebords périphériques intégrés 44 dont la première épaisseur E correspondant à la celle de la couche de revêtement 40 est identique sensiblement identique - selon l’invention celle-ci est de préférence comprise entre 150 et 500 micromètres - mais dont la largeur (deuxième épaisseur R représentée sur ces figures) diffère; selon l’invention celle-ci est de préférence comprise entre 150 et 3000 micromètres. La correspondance des valeurs minimales de 150 micromètres pour la première épaisseur E de la couche de revêtement 40 et la deuxième épaisseur R du rebord périphérique intégré 44 correspond au cas où l’on forme une feuille de 150 micromètres par étampage et que cette feuille remonte sur le chant de la carte pour former le rebord périphérique intégré. Dans ce cas ces deux épaisseurs, formées à partir de la même feuille de métal, sont identiques; cette égalité peut toutefois être réalisée pour des valeurs d’épaisseur supérieures de la couche de revêtement 40. FIGS. 4A and 4B show two integrated peripheral flanges 44 whose first thickness E corresponding to that of the coating layer 40 is identical and substantially identical - according to the invention, this is preferably between 150 and 500 micrometers - but of which the width (second thickness R shown in these figures) differs; according to the invention, this is preferably between 150 and 3000 micrometers. The correspondence of the minimum values of 150 micrometers for the first thickness E of the coating layer 40 and the second thickness R of the integrated peripheral rim 44 corresponds to the case where a sheet of 150 micrometers is formed by stamping and this sheet rises on the edge of the card to form the integrated peripheral edge. In this case these two thicknesses, formed from the same sheet of metal, are identical; this equality can however be achieved for greater values of thickness of the coating layer 40.
Sur ces figures, le substrat 1 comprend non seulement l’antenne 3 et le blindage magnétique 6, mais également une couche d’impression 5 constituant la surface inférieure 11 du substrat ; selon une variante, cette couche d’impression 5 pourrait être encore recouverte d’une couche de protection transparente (qualifiée usuellement d’ «overlay»). Le logement 8 prévu pour le substrat 1 possède les dimensions exactes du substrat 1 , de telle sorte que la bordure latérale du substrat 13 jouxte la surface interne 44A du rebord périphérique intégré 44, et la surface supérieure 12 du substrat 1 jouxte la surface inférieure 41 de la couche de revêtement 40 de la coque en métal 4, tout en garantissant un nivellement de la surface inférieure 11 du substrat 1 par rapport au talon 45 du rebord périphérique intégré 44 au niveau de la face inférieure 101 de la carte à puce 10. In these figures, the substrate 1 comprises not only the antenna 3 and the magnetic shielding 6, but also a printing layer 5 constituting the lower surface 11 of the substrate; according to a variant, this printing layer 5 could be further covered with a transparent protective layer (usually referred to as an "overlay"). The housing 8 provided for the substrate 1 has the exact dimensions of the substrate 1, such that the side edge of the substrate 13 adjoins the inner surface 44A of the integrated peripheral rim 44, and the upper surface 12 of the substrate 1 adjoins the lower surface 41 of the coating layer 40 of the metal shell 4, while ensuring a leveling of the lower surface 11 of the substrate 1 with respect to the heel 45 of the integrated peripheral rim 44 at the level of the lower face 101 of the smart card 10.
Selon une variante préférentielle pour la présente invention, la couche de revêtement 40 en métal pourra par ailleurs être ajourée pour laisser apparaître des motifs décoratifs, destinés à être visibles depuis la face supérieure de la carte 102, qui peuvent ainsi être réalisés directement sur le substrat 1 et non pas directement sur du métal. Selon une autre variante encore plus préférentielle, afin de conférer un aspect plus luxueux à la carte, la couche de revêtement en métal pourra comporter une série de cavités ou d’ouvertures prévues pour l’insertion de divers matériaux décoratifs, telles que des inserts en métaux précieux ou des pierres serties (par exemple des diamants). Bien que seuls quelques modes de réalisation aient été décrits à titre d’exemple dans ce qui précède, on comprendra que ces derniers n’ont pas pour vocation d’exposer de manière exhaustive tous les variantes d’implémentation possibles pour la présente invention. L’homme du métier comprendra qu’il est envisageable de remplacer un moyen décrit par un moyen équivalent sans sortir du cadre de la présente invention. En particulier, il serait également envisageable, sans sortir du cadre de la présente invention, d’employer des rebords périphériques ne s’étendant que sur deux faces opposées de la carte, en longueur ou en largeur, ou des rebords sur tous les côtés de la carte mais tronqués au niveau des coins, ou encore au contraire des rebords formés uniquement au niveau des quatre coins de la carte pour la caler dans son logement sous la couche de revêtement de la coque en métal. According to a preferred variant for the present invention, the coating layer 40 of metal may moreover be perforated to reveal decorative patterns, intended to be visible from the upper face of the card 102, which may thus be produced directly on the substrate. 1 and not directly on metal. According to another even more preferred variant, in order to give the card a more luxurious appearance, the metal coating layer may include a series of cavities or openings provided for the insertion of various decorative materials, such as inserts in precious metals or set stones (eg diamonds). Although only a few embodiments have been described by way of example in the foregoing, it will be understood that the latter are not intended to exhaustively expose all the possible variants of implementation for the present invention. Those skilled in the art will understand that it is conceivable to replace a means described by equivalent means without departing from the scope of the present invention. In particular, it would also be conceivable, without departing from the scope of the present invention, to use peripheral flanges extending only on two opposite faces of the card, in length or in width, or flanges on all sides of the card. the card but truncated at the corners, or on the contrary of the edges formed only at the level of the four corners of the card to wedge it in its housing under the coating layer of the metal shell.
Similairement, il serait envisageable d’utiliser un substrat dont la forme ne correspondrait que partiellement à celle du volume du logement défini à l’intérieur des rebords, prenant par exemple une forme carrée correspondant à une troncature de la forme rectangulaire disponible à l’intérieur d’un rebord périphérique intégré s’étendant sur le pourtour intégral de la carte. Similarly, it would be conceivable to use a substrate whose shape would only partially correspond to that of the volume of the housing defined inside the rims, for example taking a square shape corresponding to a truncation of the rectangular shape available inside. an integrated peripheral rim extending over the entire periphery of the card.
On pourrait sinon encore imaginer réaliser une fente dans la coque en métal, s’étendant du rebord périphérique intégré jusqu’au module de contact, afin de réaliser un blindage magnétique capacitif en lieu et place du blindage réalisée directement au-dessus de l’antenne dans le substrat. Alternatively, we could still imagine making a slot in the metal shell, extending from the integrated peripheral rim to the contact module, in order to produce a capacitive magnetic shielding instead of the shielding produced directly above the antenna. in the substrate.

Claims

Revendications Claims
1. Carte à puce (10) comprenant un substrat en plastique (1) dans lequel sont disposés au moins une antenne (3) et un blindage magnétique (6), caractérisée en ce qu’elle comprend une coque en métal (4) formée d’une couche de revêtement (40) pourvue d’un rebord périphérique intégré (44) définissant un logement (8) pour ledit substrat (1). 1. Smart card (10) comprising a plastic substrate (1) in which are arranged at least one antenna (3) and a magnetic shield (6), characterized in that it comprises a metal shell (4) formed a coating layer (40) provided with an integrated peripheral rim (44) defining a housing (8) for said substrate (1).
2. Carte à puce (10) selon la revendication 1, ledit rebord périphérique intégré (44) s’étendant sur l’intégralité du pourtour de ladite carte à puce (10), et ladite couche de revêtement étant disposée sur une surface supérieure (12) d’un substrat en plastique (1) et assemblée audit substrat en plastique (1) de telle sorte que la bordure latérale du substrat (13) jouxte une surface interne (44A) dudit rebord périphérique intégré (44) de ladite coque en métal (4). 2. Smart card (10) according to claim 1, said integrated peripheral rim (44) extending over the entire periphery of said smart card (10), and said coating layer being disposed on an upper surface ( 12) of a plastic substrate (1) and assembled to said plastic substrate (1) such that the side edge of the substrate (13) abuts an inner surface (44A) of said integrated peripheral rim (44) of said shell in metal (4).
3. Carte à puce (10) selon la revendication 2, ladite carte (10) étant une carte de paiement à interface double de dimensions conformes aux normes standard ou une carte RFID de dimensions prédéfinies, les dimensions en hauteur dudit substrat (1) étant amputées d’une épaisseur supérieure ou égale à une première épaisseur (E) correspondant à ladite couche de revêtement (40) de ladite coque en métal (4), et d’une deuxième épaisseur (R) correspondant à celle dudit rebord périphérique intégré (44). 3. Chip card (10) according to claim 2, said card (10) being a dual interface payment card of dimensions conforming to standard standards or an RFID card of predefined dimensions, the height dimensions of said substrate (1) being amputated by a thickness greater than or equal to a first thickness (E) corresponding to said coating layer (40) of said metal shell (4), and a second thickness (R) corresponding to that of said integrated peripheral rim ( 44).
4. Carte à puce (10) selon la revendication 3, ladite carte à puce (10) étant une carte de paiement à interface double comprenant un module à contact (2), ledit module à contact étant monté sur le substrat en plastique (1) de telle sorte qu’il présente une légère surépaisseur par rapport audit substrat (1) substantiellement égale à ladite première épaisseur (E) de manière à niveler la face supérieure (101) de ladite carte (10) au niveau d’un trou traversant (43) pratiqué dans ladite couche de revêtement (40) de ladite coque en métal (4) prévu pour l’insertion dudit module à contact (2). 4. Smart card (10) according to claim 3, said smart card (10) being a dual interface payment card comprising a contact module (2), said contact module being mounted on the plastic substrate (1). ) such that it has a slight extra thickness with respect to said substrate (1) substantially equal to said first thickness (E) so as to level the upper face (101) of said card (10) at the level of a through hole (43) formed in said coating layer (40) of said metal shell (4) provided for the insertion of said contact module (2).
5. Carte à puce (10) selon la revendication 3, ladite carte à puce (10) étant une carte de paiement à interface double comprenant un module à contact (2) monté sur ledit substrat en plastique (1), ledit module à contact (2) étant apposé sur un épaulement inférieur (43A) d’un trou traversant (43) pratiqué dans ladite couche de revêtement de ladite coque en métal (4) prévu pour l’insertion dudit module à contact (2) de manière à niveler la surface supérieure (101 ) de ladite carte à puce (10) au niveau dudit trou traversant (43). 5. Smart card (10) according to claim 3, said smart card (10) being a dual interface payment card comprising a contact (2) mounted on said plastic substrate (1), said contact module (2) being affixed to a lower shoulder (43A) of a through hole (43) made in said coating layer of said metal shell ( 4) provided for the insertion of said contact module (2) so as to level the upper surface (101) of said smart card (10) at the level of said through hole (43).
6. Carte à puce (10) selon l’une des revendications 2 à 5, caractérisée en ce que la surface inférieure (11) dudit substrat (1) affleure au niveau du talon (45) dudit bord périphérique intégré (44). 6. Smart card (10) according to one of claims 2 to 5, characterized in that the lower surface (11) of said substrate (1) is flush with the heel (45) of said integrated peripheral edge (44).
7. Carte à puce (10) selon la revendication 6, caractérisée en ce qu’elle comprend par ailleurs une feuille d’impression (5) s’étalant sur l’intégralité de la surface inférieure (11) dudit substrat (1). 7. Smart card (10) according to claim 6, characterized in that it further comprises a printing sheet (5) extending over the entire lower surface (11) of said substrate (1).
8. Coque en métal (4) pour une carte à puce (10) selon l’une des revendications 1 à 7 précédente, caractérisée en ce qu’elle est formée d’une couche de revêtement (40) pourvue d’un rebord périphérique intégré (44). 8. Metal shell (4) for a smart card (10) according to one of the preceding claims 1 to 7, characterized in that it is formed of a coating layer (40) provided with a peripheral edge integrated (44).
9. Coque en métal (4) pour carte à puce (10) selon la revendication9. Metal shell (4) for smart card (10) according to claim.
8, caractérisée en ce que ladite couche de revêtement (4) possède une première épaisseur (E) en hauteur comprise entre 150 et 500 micromètres, et ledit rebord périphérique intégré (44) possède une deuxième épaisseur (R) comprise entre 150 et 3000 micromètres. 8, characterized in that said coating layer (4) has a first thickness (E) in height of between 150 and 500 micrometers, and said integrated peripheral rim (44) has a second thickness (R) of between 150 and 3000 micrometers .
10. Coque en métal (4) pour carte à puce (10) selon l’une des revendications 8 ou 9, ladite carte (10) étant une carte de paiement à interface double, et un trou traversant (43) étant pratiqué dans ladite couche de revêtement (4) de ladite coque en métal (4) pour permettre l’insertion d’un module à contact (2). 10. Metal shell (4) for smart card (10) according to one of claims 8 or 9, said card (10) being a dual interface payment card, and a through hole (43) being made in said. coating layer (4) of said metal shell (4) to allow insertion of a contact module (2).
11. Coque en métal (4) selon la revendication 10, caractérisée en ce qu’un épaulement inférieur (43A) est prévu au bas dudit trou traversant (43). 11. Metal shell (4) according to claim 10, characterized in that a lower shoulder (43A) is provided at the bottom of said through hole (43).
12. Coque en métal (4) selon l’une des revendications 8 à 11 , caractérisée en ce qu’elle est ajourée. 12. Metal shell (4) according to one of claims 8 to 11, characterized in that it is perforated.
13. Coque en métal (4) selon l’une des revendications 8 à 12, caractérisée en ce qu’elle comporte une série de cavités ou d’ouvertures prévues pour l’insertion de divers matériaux décoratifs. 13. Metal shell (4) according to one of claims 8 to 12, characterized in that it comprises a series of cavities or openings provided for the insertion of various decorative materials.
PCT/EP2020/062890 2020-05-08 2020-05-08 Metal chip card and associated shell WO2021223884A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9390366B1 (en) * 2015-07-08 2016-07-12 Composecure, Llc Metal smart card with dual interface capability
US20190286961A1 (en) * 2016-07-27 2019-09-19 Composecure, Llc Rfid device
US20190354825A1 (en) * 2017-01-11 2019-11-21 Composecure, Llc Metal dual interface card

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9390366B1 (en) * 2015-07-08 2016-07-12 Composecure, Llc Metal smart card with dual interface capability
US20190286961A1 (en) * 2016-07-27 2019-09-19 Composecure, Llc Rfid device
US20190354825A1 (en) * 2017-01-11 2019-11-21 Composecure, Llc Metal dual interface card

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